Environmental sensor test methodology

1. A method for testing a batch of environmental sensors to determine the fitness for purpose of the batch of environmental sensors, the method comprising:

determining environmental parametric ranges by performing a plurality of environmental tests on at least one environmental sensor under a specified environmental condition;

performing a plurality of electrical test sequences to the sensor inputs of the at least one environmental sensor to measure electrical responses of the sensor outputs of the at least one environmental sensor;

correlating the measured electrical responses from the at least one environmental sensor to predetermined environmental parametric ranges of the at least one environmental sensor so as to define correlated electrical test limits;

testing the batch of environmental sensors by exclusively applying electrical impulses to each sensor of the batch of environmental sensors and by exclusively measuring electrical responses of the batch of environmental sensors; and

determining the fitness for purpose of the batch of environmental sensors if the measured electrical responses of the batch of environmental sensors are within the correlated electrical test limits.

2. A method according to claim 1 , wherein the step of performing the plurality of electrical test sequences is performed by an automated test equipment and the electrical responses are measured by the automated test equipment.

3. A method according to claim 1 , wherein the electrical responses provide calibration values that are stored within the environmental sensors.

4. A method according to claim 1 , wherein the environmental sensors comprise gas sensors.

5. A method according to claim 4 , wherein each gas sensor comprises:

a dielectric membrane formed on a semiconductor substrate comprising an etched portion;

a heater formed in the dielectric membrane;

gas sensing electrodes formed on the dielectric membrane; and a gas sensitive layer formed on the gas sensing electrodes.

6. A method according to claim 5 , wherein electrical impulses are applied to the heater of each gas sensor and the electrical response is measured across the gas sensing electrodes of each gas sensor.

7. A method according to claim 4 , wherein the predetermined parametric ranges are determined by running a test in the presence of a gas.

8. A method according to claim 7 , wherein the predetermined parametric ranges are determined from the sensor resistance variation in air and the sensor resistance variation in the gas to define said correlated electrical test limits.

9. A method according to claim 8 , wherein the measured electrical responses from the batch of gas sensors are compared with said correlated electrical test limits.

10. A method according to claim 9 , wherein the fitness for purpose of the gas sensors is determined when the measured electrical responses from the batch of gas sensors are within said correlated electrical test limits.

11. A method according to claim 4 , wherein the gas sensors are metal oxide gas sensors.

12. A method according to claim 1 , wherein the environmental sensors comprise humidity sensors.

13. A method according to claim 1 , wherein the environmental sensors comprise pressure sensors.

14. A method according to claim 1 wherein the batch of sensors are tested in wafer form or any other form prior to packaging.

15. A method according to claim 1 wherein the batch of sensors are tested in wafer level package format.

16. A method according to claim 1 wherein the batch of sensors are tested in a package strip format.

17. A method according to claim 16 wherein the package strip is supported face down on a dicing tape which is further supported by a film frame.

18. A method according to claim 16 , wherein the package strip comprises a plurality of environmental sensors which are electrically isolated from one another.

19. A method according to claim 16 , wherein the plurality of environmental sensors are electrically isolated by using a conductor etching process such as an etch back process.

20. A method according to claim 16 , wherein the plurality of environmental sensors are electrically isolated by using of a sawing process.

21. A method according to claim 20 , wherein the sawing process only cuts through the metal conductors between environmental sensors and keeps the integrity of the strip intact.

22. A method according to claim 20 , wherein the sawing process cuts through the full package structure including the metal conductors between sensors to leave an array of separate sensors.

23. An environmental sensor test system to determine the fitness for purpose of a batch of environmental sensors, the test system comprising:

said batch of environmental sensors;

an automated test equipment to perform a plurality of electrical test sequences to sensor inputs of at least one environmental sensor and to measure electrical responses of sensor outputs of the at least one environmental sensor;

an environmental test equipment which is configured to determine environmental parametric ranges by performing a plurality of tests on the at least one environmental sensor under a specified environmental condition;

a data analysis tool to correlate the measured electrical responses from the at least one environmental sensor to predetermined environmental parametric ranges of the at least one environmental sensor so as to define correlated electrical test limits; and

wherein the testing of the environmental sensors to determine the fitness for purpose is performed by exclusively applying electrical impulses to each sensor of the batch of environmental sensors and by exclusively measuring electrical responses of the batch of environmental sensors; and

wherein the data analysis tool is configured to determine the fitness for purpose of the batch of environmental sensors if the measured electrical responses are within the correlated electrical test limits.

24. A test system according to claim 23 , wherein the environmental sensors comprise gas sensors.

25. A test system according to claim 24 , wherein each gas sensor comprises:

a dielectric membrane formed on a semiconductor substrate comprising an etched portion;

a heater formed in the dielectric membrane;

gas sensing electrodes formed on the dielectric membrane; and

a gas sensitive layer formed on the gas sensing electrodes.

26. A test system according to claim 25 , wherein said automated test equipment is configured to apply electrical impulses to the heater of each gas sensor and to measure the electrical response across the gas sensing electrodes of each gas sensor.

27. A test system according to claim 25 , further comprising a gas testing equipment which is configured to determine predetermined parametric ranges by running a test in the presence of a gas.

28. A test system according to claim 27 , wherein the gas testing equipment is configured to determine the predetermined parametric ranges from the sensor resistance variation in air and the sensor resistance variation in the gas to define said correlated electrical test limits.

29. A test system according to claim 24 , wherein the gas sensors are metal oxide gas sensors.

30. A test system according to claim 23 , wherein the environmental sensors comprise humidity sensors.

31. A test system according to claim 23 , wherein the environmental sensors comprise pressure sensors.

32. A test system according to claim 23 wherein the batch of sensors are in wafer form or any other form prior to packaging.

33. A test system according to claim 23 wherein the batch of sensors are packaged in wafer level package format.

34. A test system according to claim 23 , wherein the batch of sensors are packaged in a package strip format.

35. A test system according to claim 34 , further comprising a film frame and a dicing tape which is supported by the film frame, wherein the package strip is supported face down on the dicing tape.

36. A test system according to claim 35 , wherein the package strip comprises a plurality of environmental sensors which are electrically isolated from one another.

37. A test system according to claim 36 , wherein the plurality of environmental sensors are electrically isolated by using a conductor etching technique such as an etching back technique.

38. A test system according to claim 36 , wherein the plurality of environmental sensors are electrically isolated by using of a sawing technique.

39. A test system according to claim 38 , wherein the environmental sensors are configured such that the sawing technique only cuts through the metal conductors between the environmental sensors and keeps the integrity of the strip intact.

40. A test system according to claim 38 , wherein the environmental sensors are configured such that the sawing technique cuts through the full package structure including the metal conductors between sensors to leave an array of separate sensors.