Multi-Processor Platform for Wireless Communication Terminal Having a Partitioned Protocol Stack
A multi-mode wireless communication device and multi-mode communication method are disclosed. The multi-mode device includes a first baseband co-processor configured to execute low-level stack operations of a first wireless communications protocol employed within a first wireless communications network. The device also includes a host baseband processor configured to execute a set of protocol stack operations of a second wireless communications protocol employed within a first wireless communications network and higher-level stack operations of the first wireless communications protocol. A data communication channel capable of carrying data received by the multi-mode wireless communication device from the first wireless communications network or sent by the multi-mode wireless communication device through the first wireless communications network is provided between at least the host baseband processor and the first baseband co-processor.
1 . A multi-mode wireless communication device, comprising:
a first processor configured to execute a first portion of stack operations of a first wireless communication protocol, the first portion of stack operations of the first wireless communication protocol including a physical stratum of the first wireless communication protocol; and
a second processor configured to execute a second portion of stack operations of the first wireless communication protocol and a first portion of stack operations of a second wireless communication protocol different from the first wireless communication protocol,
wherein the second portion of stack operations of the first wireless communication protocol includes a protocol stratum of the first wireless communication protocol and a communication stratum common to the first wireless communication protocol and the second wireless communication protocol, and
wherein the first portion of stack operations of the second wireless communication protocol includes a protocol stratum of the second wireless communication protocol and the communication stratum.
2 . The multi-mode wireless communication device of claim 1 , wherein the first wireless communication protocol comprises:
a cellular communication protocol, and
wherein the second wireless communication protocol comprises:
a wireless networking communication protocol.
3 . The multi-mode wireless communication device of claim 1 , wherein the physical stratum of the first wireless communication protocol comprises:
a physical layer module configured to implement bearer-specific stack functions of the first wireless communication protocol; and
a physical stratum buffer associated with the physical layer module.
4 . The multi-mode wireless communication device of claim 1 , wherein the protocol stratum of the first wireless communication protocol comprises:
bearer-specific stack functions of the first wireless communication protocol.
5 . The multi-mode wireless communication device of claim 1 , wherein the communication stratum comprises:
bearer-independent stack functions of the first wireless communication protocol and the second wireless communication protocol.
6 . The multi-mode wireless communication device of claim 1 , wherein the protocol stratum of the second wireless communication protocol comprises:
a medium access control (MAC) layer configured to implement bearer-specific stack functions of the second wireless communication protocol.
7 . The multi-mode wireless communication device of claim 1 , wherein the second processor is configured to be communicatively coupled to a third processor, the third processor being configured to execute a second portion of stack operations of the second wireless communication protocol, the second portion of stack operations of the first wireless communication protocol including a physical stratum of the second wireless communication protocol.
8 . The multi-mode wireless communication device of claim 7 , wherein the third processor is realized using a chip, the chip being configured to be inserted within the multi-mode wireless communication device.
9 . A chip that is configured to be inserted within a multi-mode wireless communication device, the chip comprising:
a physical layer module configured to implement a first portion of stack operations of a first wireless communication protocol, the first portion of stack operations of the first wireless communication protocol including a physical stratum of the first wireless communication protocol; and
a physical stratum buffer associated with the physical layer module,
wherein the multi-mode wireless communication device is configured to:
execute stack operations of a second wireless communication protocol different from the first wireless communication protocol, the stack operations of the second wireless communication protocol including a physical stratum of the second wireless communication protocol, a protocol stratum of the second wireless communication protocol and a communication stratum common to the first wireless communication protocol and the second wireless communication protocol, and
execute a second portion of stack operations of the first wireless communication protocol, the second portion of stack operations of the first wireless communication protocol including a protocol stratum of the first wireless communication protocol and the communication stratum.
10 . The chip of claim 9 , wherein the first wireless communication protocol comprises:
a wireless networking communication protocol, and
wherein the second wireless communication protocol comprises:
a cellular communication protocol.
11 . The chip of claim 9 , wherein the physical stratum of the second wireless communication protocol comprises:
a physical layer module configured to implement bearer-specific stack functions of the second wireless communication protocol; and
a physical stratum buffer associated with the physical layer module.
12 . The chip of claim 9 , wherein the protocol stratum of the first wireless communication protocol comprises:
bearer-specific stack functions of the first wireless communication protocol.
13 . The chip of claim 9 , wherein the communication stratum comprises:
bearer-independent stack functions of the first wireless communication protocol and the second wireless communication protocol.
14 . The chip of claim 9 , wherein the protocol stratum of the first wireless communication protocol comprises:
a medium access control (MAC) layer configured to implement bearer-specific stack functions of the first wireless communication protocol.
15 . The chip of claim 9 , wherein the chip is configured to be inserted within the multi-mode wireless communication device.
16 . A multi-mode wireless communication device, comprising:
a first processor configured to execute a physical stratum of a first wireless communication protocol; and
a second processor configured to execute:
a protocol stratum of the first wireless communication protocol,
a communication stratum common to the first wireless communication protocol and a second wireless communication protocol different from the first wireless communication protocol, and
a protocol stratum of the second wireless communication protocol.
17 . The multi-mode wireless communication device of claim 16 , wherein the communication stratum comprises:
bearer-independent stack functions of the first wireless communication protocol and the second wireless communication protocol.
18 . The multi-mode wireless communication device of claim 16 , wherein the protocol stratum of the second wireless communication protocol comprises:
a medium access control (MAC) layer configured to implement bearer-specific stack functions of the second wireless communication protocol.
19 . The multi-mode wireless communication device of claim 16 , wherein the second processor is configured to be communicatively coupled to a third processor, the third processor being configured to execute a physical stratum of the second wireless communication protocol.
20 . The multi-mode wireless communication device of claim 19 , wherein the third processor is realized using a chip, the chip being configured to be inserted within the multi-mode wireless communication device.