IP Library › Patent Application 15001362
Patent Application
App. No. 15/001,362

WIRING BOARD

Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US None
App. No.
15/001,362
Abstract

A wiring board of the present invention includes a build-up layer having a plurality of insulating layers laminated one upon another, a groove formed on a major surface of each of the insulating layers, and a wiring conductor formed in the groove. A surface of the wiring conductor lies lower than the major surface of each of the insulating layers which is formed in the wiring conductor in the groove.

Claims (9)

1 . A wiring board comprising:

a build-up layer comprising a plurality of insulating layers laminated one upon another;

a groove formed on a major surface of each of the insulating layers; and

a wiring conductor formed in the groove,

wherein a surface of the wiring conductor lies lower than the major surface of each of the insulating layers which is formed in the wiring conductor in the groove.

2 . The wiring board according to claim 1 , wherein the build-up layer comprises the two insulating layers, and the major surface of each of the insulating layers has the groove formed in the wiring conductor.

3 . The wiring board according to claim 1 , further comprising a core substrate,

wherein the build-up layer is disposed on at least one surface of the core substrate.

4 . The wiring board according to claim 1 , wherein at least one of the insulating layers has a two-layer structure.

Assignments (2)
CHANGE OF NAME Recorded May 25, 2016
From: KYOCERA CIRCUIT SOLUTIONS, INC.
To: KYOCERA CORPORATION
Reel/Frame 038806/0631 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 20, 2016
From: YASUDA, MASAHARU
To: KYOCERA CIRCUIT SOLUTIONS, INC.
Reel/Frame 037531/0175 →