Polishing agent, polishing method, and liquid additive for polishing

1. A polishing agent comprising:

cerium oxide particles;

a water-soluble organic polymer having at least one selected from a carboxylic acid group and a salt of carboxylic acid;

a water-soluble polyamide having at least one selected from a tertiary amino group and an oxyalkylene chain in a molecule thereof; and

water,

wherein the polishing agent has a pH of 7 or less.

2. The polishing agent according to claim 1 , wherein the water-soluble polyamide has the tertiary amino group in at least one selected from a main chain and a side chain thereof.

3. The polishing agent according to claim 1 , wherein the water-soluble polyamide has the oxyalkylene chain in the main chain thereof.

4. The polishing agent according to claim 1 , wherein the water-soluble polyamide is a copolymer obtained from at least one selected from aminoethyl piperazine and a modified polyalkylene glycol, and a lactam.

5. The polishing agent according to claim 1 , wherein the water-soluble organic polymer contains at least one selected from polyacrylic acid and ammonium polyacrylate.

6. The polishing agent according to claim 1 , wherein the water-soluble organic polymer has a weight average molecular weight of from 1,000 to 50,000.

7. The polishing agent according to claim 1 , wherein the water-soluble polyamide is contained in an amount of from 0.00005 to 0.01 mass % based on a total amount of the polishing agent.

8. The polishing agent according to claim 1 , wherein the water-soluble organic polymer is contained in an amount of from 0.01 to 0.5 mass % based on the total amount of the polishing agent.

9. The polishing agent according to claim 1 , having the pH of from 4 to 6.5.

10. The polishing agent according to claim 1 , wherein the cerium oxide particles have an average secondary particle size of from 0.01 to 0.5 μm.

11. The polishing agent according to claim 1 , wherein the cerium oxide particles are contained in an amount of from 0.05 to 2 mass % based on the total amount of the polishing agent.

12. A polishing method comprising: bringing a polishing pad into contact with a surface to be polished while supplying a polishing agent to perform polishing by relative movement therebetween,

wherein the surface to be polished including a surface comprising silicon oxide of a semiconductor substrate is polished using the polishing agent according to claim 1 as the polishing agent.

13. A liquid additive for polishing, which is a liquid additive for preparing a polishing agent by mixing with a dispersion of cerium oxide particles, the liquid additive comprising:

a water-soluble organic polymer having at least one selected from a carboxylic acid group and a salt of carboxylic acid;

a water-soluble polyamide having at least one selected from a tertiary amino group and an oxyalkylene chain in a molecule thereof; and

water,

wherein the liquid additive has a pH of 7 or less.

14. The liquid additive for polishing according to claim 13 , wherein the water-soluble polyamide has at least one selected from: the tertiary amino group bonded to at least one selected from a main chain and a side chain thereof; and the oxyalkylene chain bonded to the main chain thereof.

15. The liquid additive for polishing according to claim 13 , wherein the water-soluble polyamide is a copolymer obtained from at least one selected from aminoethyl piperazine and a modified polyalkylene glycol, and a lactam.

16. The liquid additive for polishing according to claim 13 , wherein the water-soluble organic polymer contains at least one selected from polyacrylic acid and ammonium polyacrylate.