Low scattering silica glass and method for heat-treating silica glass
View Patent ↗Provides is low scattering silica glass suitable as a material of an optical communication fiber. Silica glass has a fictive temperature of at least 1,000° C. and a void radius of at most 0.240 nm, as measured by positron annihilation lifetime spectroscopy. A method for heat-treating silica glass is also provided, which comprises holding silica glass to be heat-treated in an atmosphere at a temperature of at least 1,200° C. and at most 2,000° C. under a pressure of at least 30 MPa, and cooling the silica glass at an average temperature-decreasing rate of at least 40° C./min during cooling within a temperature range of from 1,200° C. to 900° C. A method for heat-treating silica glass also comprises holding silica glass to be heat-treated in an atmosphere at a temperature of at least 1,200° C. and at most 2,000° C. under a pressure of at least 140 MPa, and cooling the silica glass in an atmosphere under a pressure of at least 140 MPa during cooling within a temperature range of from 1,200° C. to 900° C.
1. Silica glass, which has a fictive temperature of at least 1,000° C. and a void radius of at most 0.240 nm, as measured by positron annihilation lifetime spectroscopy,
wherein
a content of SiO 2 in the silica glass is at least 99.7 mass %,
an OH content in the silica glass is at most 50 ppm,
a content of an alkali metal component in the silica glass is at most 100 ppm, and
a Rayleigh scattering coefficient of the silica glass with respect to light at 1.55 μm is at most 0.065 dB/Km.
2. Silica glass, which has a refractive index of at least 1.460 and an annihilation lifetime τ 3 of at most 1.56 ns when a positron is captured by a void and annihilates,
wherein
a content of SiO 2 in the silica glass is at least 99.7 mass %,
an OH content in the silica glass is at most 50 ppm,
a content of an alkali metal component in the silica glass is at most 100 ppm, and
a Rayleigh scattering coefficient of the silica glass with respect to light at 1.55 μm is at most 0.065 dB/Km.
3. A method for heat-treating silica glass, which comprises holding silica glass to be heat-treated in an atmosphere at a temperature of at least 1,200° C. and at most 2,000° C. under a pressure of at least 30 MPa, and cooling the silica glass at an average temperature-decreasing rate of at least 55° C./min during cooling within a temperature range of from 1,200° C. to 900° C., wherein the silica glass of claim 2 is produced.
4. A method for heat-treating silica glass, which comprises holding silica glass to be heat-treated in an atmosphere at a temperature of at least 1,200° C. and at most 2,000° C. under a pressure of at least 140 MPa, and cooling the silica glass in an atmosphere under a pressure of at least 140 MPa during cooling within a temperature range of from 1,200° C. to 900° C., wherein the silica glass of claim 2 is produced.
5. The method for heat-treating silica glass according to claim 3 , which further comprises cooling the silica glass in an atmosphere under a pressure of at least 0.1 MPa within a temperature range of from 900° C. to 200° C.
6. The method for heat-treating silica glass according to claim 3 , wherein the scattering coefficient of the silica glass after the heat treatment decreases to 60% or less of the value before the heat treatment.
7. The method for heat-treating silica glass according to claim 3 , wherein the void radius of the silica glass as measured by positron annihilation lifetime spectroscopy after the heat treatment decreases to 98% or less of the value before the heat treatment.
8. An optical communication fiber, which uses the silica glass as defined in claim 1 .
9. An optical member for lithography, which uses the silica glass as defined in claim 1 .
10. An optical communication fiber, which uses the silica glass as defined in claim 2 .
11. An optical member for lithography, which uses the silica glass as defined in claim 2 .