Method of making forming screens

1. A process of making a forming screen, comprising the steps of:

a) providing a metal layer;

b) bonding a first engravable material to the metal layer, the first engravable material having a first engravable material inner surface, a first engravable material outer surface, and a first engravable material thickness;

c) engraving a predetermined pattern into the first engravable material thickness with a collimated energy beam to remove a portion of the first engravable material to form a continuous, interconnected network of channels, the continuous interconnected network of channels comprising a negative space within the first engravable material to expose the metal layer and to create a plurality of discrete formations bonded to the metal layer, thereby creating a pre-form;

d) at least partially filling the continuous, interconnected network of channels of the pre-form with metal to a predetermined depth, thereby creating a metallized pre-form, the metallized pre-form comprising a metallic lattice, the plurality of discrete formations, the metal layer and a metallized pre-form external surface, the metallized pre-form external surface comprising the metallic lattice and the plurality of discrete formations, the metallic lattice comprising metallic lattice x-axis segments interconnected with metallic lattice y-axis segments and the plurality of discrete formations encompassed by the metallic lattice;

e) placing a second engravable material in contact with the metallized pre-form external surface to form a multiplanar base substrate, the second engravable material comprising a second engravable material inner surface, a second engravable material outer surface and a second engravable material thickness;

f) engraving the multiplanar base substrate by engraving the second engravable material with a collimated energy beam to remove a portion of the second engravable material to create a plurality of through-hole perforations that extend through the second engravable material thickness, wherein at least some of the plurality of through-hole perforations are aligned over the metallic lattice to form a multiplanar pre-form;

g) depositing metal into the multiplanar pre-form at the plurality of through-hole perforations to at least partially fill at least some of the through-hole perforations aligned over the metallic lattice to create a metallized multiplanar pre-form comprising a plurality of protrusions on the metal lattice;

h) removing the second engravable material from the metallized multiplanar pre-form;

i) removing the discrete formations from the metallized pre-form to create a screen precursor, the screen precursor comprising the metallic lattice and the metal layer, wherein metallic lattice encompasses a plurality of voids, the voids comprising negative space corresponding to the discrete formations of the metallized pre-form; and

j) removing the metallic lattice from the metal layer of the screen precursor by etching away the metal layer of the screen precursor, thereby creating a forming screen.

2. The process of claim 1 , wherein the metal layer is copper.

3. The process of claim 1 , wherein the first engravable material comprises a layer of non-conductive resin and wherein the b) bonding comprises adhering the first engravable material inner surface to the metal layer with and adhesive.

4. The process of claim 1 , wherein the c) engraving comprises laser engraving.

5. The process of claim 1 , wherein the d) at least partially filling comprises electroplating in a bath containing dissolved nickel salts to at least partially fill the continuous interconnected network of channels to a pre-determined depth with nickel.

6. The process of claim 1 , wherein the engravable material comprises an acetal resin and wherein the i) removing comprises dissolving the discrete formations with a solvent.

7. The process of claim 1 , wherein the j) removing comprises placing the screen precursor in an acid bath and dissolving the metal layer to release the metal lattice.

8. The process of claim 1 , wherein the g) depositing comprises electroplating.

9. The process of claim 1 , wherein the h) removing comprises dissolving the second engravable material.