Connection structure of wiring substrate, and connection method of wiring substrate
Through positioning between a first mark portion of a first substrate body and a second mark portion of a second substrate body, a first connection terminal portion and a second connection terminal portion are superimposed on each other simultaneously with the superimposition of the second substrate body on the first substrate body. In addition, a first substrate cut-off portion and a second substrate cut-off portion are also superimposed on each other. The first connection terminal portion of a first row and the second connection terminal portion of the first row are electrically bonded to each other by thermo-compression bonding or the like.
1. A connection structure of wiring substrates, comprising:
a first wiring substrate, including:
a first substrate body;
a first wiring portion provided on the first substrate body;
a plurality of first connection terminal portions provided for the first wiring portion at intervals; and
a first substrate cut-off portion provided between adjacent two of the plurality of first connection terminal portions, for cutting off electrical connection between the adjacent two first connection terminal portions; and
a second wiring substrate provided so as to face the first wiring substrate, the second wiring substrate including:
a second substrate body superimposed on the first substrate body;
a second wiring portion provided on the second substrate body;
a plurality of second connection terminal portions provided for the second wiring portion so as to be superimposed on the corresponding first connection terminal portions; and
a second substrate cut-off portion superimposed on the first substrate cut-off portion, for cutting off electrical connection between adjacent two of the plurality of second connection terminal portions,
wherein at least one of the first connection terminal portions and at least one of the second connection terminal portions are electrically bonded to each other.
2. The connection structure of wiring substrates according to claim 1 , wherein the at least one first connection terminal portion and the at least one second connection terminal portion are electrically bonded to each other by compression.
3. A method of connecting first and second wiring substrates, the first wiring substrate including a first substrate body, a first wiring portion provided on the first substrate body, a plurality of first connection terminal portions provided for the first wiring portion at intervals, and a first substrate cut-off portion provided between adjacent two of the plurality of first connection terminal portions, and the second wiring substrate including a second substrate body, a second wiring portion provided on the first substrate body, a plurality of second connection terminal portions provided for the first wiring portion at intervals, and a second substrate cut-off portion provided between adjacent two of the plurality of second connection terminal portions, the method comprising:
superimposing the first substrate body on a second substrate body;
superimposing at least one of the first connection terminal portions for bonding on at least one of the second connection terminal portions for bonding;
superimposing the first substrate cut-off portion on the second substrate cut-off portion;
electrically bonding the at least one first connection terminal portion for bonding and the at least one second connection terminal portion for bonding which have been superimposed; and
cutting the first and second substrate bodies in the first and second substrate cut-off portions, respectively, thereby separating the first connection terminal portion and the second connection terminal portion electrically bonded together from the respective first and second substrate bodies; and
electrically bonding one of the remaining first connection terminal portions and one of the remaining second connection terminal portions which are not bonded to each other in the electrically bonding the first and second connection terminal portions.
4. The method of connecting wiring substrates according to claim 3 , wherein the at least one first connection terminal portion and the at least one second connection terminal portion are electrically bonded to each other by compression.
5. The method of connecting wiring substrates according to claim 3 , further comprising:
providing a first mark portion at a corresponding position of the first substrate cut-off portion in the first substrate body, and providing a second mark portion at a corresponding position of the second substrate cut-off portion in the second substrate body; and
superimposing the respective first connection terminal portions on the respective second connection terminal portions by superimposing the respective mark portions, and superimposing the first substrate cut-off portion on the second substrate cut-off portion.