IP Library Granted Patent US 9,950,456
Granted Patent B2
US 9,950,456 · App. 15/016,054 · Granted Apr 24, 2018

Housing and method of forming the same

Inventors: Hiroaki Hirao (Ome Tokyo, JP); Kazuo Ito (Mitaka Tokyo, JP)
Assignee: Kabushiki Kaisha Toshiba
B29C45/14065B29C45/2708B29C45/44G06F1/16B29C45/33B29C2045/14147B29L2031/3481
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Quick Facts
Patent No.
US 9,950,456
App. No.
15/016,054
Granted
Apr 24, 2018
Kind
B2
Abstract

According to one embodiment, a housing includes a base plate and a frame formed on an outer edge of the base plate. The base plate includes a positioning hole for positioning in a mold. At least, the frame has a cross-section protruding outside the base plate. A positioning pin fit into the positioning hole is provided in the mold. An inlet through which molten resin is injected into a cavity of the mold is opened in the positioning pin. In the housing, the frame is formed on the outer edge of the base plate by injecting synthetic resin into the mold through the inlet.

Claims (28)

1. An electronic housing comprising:

a base plate; and

a frame on an outer edge of the base plate and comprising a synthetic resin material, wherein:

the base plate comprising a positioning hole to be engaged with a positioning pin in a mold for forming the electronic housing;

the frame comprising:

a first portion on the outer edge of the base plate;

a third portion at a first interval from the first portion; and

a second portion between the first portion and the third portion, coupling the first portion and the third portion, and forming the frame to have a thin cross-section protruding outside the base plate;

the positioning hole being an inlet injecting the synthetic resin material; and

the frame formed by injecting the synthetic resin material into a cavity formed inside the mold through the positioning hole.

2. The electronic housing of claim 1 , wherein

an upper surface of the first portion is on the same plane with a first surface of the base plate,

a lower surface of the first portion is attached to a second surface of the base plate opposite to the first surface, and

the third portion is on a side of the second surface at the first interval from the first portion.

3. The electronic housing of claim 1 , wherein

the cross-section of the frame is C-shaped.

4. The electronic housing of claim 1 , wherein

the second portion is at a midpoint of an outward direction of the first portion and the third portion extending in a direction orthogonal to the first portion and the third portion.

5. The electronic housing of claim 1 , wherein

the base plate is a plate material formed by impregnating carbon fiber with resin.

6. The electronic housing of claim 2 , wherein

the cross-section of the frame is C-shaped.

7. The electronic housing of claim 2 , wherein

the second portion is at a midpoint of an outward direction of the first portion and the third portion extending in a direction orthogonal to the first portion and the third portion.

8. The electronic housing of claim 2 , wherein

the base plate is a plate material formed by impregnating carbon fiber with resin.

9. The electronic housing of claim 4 , wherein

a rib extending outward from the base plate is between the first portion and the third portion.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 15, 2019
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA CLIENT SOLUTIONS CO., LTD.
Reel/Frame 048720/0635 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 4, 2016
From: HIRAO, HIROAKI; ITO, KAZUO
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 037669/0846 →
Continuity (2)
Provisional Application 62153983 · Apr 28, 2015
Related Publication 20160324022A1 · Nov 3, 2016