Imaging module and electronic apparatus

1. An imaging module comprising:

a lens unit that has a lens group; and

an imaging element unit that has an imaging element and is fixed to the lens unit,

wherein the lens unit includes

a focus drive unit that drives at least a part of a plurality of lenses of the lens group,

a first image blur-correction drive unit that drives at least a part of the plurality of lenses of the lens group in a first direction present in a plane perpendicular to a direction of an optical axis of the lens group,

a second image blur-correction drive unit that drives at least a part of the plurality of lenses of the lens group in a second direction crossing the first direction present in the plane perpendicular to the direction of the optical axis of the lens group,

a housing that houses the focus drive unit and the first and second image blur-correction drive units therein,

a first connecting portion that is electrically connected to the imaging element unit,

a first wiring portion that electrically connects the focus drive unit and the first and second image blur-correction drive units to the first connecting portion,

a plurality of second connecting portions that are disposed outside the housing,

a second wiring portion that is electrically connected to the plurality of second connecting portions and is electrically connected to the focus drive unit and the first and second image blur-correction drive units to which the first wiring portion is connected, and

a wiring board that includes at least a part of the second wiring portion, and the plurality of second connecting portions,

wherein the wiring board includes a flexible printed circuit and a terminal pattern region on which the second connecting portions are formed, and

the terminal pattern region is fixed to an outer surface of the housing.

2. The imaging module according to claim 1 ,

wherein the first wiring portion further includes wires that electrically connect sensors for detecting the displacement of the lenses to the first connecting portion, and

the second wiring portion includes wires that are electrically connected to the sensors to which the first connecting portion is connected.

3. The imaging module according to claim 1 ,

wherein the wiring board has a region that is disposed outside the housing.

4. The imaging module according to claim 2 ,

wherein the wiring board has a region that is disposed outside the housing.

5. The imaging module according to claim 1 ,

wherein the second connecting portions are coated with an insulating material.

6. The imaging module according to claim 2 ,

wherein the second connecting portions are coated with an insulating material.

7. The imaging module according to claim 3 ,

wherein the second connecting portions are coated with an insulating material.

8. The imaging module according to claim 1 , further comprising:

a cover member that covers the outside of the second connecting portions.

9. The imaging module according to claim 2 , further comprising:

a cover member that covers the outside of the second connecting portions.

10. The imaging module according to claim 3 , further comprising:

a cover member that covers the outside of the second connecting portions.

11. The imaging module according to claim 1 ,

wherein the terminal pattern region is fixed to a plurality of outer surfaces of the housing.

12. The imaging module according to claim 1 ,

wherein the terminal pattern region is attached to an outer surface of the housing.

13. The imaging module according to claim 1 , further comprising:

a reinforcing member that is disposed on a back side of an exposed surface of the wiring board, to which the second connecting portions are exposed, so as to be integrated with the wiring board.

14. The imaging module according to claim 1 ,

wherein a thickness of a wall of the housing, which has the outer surface to which the second connecting portions are fixed, is thicker than a thickness of a wall of the housing that has an outer surface to which the second connecting portions are not fixed.

15. The imaging module according to claim 1 ,

wherein the wiring board includes at least a part of the first wiring portion, and

the second wiring portion is used as at least a part of the first wiring portion.

16. The imaging module according to claim 1 ,

wherein the wiring board includes at least a part of the first wiring portion, and

the second wiring portion includes a portion branched from the first wiring portion.

17. The imaging module according to claim 1 ,

wherein the plurality of second connecting portions are disposed on a side surface of the housing so as to be arranged in multiple rows in a direction of a long side of the side surface.

18. The imaging module according to claim 17 ,

wherein when A denotes a length of a long side of the surface on which the plurality of second connecting portions are disposed, B denotes a length of a short side of the surface on which the plurality of second connecting portions are disposed, C denotes a length of one side of a rectangular region in which one of the second connecting portions is disposed, D denotes a length of a side, which is connected to the side of C, of the rectangular region in which one of the second connecting portions is disposed, N denotes the number of the plurality of second connecting portions, and M denotes the number of the rows of the plurality of second connecting portions, the second connecting portions are disposed so that C/D is in the range of 0.4 to 2.8 in a case in which “C=A/(N/M)” and “D=B/M” are satisfied.

19. The imaging module according to claim 1 ,

wherein a pixel pitch of the imaging element is 1 μm or less.

20. An electronic apparatus including the imaging module according to claim 1 .