Compact shielded automotive radar module and method
View Patent ↗An automobile radar module and method include a PCB having a first side on which RF electronic components are mounted and a second side on which digital electronic components are mounted. An EMI shield is mounted over the first side of the PCB, and a radome is mounted over the EMI shield. The EMI shield comprises an aperture exposing RF components on the first side of the PCB. The radome comprises a protrusion which protrudes into the aperture in the EMI shield. The protrusion and sidewalls of the aperture define a shielded region above the RF components on the first side of the PCB. The sidewalls extend at an acute angle with respect to a plane of the primary surface of the EMI shield, the acute angle being selected based on operational parameters of the radar module such that a predetermined shielding performance is realized.
1. An automobile radar module, comprising:
a housing;
a printed circuit board (PCB) mounted in the housing, the PCB having a first side on which radio frequency (RF) electronic components are mounted and a second side on which digital electronic components are mounted;
an electromagnetic interference (EMI) shield mounted over the first side of the PCB; and
a radome mounted over the EMI shield; wherein:
the EMI shield comprises at least one aperture through a primary surface of the EMI shield, the at least one aperture exposing at least a portion of the RF components on the first side of the PCB, such that radiation to and from the portion of the RF components of the first side of the PCB exposed by the aperture of the EMI shield passes through the aperture;
the radome comprises at least one protrusion which protrudes into the at least one aperture in the EMI shield, such that the at least one protrusion on the radome and sidewalls of the at least one aperture on the EMI shield are shaped and positioned such that they are aligned to define a shielded region above the portion of the RF components on the first side of the PCB; and
the sidewalls of the at least one aperture extend at an acute angle with respect to a plane of the primary surface of the EMI shield, the acute angle being selected based on operational parameters of the radar module such that a desired shielding performance is realized.
2. The automobile radar module of claim 1 , wherein the PCB and the EMI shield are mounted in the housing on a plurality of heat-stake posts formed in the housing.
3. The automobile radar module of claim 1 , wherein the housing is made of plastic.
4. The automobile radar module of claim 3 , wherein the plastic is electrically conductive.
5. The automobile radar module of claim 3 , wherein an electrically conductive plating is applied to the housing.
6. The automobile radar module of claim 3 , wherein an electrically conductive paint is applied to the housing.
7. The automobile radar module of claim 1 , wherein the EMI shield is made of plastic.
8. The automobile radar module of claim 7 , wherein the plastic is electrically conductive.
9. The automobile radar module of claim 7 , wherein an electrically conductive plating is applied to the EMI shield.
10. The automobile radar module of claim 7 , wherein an electrically conductive paint is applied to the EMI shield.
11. A method of EMI shielding an automobile radar module, comprising:
mounting a printed circuit board (PCB) in a housing, the PCB having a first side on which radio frequency (RF) electronic components are mounted and a second side on which digital electronic components are mounted;
mounting an EMI shield over the first side of the PCB;
mounting a radome over the EMI shield;
forming at least one aperture through a primary surface of the EMI shield, the at least one aperture exposing at least a portion of the RF components on the first side of the PCB, such that radiation to and from the portion of the RF components of the first side of the PCB exposed by the aperture of the EMI shield passes through the aperture;
forming at least one protrusion on the radome, the at least one protrusion protruding into the at least one aperture in the EMI shield, such that the at least one protrusion and sidewalls of the at least one aperture on the EMI shield are shaped and positioned such that they are aligned to define a shielded region above the portion of the RF components on the first side of the PCB; and
forming the sidewalls of the at least one aperture at an acute angle with respect to a plane of the primary surface of the EMI shield, the acute angle being selected based on operational parameters of the radar module such that a desired shielding performance is realized.
12. The method of claim 11 , wherein the PCB and the EMI shield are mounted in the housing on a plurality of heat-stake posts formed in the housing.
13. The method of claim 11 , wherein the housing is formed of plastic.
14. The method of claim 13 , wherein the plastic is electrically conductive.
15. The method of claim 13 , further comprising applying an electrically conductive plating to the housing.
16. The method of claim 13 , further comprising applying an electrically conductive paint to the housing.
17. The method of claim 11 , wherein the EMI shield is formed of plastic.
18. The method of claim 17 , wherein the plastic is electrically conductive.
19. The method of claim 17 , further comprising applying an electrically conductive plating to the EMI shield.
20. The method of claim 17 , further comprising applying an electrically conductive paint to the EMI shield.