IP Library Granted Patent US 10,364,079
Granted Patent B2
US 10,364,079 · App. 15/004,187 · Granted Jul 30, 2019

Integral hot melt adhesive packaging films and use thereof

Inventors: Jinyu Chen (Fanwood, NJ); Yuhong Hu (Belle Mead, NJ); Darshak Desai (Edison, NJ)
Assignee: HENKEL IP & HOLDING GMBH
B65D65/38B32B1/02B32B27/08B32B27/20B32B27/32B32B27/327B65B1/04B65B63/08C08J5/18C08L23/0807C08L23/0815C08L23/12C09J123/14B32B2270/00B32B2553/00B65B9/20B65B2220/24C08J2323/08C08J2323/12C08J2423/08C08J2423/12C08L2203/16C08L2203/162C08L2205/02C08L2314/06Y10T428/1345Y10T428/1352Y10T428/1397
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Quick Facts
Patent No.
US 10,364,079
App. No.
15/004,187
Granted
Jul 30, 2019
Kind
B2
Abstract

Propylene polymer based packaging films for encapsulating hot melt adhesives are disclosed. The packaging films are readily miscible with the various hot melt adhesive chemistries during the melting stage without deleteriously affecting the adhesive properties, making the packaging film particularly well suited for packaging hot melt adhesives in a pillow, cylinder, pouch, block, cartridge and like forms.

Claims (10)

1. A method of forming a cylindrical integral hot melt adhesive package comprising the steps of:

1. preparing packaging film as an encapsulating vessel;

2. pumping or pouring the hot melt adhesive in a molten state into the packaging film, wherein the packaging film is in direct contact with a heat sink;

3. sealing the packaging film; and

4. cooling the sealed package; and

wherein the packaging film comprises a polymer blend comprising at least 70 wt % of propylene and up to 15 wt % of ethylene content; and the packaging film has (a) a viscosity range of about 200,000 to 3,000,000 cps at 200° C. with a rheometer with near-zero shear; (b) a peak melting temperature range of about 90 to 140° C.; (c) a Tm offset temperature below 149° C.; and (d) a storage modulus (G′) range of about 1×10 6 to about 1×10 8 Pascal at 100° C. with frequency at 10 rad/s;

wherein the hot melt adhesive selected is from the group consisting of poly-alpha-olefins, rubbers, styrenic block-copolymers, ethylene-vinyl acetates, ethylene-butyl acetates, and mixtures thereof; and

wherein the cooled sealed package is non-tacky.

2. The method of forming an integral hot melt adhesive package of claim 1 wherein pumping or pouring the hot melt adhesive in a molten state is conducted at temperatures of about 150° C. or below.

3. The method of forming an integral hot melt adhesive package of claim 1 wherein the heat sink is water.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 9, 2022
From: HENKEL IP & HOLDING GMBH
To: HENKEL AG & CO. KGAA
Reel/Frame 059357/0267 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 13, 2016
From: CHEN, JINYU; HU, YUHONG; DESAI, DARSHAK
To: HENKEL CORPORATION
Reel/Frame 039147/0310 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 13, 2016
From: HENKEL CORPORATION
To: HENKEL US IP LLC
Reel/Frame 039325/0910 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 13, 2016
From: HENKEL US IP LLC
To: HENKEL IP & HOLDING GMBH
Reel/Frame 039326/0094 →
Continuity (3)
Division 13800445 · Mar 13, 2013
Provisional Application 61648290 · May 17, 2012
Related Publication 20160137371A1 · May 19, 2016