IP Library Granted Patent US 10,064,265
Granted Patent B2
US 10,064,265 · App. 15/027,177 · Granted Aug 28, 2018

Flexible printed circuit having a low emissivity

Inventors: David Robert (Saint Nizier du Moucherotte, FR); Yves Royer (Vinay, FR)
Assignee: SOCIÉTÉ FRANÇAISE DE DÉTECTEURS INFRAROUGES—SOFRADIR
H05K1/0201G01J5/06G01J5/061G01J5/10H01R12/77H05K1/028H05K1/0209H05K1/0296H05K1/11H05K1/0218H05K1/147H05K2201/06H05K2201/066H05K2201/0715
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Quick Facts
Patent No.
US 10,064,265
App. No.
15/027,177
Granted
Aug 28, 2018
Kind
B2
Abstract

A flexible printed circuit of low emissivity including first and second ends and a flexible central portion extending between the first and second ends and including electrically-conductive tracks, coated with a polymer material, to electrically connect the first and second ends. The flexible central portion is at least partly covered with a heat shield formed in a material having an emissivity smaller than those of the polymer material and of the electrically-conductive tracks.

Claims (28)

1. Flexible printed circuit comprising:

first and second electric connectors; and

a flexible central portion extending between the first and second electric connectors and comprising electrically-conductive tracks arranged to electrically connect the first and second electric connectors, the electrically-conductive tracks being coated with a polymer material,

wherein

the flexible central portion is at least partly covered with a heat shield made of a material having an emissivity smaller than the emissivity of the polymer material and the emissivity of the electrically-conductive tracks, and the heat shield is separated from the electrically-conductive tracks by the polymer material, the heat shield having a thickness in the range from 50 to 200 nm configured so as to block thermal transfer by conduction in the heat shield between the first electric connector and the second electric connector.

2. Flexible printed circuit according to claim 1 , wherein the material of the heat shield has an emissivity smaller than 0.05.

3. Flexible printed circuit according to claim 1 , wherein the flexible central portion comprises a first and a second opposite main faces, each covered with the heat shield.

4. Flexible printed circuit according to claim 3 , wherein each heat shield is an outermost layer of the central portion.

5. Flexible printed circuit according to claim 1 , wherein the material of the heat shield is electrically conductive.

6. Flexible printed circuit according to claim 5 , wherein the material of the heat shield is selected from the group consisting of gold, silver, copper, and tungsten.

7. Flexible printed circuit according to claim 5 , comprising an electric interconnection between one of the conductive tracks and the heat shield.

8. Infrared detector comprising a hot source, a cold source, and a flexible printed circuit according to claim 1 , wherein the first electric connector is thermally connected to the cold source and the second electric connector is thermally connected to the hot source, which results in a temperature gradient in the flexible central portion.

9. Infrared detector according to claim 8 , wherein the flexible printed circuit is arranged inside of a vacuum cryostat chamber.

10. Flexible printed circuit according to claim 1 , wherein the flexible central portion and the heat shield together comprise successively:

a first heat shield,

the electrically-conductive tracks coated with the polymer material,

a second heat shield.

11. Flexible printed circuit according to claim 1 , wherein the heat shield is the outermost layer of the central portion.

12. Flexible printed circuit comprising:

first and second electric connectors; and

a flexible central portion extending between the first and second electric connectors and comprising electrically-conductive tracks arranged to electrically connect the first and second electric connectors, the electrically-conductive tracks being coated with a polymer material,

wherein

the flexible central portion is at least partly covered with a heat shield made of a material having an emissivity smaller than the emissivity of the polymer material and the emissivity of the electrically-conductive tracks, and the heat shield is separated from the electrically-conductive tracks by the polymer material,

the material of the heat shield is selected from the group consisting of gold, silver, and tungsten, and

the heat shield has a thickness in the range from 50 to 200 nm configured so as to block thermal transfer by conduction in the heat shield between the first electric connector and the second electric connector.

13. Flexible printed circuit according to claim 12 , wherein the flexible central portion comprises a first and a second opposite main faces, each covered with the heat shield.

14. Flexible printed circuit according to claim 13 , wherein each heat shield is an outermost layer of the central portion.

15. Flexible printed circuit according to claim 12 , wherein the heat shield is the outermost layer of the central portion.

Assignments (2)
CHANGE OF NAME Recorded Sep 22, 2020
From: SOFRADIR
To: LYNRED
Reel/Frame 053844/0652 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 4, 2016
From: ROBERT, DAVID; ROYER, YVES
To: SOCIÉTÉ FRANÇAISE DE DÉTECTEURS INFRAROUGES - SOFRADIR
Reel/Frame 038186/0311 →
Priority Claims (1)
FR 13 02295 · Oct 2, 2013 · national
Continuity (1)
Related Publication 20160242270A1 · Aug 18, 2016