IP Library Granted Patent US 9,935,289
Granted Patent B2
US 9,935,289 · App. 15/003,805 · Granted Apr 3, 2018

Environmental sensitive element package and encapsulation method thereof

Inventors: Kuang-Jung Chen (Hsinchu County, TW); Shu-Tang Yeh (Taichung, TW); Yung-Sheng Wang (Taichung, TW)
Assignee: Industrial Technology Research Institute Institute
H01L51/5253B32B3/30B32B7/12B32B15/08B32B15/18B32B17/06B32B27/06B32B27/281B32B27/286B32B27/308B32B27/36B32B27/365H01L51/525H01L51/5246H01L51/5259B32B2255/10B32B2255/20B32B2255/26B32B2307/546B32B2307/724B32B2307/726B32B2307/7244B32B2307/7246B32B2439/62B32B2457/20B32B2553/00H01L2251/55Y10T428/239
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Quick Facts
Patent No.
US 9,935,289
App. No.
15/003,805
Granted
Apr 3, 2018
Kind
B2
Abstract

A package of environmental sensitive element including a first substrate, a second substrate, a barrier structure between the first substrate and the second substrate, an environmental sensitive element and an adhesive is provided. The second substrate is disposed above the first substrate. The environmental sensitive element is disposed on the first substrate and located between the first substrate and the second substrate. The barrier structure is distributed outside the environmental sensitive element. The adhesive is disposed between the first substrate and the second substrate and encapsulates the environmental sensitive element and the barrier structure, wherein an outgassing of the adhesive under 120 degrees Celsius is less than or equal to 5×10 −7 gram/cm 2 .

Claims (34)

1. An environmental sensitive element package, comprising:

a first substrate;

a second substrate disposed above the first substrate;

a barrier structure between the first substrate and the second substrate;

an environmental sensitive element disposed on the first substrate and between the first substrate and the second substrate, wherein the barrier structure is distributed outside the environmental sensitive element;

a flexible buffer layer disposed on the environmental sensitive element and made of small molecular compounds, oligomers, or organic-inorganic co-steaming materials; and

an adhesive disposed between the first substrate and the second substrate and encapsulating the environmental sensitive element, the barrier structure, and the flexible buffer layer, wherein an outgassing of the adhesive under 120 degrees Celsius is less than or equal to 5×10 −7 gram/cm 2 , wherein an outgassing of the flexible buffer layer under 120 degrees Celsius is less than the outgassing of the adhesive under 120 degrees Celsius, and the outgassing of the flexible buffer layer under 120 degrees Celsius is less than 5×10 −8 gram/cm 2 .

2. The environmental sensitive element package as claimed in claim 1 , wherein the barrier structure and the second substrate are integrally formed and substantially made of a same material, the barrier structure and the second substrate are made of stainless steel, glass, or plastic.

3. The environmental sensitive element package as claimed in claim 1 , wherein the barrier structure is disposed on the second substrate and protrudes from the second substrate toward the first substrate.

4. The environmental sensitive element package as claimed in claim 1 , further comprising:

a flexible passivation layer covering the flexible buffer layer, wherein the flexible buffer layer is located between the environmental sensitive element and the flexible passivation layer.

5. The environmental sensitive element package as claimed in claim 1 , further comprising:

a plurality of passivation films covering the flexible buffer layer.

6. The environmental sensitive element package as claimed in claim 1 , further comprising:

a flexible passivation layer covering the flexible buffer layer; and

a plurality of passivation films covering the flexible passivation layer, wherein the flexible passivation layer is between the flexible buffer layer and the plurality of passivation films.

7. The environmental sensitive element package as claimed in claim 1 , wherein the outgassing of the adhesive under 120 degrees Celsius ranges from 5×10 −8 gram/cm 2 to 5×10 −7 gram/cm 2 .

8. An environmental sensitive element package, comprising:

a first substrate;

a second substrate disposed above the first substrate;

a barrier structure between the first substrate and the second substrate;

an environmental sensitive element disposed on the first substrate and between the first substrate and the second substrate, wherein the barrier structure is distributed outside the environmental sensitive element;

a flexible buffer layer disposed on the environmental sensitive element and made of small molecular compounds, oligomers, or organic-inorganic co-steaming materials; and

an adhesive disposed between the first substrate and the second substrate and encapsulating the environmental sensitive element, the barrier structure, and the flexible buffer layer, wherein an outgassing of the adhesive under 120 degrees Celsius is less than or equal to 5×10 −7 gram/cm 2 , wherein an outgassing of the flexible buffer layer under 120 degrees Celsius is less than the outgassing of the adhesive under 120 degrees Celsius, and the outgassing of the flexible buffer layer under 120 degrees Celsius is less than 5×10 −8 gram/cm 2 , wherein the outgassing of the adhesive increases gradually from a first side of the adhesive near the environmental sensitive element to a second side of the adhesive opposite to the first side of the adhesive.

9. The environmental sensitive element package as claimed in claim 8 , wherein the barrier structure and the second substrate are integrally formed and substantially made of a same material, the barrier structure and the second substrate are made of stainless steel, glass, or plastic.

10. The environmental sensitive element package as claimed in claim 8 , wherein the barrier structure is disposed on the second substrate and protrudes from the second substrate toward the first substrate.

11. The environmental sensitive element package as claimed in claim 8 , further comprising:

a flexible passivation layer covering the flexible buffer layer, wherein the flexible buffer layer is located between the environmental sensitive element and the flexible passivation layer.

12. The environmental sensitive element package as claimed in claim 8 , further comprising:

a plurality of passivation films covering the flexible buffer layer.

13. The environmental sensitive element package as claimed in claim 8 , further comprising:

a flexible passivation layer covering the flexible buffer layer; and

a plurality of passivation films covering the flexible passivation layer, wherein the flexible passivation layer is between the flexible buffer layer and the plurality of passivation films.

14. The environmental sensitive element package as claimed in claim 8 , wherein the outgassing of the adhesive under 120 degrees Celsius ranges from 5×10 −8 gram/cm 2 to 5×10 −7 gram/cm 2 .

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 15, 2022
From: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
To: HANNSTAR DISPLAY CORPORATION
Reel/Frame 059365/0305 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 26, 2016
From: CHEN, KUANG-JUNG; YEH, SHU-TANG; WANG, YUNG-SHENG
To: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Reel/Frame 037590/0478 →
Priority Claims (1)
TW 99130696 A · Sep 10, 2010 · national
Continuity (3)
Continuation In Part 12915018 · Oct 29, 2010
Provisional Application 62106234 · Jan 22, 2015
Related Publication 20160204379A1 · Jul 14, 2016