Sound damping wallboard and method of constructing a sound damping wallboard
A sound damping wallboard for installation on an installed wallboard, a sound damping wallboard system, and a method of constructing a sound damping wallboard on a building structure are disclosed. The sound damping wallboard comprises a gypsum layer having a gypsum layer inner surface and a gypsum layer outer surface, a sound damping layer disposed at the gypsum layer inner surface for installation between the gypsum layer and an installed wallboard and having a sound damping layer inner surface, a first encasing layer disposed at the gypsum layer outer surface, and a second encasing layer disposed at the sound damping layer inner surface.
1. A sound damping wallboard system for a building structure comprising a first wallboard fastened to the building structure, comprising:
a second wallboard comprising:
a gypsum layer having a gypsum layer inner surface and a gypsum layer outer surface;
a sound damping layer disposed at the gypsum layer inner surface, and having a sound damping layer inner surface opposite the gypsum layer inner surface;
wherein the sound damping layer is formed by applying an adhesive composition comprising a dispersion including an acrylate copolymer and water at the gypsum layer inner surface;
a first encasing layer disposed at the gypsum layer outer surface;
a second encasing layer disposed at the sound damping layer inner surface, wherein the second encasing layer is formed of a material comprising paper, fiberglass, foil, a polymer, or a combination thereof; and
wherein the second wallboard is fastened to the first wallboard with the sound damping layer disposed between the gypsum layer and the first wallboard.
2. The sound damping wallboard system of claim 1 , wherein the sound damping wallboard includes a third encasing layer between the gypsum layer and the sound damping layer.
3. The sound damping wallboard system of claim 1 , wherein the first wallboard has a first wallboard thickness, and the gypsum layer has a gypsum layer thickness that is less than the first wallboard thickness.
4. The sound damping wallboard system of claim 1 , wherein the gypsum layer has a gypsum layer thickness that is about 5/16 inch or less.
5. The sound damping wallboard system of claim 1 , wherein the gypsum layer has a gypsum layer thickness that is about ¼ inch or less.
6. The sound damping wallboard system of claim 1 , wherein the first wallboard comprises a first wallboard gypsum layer having a first density, and the second wallboard comprises a second wallboard gypsum layer having a second density that is greater than the first density.
7. A method of constructing a sound damping wallboard on a building structure comprising a first wallboard fastened to the building structure, comprising the steps of:
fastening a second wallboard to the first wallboard wherein the second wallboard comprises
a gypsum layer having a gypsum layer inner surface and a gypsum layer outer surface,
a sound damping layer having a first surface disposed at the gypsum layer inner surface and a second surface opposite the first surface,
wherein the sound damping layer is formed by applying an adhesive composition comprising a dispersion including an acrylate copolymer and water at the gypsum layer inner surface,
a first encasing layer disposed at the gypsum layer outer surface;
a second encasing layer disposed at the sound damping layer second surface, wherein the second encasing layer is formed of a material comprising paper, fiberglass, foil, a polymer, or a combination thereof; and
wherein the second wallboard is fastened to the first wallboard with the sound damping layer disposed between the gypsum layer and the first wallboard.
8. The method of claim 7 , wherein the gypsum layer has a gypsum layer thickness that is about 5/16 inch or less.
9. The method of claim 7 , wherein the gypsum layer has a gypsum layer thickness that is about ¼ inch or less.
10. The method of claim 7 , wherein the sound damping layer comprises an elastomer.
11. The method of claim 7 , wherein the first wallboard has a first wallboard thickness, and the gypsum layer has a gypsum layer thickness that is less than the first wallboard thickness.
12. The method of claim 7 , further comprising the step of removing the second encasing layer from the second wallboard prior to fastening the second wallboard to the first wallboard.
13. The method of claim 7 , wherein the second encasing layer comprises an adhesive and carrier sheet, and further comprising the steps of removing the carrier sheet, and fastening the second wallboard to the first wallboard by contact with the adhesive.
14. The method of claim 7 , wherein the first wallboard comprises a first wallboard gypsum layer having a first density, and the second wallboard comprises a second wallboard gypsum layer having a second density that is greater than the first density.