IP Library Granted Patent US 10,117,327
Granted Patent B2
US 10,117,327 · App. 15/017,538 · Granted Oct 30, 2018

Radio-frequency module

Inventors: Ryosuke Shiozaki (Tokyo, JP); Maki Nakamura (Osaka, JP); Junji Sato (Tokyo, JP)
Assignee: Panasonic Intellectual Property Management Co., Ltd.
H05K1/0243H01L23/49822H01L23/49827H01L23/66H01L24/00H05K1/0298H05K1/144H05K1/181H01L23/49811H01L2223/6627H01L2924/15311H05K2201/042H05K2201/10098H05K2201/10378
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Quick Facts
Patent No.
US 10,117,327
App. No.
15/017,538
Granted
Oct 30, 2018
Kind
B2
Abstract

A radio-frequency module includes: boards; interconnect parts that are conductor layers on the individual boards, at least one of the conductor layers being connected to an RF chip; a land that is a conductor layer connected to one of the interconnect parts; a transmission unit disposed between the boards, connected to the boards through the land to transmit a signal; a ground conductor disposed around the land and the interconnect part connected to the land; an isolation part disposed between the interconnect layer connected to the land and the ground conductor to isolate the interconnect layer connected to the land from the ground conductor; and a coupling part disposed between the land and the ground conductor to short-circuit the land and the ground conductor.

Claims (24)

1. A radio-frequency module comprising:

a board;

an interconnect part having electrical conductivity provided on the board;

a land having electrical conductivity connected to the interconnect part;

a transmission circuitry connected to the land to transmit a signal;

a ground conductor formed at plane completely disposed surrounding a whole circumference of the land and the interconnect part;

an isolation part disposed between the land and the ground conductor to isolate the land and the ground conductor from each other, and disposed between the interconnect part and the ground conductor to isolate the interconnect part and the ground conductor from each other; and

a coupling part connected between the land and the ground conductor to short-circuit the land and the ground conductor.

2. The radio-frequency module according to claim 1 , wherein

the coupling part is disposed on a line extending from a line connecting a center of the land and the interconnect part.

3. The radio-frequency module according to claim 1 , wherein

an angle formed by a line connecting a center of the land to the corresponding interconnect part and a line connecting a center of the land to the coupling part is set depending on a frequency band of the signal.

4. The radio-frequency module according to claim 1 , wherein

the isolation part extends radially outward from a center of the land along the coupling part.

5. The radio-frequency module according to claim 1 , wherein

the coupling part comprises a plurality of coupling parts that are disposed at a plurality of locations in the isolation part and short-circuit the land and the ground conductor.

6. A radio-frequency module comprising:

a multi-layer board including a plurality of layers;

an interconnect part having electrical conductivity provided on at least one of the plurality of layers of the multi-layer board;

a land having electrical conductivity connected to the interconnect part;

a transmission circuitry connected to the land to transmit a signal;

a ground conductor formed at plane completely disposed surrounding a whole circumference of the land and the interconnect part;

an isolation part disposed between the land and the ground conductor to isolate the land and the ground conductor from each other, and disposed between the interconnect part and the ground conductor to isolate the interconnect part and the ground conductor from each other; and

a coupling part connected between the land and the ground conductor to short-circuit the land and the ground conductor.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 28, 2024
From: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
To: PANASONIC AUTOMOTIVE SYSTEMS CO., LTD.
Reel/Frame 066703/0139 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 17, 2016
From: SHIOZAKI, RYOSUKE; NAKAMURA, MAKI; SATO, JUNJI
To: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Reel/Frame 037758/0379 →
Priority Claims (1)
JP 2015-032913 · Feb 23, 2015 · national
Continuity (1)
Related Publication 20160249448A1 · Aug 25, 2016