Sound damping wallboard and method of forming a sound damping wallboard
View Patent ↗A sound damping wallboard and methods of forming a sound damping wallboard are disclosed. The sound damping wallboard comprises a gypsum layer with a gypsum surface having an encasing layer. The encasing layer is partially removed to expose the gypsum surface and form a gypsum surface portion and a first encasing layer portion on the gypsum layer. A sound damping layer is applied to the gypsum layer to cover at least part of the gypsum surface portion and the encasing layer portion.
1. A sound damping wallboard, comprising:
a gypsum layer having a first side with a first gypsum surface;
a first encasing layer partially covering the first gypsum surface to form a first encasing layer portion and a first gypsum surface portion on the first side; and
a sound damping layer on the first side, and covering at least part of the first encasing layer portion and the first gypsum surface portion.
2. The sound damping wallboard of claim 1 , wherein the first encasing layer portion is formed in a regular pattern.
3. The sound damping wallboard of claim 1 , wherein the first encasing layer portion is formed in a pattern comprising a plurality of parallel bands.
4. The sound damping wallboard of claim 1 , wherein the first gypsum surface has an edge, and at least part of the first encasing layer portion is positioned adjacent to the edge.
5. The sound damping wallboard of claim 1 , wherein the first gypsum surface has first and second edges opposite each other, and at least part of the first encasing layer portion is positioned adjacent to the first and second edges.
6. The sound damping wallboard of claim 1 , wherein the sound damping layer comprises a viscoelastic polymer.
7. The sound damping wallboard of claim 1 , further comprising:
a second gypsum layer having a second side with a second gypsum surface;
a second encasing layer partially covering the second gypsum surface to form a second encasing layer portion and a second gypsum surface portion on the second side; and
wherein the sound damping layer is positioned between the first and second sides, and covers at least part of the first and second encasing layer portions and the first and second gypsum surface portions.
8. The sound damping wallboard of claim 7 , wherein the sound damping layer comprises a viscoelastic polymer adhesive.
9. The sound damping wallboard of claim 7 , wherein the first and second encasing layer portions are formed in the same pattern.
10. The sound damping wallboard of claim 7 , wherein at least part of the sound damping layer is positioned between the first and second encasing layer portions.
11. A method of forming a sound damping wallboard, comprising the steps of:
providing a first gypsum layer having a first side with a first gypsum surface, and a first encasing layer covering the first gypsum surface;
removing part of the first encasing layer to expose the first gypsum surface, and form a first encasing layer portion and a first gypsum surface portion on the first side;
applying a sound damping layer to the first side to cover at least part of the first encasing layer portion and the first gypsum surface portion.
12. The method of claim 11 , wherein the first gypsum surface has an edge, and at least part of the first encasing layer portion is positioned adjacent to the edge.
13. The method of claim 11 , wherein the first gypsum surface has first and second edges opposite each other, and at least part of the first encasing layer portion is positioned adjacent to the first and second edges.
14. The method of claim 11 , wherein the first encasing layer portion is formed in a regular pattern.
15. The method of claim 11 , wherein the first encasing layer portion is formed in a pattern comprising a plurality of parallel bands.
16. The method of claim 11 , wherein the sound damping layer is a viscoelastic polymer.
17. The method of claim 11 , wherein part of the first encasing layer is removed by abrasion.
18. The method of claim 11 , wherein part of the first encasing layer is removed by planing.
19. The method of claim 11 , wherein part of the first encasing layer is removed by peeling.
20. The method of claim 11 , further comprising the step of cleaning the first encasing layer portion and the first gypsum surface portion before applying the sound damping layer to the first side.
21. The method of claim 20 , wherein the first encasing layer portion and the first gypsum surface portion are cleaned by a vacuum.
22. A method of forming a sound damping wallboard, comprising the steps of:
providing a first gypsum layer having a first side with a first gypsum surface, and a first encasing layer covering the first gypsum surface;
removing part of the first encasing layer to expose the first gypsum surface, and form a first encasing layer portion and a first gypsum surface portion on the first side;
providing a second gypsum layer having a second side with a second gypsum surface, and a second encasing layer covering the second gypsum surface;
removing part of the second encasing layer to expose the second gypsum surface, and form a second encasing layer portion and a second gypsum surface portion on the second side;
applying a sound damping layer between the first side and the second side to cover at least part of the first and second encasing layer portion and the first and second gypsum surface portion.
23. The method of claim 22 , wherein the sound damping layer is a viscoelastic polymer adhesive.
24. The method of claim 22 , wherein the first and second encasing layer portions are formed in the same pattern.
25. The method of claim 22 , further comprising the step of applying a third encasing layer to encase the structure formed by the first and second gypsum layers and the sound damping layer.