Package of flexible environmental sensitive electronic device and sealing member

1. A flexible environmental sensitive electronic device package, comprising:

a flexible electronic device;

a thin film encapsulation, covering the flexible electronic device; and

a sealing member, covering the flexible electronic device and the thin film encapsulation, wherein the sealing member includes a first portion and a second portion, the first portion covers the flexible electronic device and the thin film encapsulation, the second portion covers the first portion, Young's modulus of the second portion is between 0 MPa and 100 MPa, Young's modulus of the first portion is greater than that of the second portion, a thickness of the first portion is less than that of the second portion, and the first portion includes a plurality of separated patterns or a continuous pattern with a hollow region to partially cover the thin film encapsulation.

2. The flexible environmental sensitive electronic device package according to claim 1 , wherein the flexible electronic device includes:

a flexible substrate;

an environmental sensitive electronic device disposed on the flexible substrate; and

a first barrier layer disposed on the flexible substrate, wherein a portion of the first barrier layer is distributed between the environmental sensitive electronic device and the flexible substrate.

3. The flexible environmental sensitive electronic device package according to claim 2 , wherein the thin film encapsulation includes a plurality of inorganic films and the plurality of inorganic films cover the environmental sensitive electronic device.

4. The flexible environmental sensitive electronic device package according to claim 3 , wherein an outmost layer of the thin film encapsulation is a silicon nitride film and the thin film encapsulation contacts the first portion of the sealing member directly.

5. The flexible environmental sensitive electronic device package according to claim 1 , wherein the first portion of the sealing member includes a thermal curing adhesive and the second portion of the sealing member includes a pressure sensitive adhesive.

6. The flexible environmental sensitive electronic device package according to claim 1 , wherein the first portion of the sealing portion includes a thermal curing adhesive and the second portion of the sealing member includes a fluid.

7. The flexible environmental sensitive electronic device package according to claim 1 , wherein the sealing member further includes a side wall barrier structure disposed on the first portion.

8. The flexible environmental sensitive electronic device package according to claim 1 , wherein the thickness of the first portion is between 1 μm and 10 μm and the thickness of the second portion is between 5 μm and 25 μm.

9. The flexible environmental sensitive electronic device package according to claim 1 , wherein the first portion entirely covers the thin film encapsulation.

10. The flexible environmental sensitive electronic device package according to claim 1 , further including:

a barrier layer disposed between the flexible electronic device and the thin film encapsulation.

11. The flexible environmental sensitive electronic device package according to claim 1 , further including:

a flexible cover, covering the sealing member, wherein the sealing member is disposed between the flexible electronic device and the flexible cover; and

a second barrier layer, disposed between the flexible cover and the sealing.

12. The flexible environmental sensitive electronic device package according to claim 1 , wherein Young's modulus of the first portion is between 50 MPa and 3000 MPa.

13. A sealing member, adapted to cover a flexible electronic device, the sealing member comprising:

a first portion and a second portion, wherein the first portion covers the flexible electronic device, the second portion covers the first portion, Young's modulus of the second portion is between 0 MPa and 100 MPa, Young's modulus of the first portion is greater than that of the second portion, a thickness of the first portion is less than that of the second portion, and the first portion includes a plurality of separated patterns or a continuous pattern with a hollow region.

14. The sealing member according to claim 13 , wherein the first portion of the sealing portion includes a thermal curing adhesive and the second portion of the sealing member includes a pressure sensitive adhesive.

15. The sealing member according to claim 13 , wherein the first portion of the sealing portion includes a thermal curing adhesive and the second portion of the sealing member includes a fluid.

16. The sealing member according to claim 13 , wherein the thickness of the first portion is between 1 μm and 10 μm and the thickness of the second portion is between 5 μm and 25 μm.

17. The sealing member according to claim 13 , further including a side wall barrier structure surrounding the second portion.

18. The sealing member according to claim 13 , wherein Young's modulus of the first portion is between 50 MPa and 3000 MPa.

19. A flexible environmental sensitive electronic device package, comprising:

a flexible electronic device, comprising:

a flexible substrate; and

an environmental sensitive electronic device disposed on the flexible substrate;

a thin film encapsulation, covering the flexible electronic device, wherein the thin film encapsulation comprises a plurality of inorganic films and the plurality of inorganic films cover the environmental sensitive electronic device; and

a sealing member, covering the flexible electronic device and the thin film encapsulation, wherein the sealing member includes a first portion and a second portion, the first portion covers the flexible electronic device and the thin film encapsulation, the second portion covers the first portion, Young's modulus of the second portion is between 0 MPa and 100 MPa, Young's modulus of the first portion is greater than that of the second portion, and a thickness of the first portion is less than that of the second portion.