Method of manufacturing cards that include an electronic module and intermediate products
Method of manufacturing at least one card each including an electronic module ( 2 ), this method providing a frame ( 14 ) or a plate ( 18 ) having at least one aperture ( 16 ) provided for receiving said electronic module. It is characterized in that at least one part of the peripheral area of said at least one aperture is deformed or crushed by localized application of pressure to said at least one part of the peripheral area on the frame or plate, so as to reduce locally the thickness of the frame or plate in said at least one part of the peripheral area, in that the electronic module is brought opposite the corresponding aperture so that at least one zone of the electronic module is superposed on said at least one part of the peripheral area, and in that a material connection is established between said at least one part of the peripheral area and said at least one corresponding zone of the electronic module for assembling said electronic module to the frame or plate before a resin is added at least on one side of the electronic module in a subsequent step of the method.
1. An assembly forming an intermediate product in a card manufacture method, comprising:
a plate comprising at least one through aperture extending through all of a thickness of the plate, and at least one projecting part located in a peripheral area of a corresponding through aperture of the at least one through aperture; and
an electronic module disposed in said at least one through aperture so that an open space on at least on one side of the plate remains in said at least one through aperture,
wherein the electronic module has at least two zones, each zone being deformably connected to the at least one projecting part,
wherein the at least one projecting part projects relative to a respective one of said at least two zones into the at least one through aperture,
wherein the at least two zones and the at least one projecting part of the plate form a material connection between the electronic module and the plate,
wherein the at least one projecting part defines at least one step having a smaller thickness than the thickness of the plate, and said each zone of the at least two zones covers a respective step of said at least one step, and
wherein the assembly is at least partially covered by a filling material or a resin so as to form with the filling material or resin a layer of cards.
2. The assembly according to claim 1 , further comprising:
a slot through the plate and disposed along an edge of the electronic module,
wherein said at least one through aperture in the plate has first dimensions and a first profile, and the electronic module has second dimensions and a second profile, which are such that said at least two zones are at least two distinct zones on the edge of the electronic module superposed on at least two corresponding parts of the peripheral area of a corresponding aperture, said each zone of the at least two zones and said each corresponding part of the at least two corresponding parts jointly positioning the electronic module relative to the plate.
3. The assembly according to claim 2 , wherein an adhesive film forming an adherent interface is disposed between said each zone of the at least two zones and said each corresponding part of the at least two corresponding parts.
4. The assembly according to claim 1 , wherein the thickness of the plate is approximately equal to a maximum height of the electronic module.
5. The assembly according to claim 1 , wherein the thickness of the plate is approximately equal to a maximum height of the electronic module so that the electronic module is inside the corresponding through aperture in the plate.
6. An intermediate product in a card manufacture method, comprising:
a plate having at least one through aperture extending through all of a thickness of the plate, and at least one projecting part located in a peripheral area of a corresponding through aperture of the at least one through aperture;
an electronic module disposed in said at least one through aperture so that an open space on at least on one side of the plate remains in said at least one through aperture; and
a filling material or resin, which fills a remaining space in said at least one through aperture,
wherein the electronic module has at least two zones, each zone being deformably connected to at least one projecting part,
wherein the at least one projecting part projects relative to a respective one of said at least two zones into the at least one through aperture,
wherein the at least two zones and the at least one projecting part of the plate form a material connection between the electronic module and the plate,
wherein the at least one projecting part defines at least one step having a smaller thickness than the thickness of the plate, wherein said each zone of the at least two zones covers a respective step of said at least one step, and
wherein the intermediate product forms an intermediate layer assembled between external layers.
7. The intermediate product according to claim 6 , further comprising:
a slot through the plate and disposed along an edge of the electronic module, the slot being filled by the filling material,
wherein said at least one through aperture in the plate has first dimensions and a first profile, and the electronic module has second dimensions and a second profile, which are such that said at least two zones are at least two distinct zones on the edge of the electronic module superposed on at least two corresponding parts of the peripheral area of a corresponding aperture, said each zone of the at least two zones and said each corresponding part of the at least two corresponding parts jointly positioning the electronic module relative to the plate.
8. The intermediate product according to claim 7 , wherein an adhesive film forming an adherent interface is disposed between said each zone of the at least two zones and said each corresponding part of the at least two corresponding parts.
9. The intermediate product according to claim 6 , wherein the thickness of the plate is approximately equal to a maximum height of the electronic module.
10. The intermediate product according to claim 6 , wherein the filling material comprises a resin that adheres securely to PVC materials, the resin further covering a bottom surface and a top surface of the plate.