Solder-creep management in high-power laser devices

1. A laser apparatus comprising:

a beam emitter having first and second opposed surfaces;

a first electrode mount disposed beneath and in thermal contact with the first surface of the beam emitter, wherein the first electrode mount (i) is composed of a metallic material having an electrical conductivity at 20° C. of at least 1×10 6 S/m and (ii) is electrically connected to an electrode of the beam emitter;

a thermally conductive housing body disposed beneath the first electrode mount, wherein the housing body comprises an insulating layer to prevent electrical conduction between the housing body and the first electrode mount;

a thermal bonding layer disposed between the first electrode mount and the insulating layer of the housing body, the thermal bonding layer (i) improving thermal conduction between the first electrode mount and the housing body, and (ii) comprising a thermal bonding material, wherein the thermal bonding material comprises a metallic solder, paste, or gel; and

a creep-mitigation system for preventing or retarding movement of the thermal bonding material out of the thermal bonding layer, the creep-mitigation system comprising a plurality of thermally conductive particles interspersed within the thermal bonding layer.

2. The laser apparatus of claim 1 , wherein the thermal bonding material comprises indium.

3. The laser apparatus of claim 1 , wherein the creep-mitigation system comprises a mesh support structure defining a plurality of openings therein, at least a portion of the thermal bonding material being disposed in the openings.

4. The laser apparatus of claim 1 , wherein the plurality of thermally conductive particles interspersed within the thermal bonding layer are electrically insulating.

5. The laser apparatus of claim 1 , wherein the creep-mitigation system comprises a plurality of recessed channels defined by at least one of the first electrode mount or the housing body, at least some of the thermal bonding material being disposed within the channels.

6. The laser apparatus of claim 5 , wherein each of the channels is filled with the thermal bonding material.

7. The laser apparatus of claim 1 , wherein the creep-mitigation system comprises a plurality of posts defined by at least one of the first electrode mount or the housing body and protruding therefrom, each of the posts spanning at least a portion of a distance between the first electrode mount and the housing body.

8. The laser apparatus of claim 1 , wherein the creep-mitigation system comprises one or more stops disposed around at least a portion of a perimeter of the thermal bonding layer.

9. The laser apparatus of claim 1 , wherein the creep-mitigation system comprises an adhesive layer disposed around at least a portion of a perimeter of the thermal bonding layer, wherein (a) the adhesive layer is disposed in contact with the first electrode mount, housing body, and thermal bonding material, and (b) the adhesive layer is not disposed between the first electrode mount and the housing body.

10. The laser apparatus of claim 9 , wherein (i) the adhesive layer comprises a thermally conductive adhesive, and (ii) the creep-mitigation system further comprises a plurality of posts spanning at least a portion of a distance between the first electrode mount and the housing body, each of the posts being composed of the thermally conductive adhesive.

11. The laser apparatus of claim 1 , further comprising a second electrode mount (i) disposed over and in thermal contact with the second surface of the beam emitter and (ii) electrically insulated from the first electrode mount except for any electrical connection through the beam emitter.

12. The laser apparatus of claim 1 , wherein the beam emitter comprises a diode bar emitting a plurality of discrete beams.

13. A laser apparatus comprising:

a beam emitter having first and second opposed surfaces;

a first electrode mount disposed beneath the first surface of the beam emitter;

a thermal bonding layer disposed between the first electrode mount and the first surface of the beam emitter, the thermal bonding layer (i) improving thermal conduction between the first electrode mount and the beam emitter, and (ii) comprising a thermal bonding material; and

a creep-mitigation system for preventing or retarding movement of the thermal bonding material out of the thermal bonding layer,

wherein the creep-mitigation system comprises (A) a plurality of posts spanning an entire distance between the beam emitter and the first electrode mount to thereby take up clamping force therebetween, and (B) an adhesive layer (i) disposed around at least a portion of a perimeter of the thermal bonding layer, and (ii) comprising an adhesive material, wherein (a) the adhesive layer is disposed in contact with the first electrode mount, beam emitter, and thermal bonding material, and (b) the adhesive layer is not disposed between the first electrode mount and the beam emitter.

14. The laser apparatus of claim 13 , wherein the adhesive layer comprises a thermally conductive adhesive material.

15. The laser apparatus of claim 13 , further comprising:

a second electrode mount (i) disposed over and in thermal contact with the second surface of the beam emitter and (ii) electrically insulated from the first electrode mount except for any electrical connection through the beam emitter;

a second thermal bonding layer disposed between the second electrode mount and the second surface of the beam emitter, the second thermal bonding layer (i) improving thermal conduction between the second electrode mount and the beam emitter, and (ii) comprising a second thermal bonding material; and

an adhesive layer disposed around at least a portion of a perimeter of the second thermal bonding layer.

16. The laser apparatus of claim 13 , wherein the beam emitter comprises a diode bar emitting a plurality of discrete beams.

17. A laser apparatus comprising:

a beam emitter having first and second opposed surfaces;

a first electrode mount disposed beneath the first surface of the beam emitter, wherein (i) the beam emitter only partially overlaps the first electrode mount to thereby define a region of overlap between the beam emitter and the first electrode mount, and (ii) at least one of the beam emitter or the first electrode mount defines a plurality of recessed channels therein;

a thermal bonding layer disposed between the first electrode mount and the first surface of the beam emitter in the region of overlap, the thermal bonding layer (i) improving thermal conduction between the first electrode mount and the beam emitter, and (ii) comprising a thermal bonding material; and

an adhesive layer surrounding the entire region of overlap and being disposed within the plurality of channels to thereby define (i) a plurality of isolated pockets of the thermal bonding material each surrounded on all sides by adhesive material, and (ii) a portion of the adhesive layer disposed in contact with the first electrode mount, the beam emitter, and the thermal bonding material but not disposed between the first electrode mount and the beam emitter.

18. A wavelength beam combining laser system comprising:

a beam emitter emitting a plurality of discrete beams and having first and second opposed surfaces;

focusing optics for focusing the plurality of beams onto a dispersive element;

a dispersive element for receiving and dispersing the received focused beams;

a partially reflective output coupler positioned to receive the dispersed beams, transmit a portion of the dispersed beams therethrough as a multi-wavelength output beam, and reflect a second portion of the dispersed beams back toward the dispersive element;

a first electrode mount disposed beneath and in thermal contact with the first surface of the beam emitter, wherein the first electrode mount (i) is composed of a metallic material having an electrical conductivity at 20° C. of at least 1×10 6 S/m and (ii) is electrically connected to an electrode of the beam emitter;

a thermally conductive housing body disposed beneath the first electrode mount, wherein the housing body comprises an insulating layer to prevent electrical conduction between the housing body and the first electrode mount;

a thermal bonding layer disposed between the first electrode mount and the insulating layer of the housing body, the thermal bonding layer (i) improving thermal conduction between the first electrode mount and the housing body, and (ii) comprising a thermal bonding material, wherein the thermal bonding material comprises a metallic solder, paste, or gel; and

a creep-mitigation system for preventing or retarding movement of the thermal bonding material out of the thermal bonding layer, the creep-mitigation system comprising a plurality of thermally conductive particles interspersed within the thermal bonding layer.

19. The laser system of claim 18 , wherein the dispersive element comprises a diffraction grating.

20. The laser system of claim 18 , wherein the creep-mitigation system comprises a mesh support structure defining a plurality of openings therein, at least a portion of the thermal bonding material being disposed in the openings.

21. The laser system of claim 18 , wherein the plurality of thermally conductive particles interspersed within the thermal bonding layer are electrically insulating.

22. The laser system of claim 18 , wherein the creep-mitigation system comprises a plurality of recessed channels defined by at least one of the first electrode mount or the housing body, at least some of the thermal bonding material being disposed within the channels.

23. The laser system of claim 18 , wherein the creep-mitigation system comprises a plurality of posts defined by at least one of the first electrode mount or the housing body and protruding therefrom, each of the posts spanning at least a portion of a distance between the first electrode mount and the housing body.

24. The laser apparatus of claim 18 , wherein the creep-mitigation system comprises one or more stops disposed around at least a portion of a perimeter of the thermal bonding layer.

25. The laser apparatus of claim 18 , wherein the creep-mitigation system comprises an adhesive layer disposed around at least a portion of a perimeter of the thermal bonding layer, wherein (a) the adhesive layer is disposed in contact with the first electrode mount, housing body, and thermal bonding material, and (b) the adhesive layer is not disposed between the first electrode mount and the housing body.

26. The laser system of claim 22 , wherein each of the channels is filled with the thermal bonding material.