Semiconductor chip and method of separating a composite into semiconductor chips
View Patent ↗The invention concerns a semiconductor chip ( 100 ) with a semiconductor body ( 2 ) having a semiconductor layer sequence, and with a substrate body ( 4 ) and at least one upper side contact ( 8 ). In projection the semiconductor chip ( 100 ) has a shape which deviates from a rectangular shape. The invention also concerns a method of separating a composite into a plurality of semiconductor chips ( 100 ) along a separation pattern ( 15 ) with the steps enabling a plurality of semiconductor chips according to the invention to be produced.
1. A semiconductor chip having a semiconductor body, which comprises a semiconductor layer sequence, having a carrier body and having at least one top side contact, wherein:
the semiconductor chip has in projection a shape that deviates from a rectangular shape,
the semiconductor chip has a base region and a contact region, which is offset laterally from the base region, the at least one top side contact is arranged at least partly in the contact region, the base region has in projection the shape of a rectangle, and the contact region is adjacent to a side surface of the base region,
the contact region is arranged in projection completely within a reference rectangle, one side of which is formed by a side of the projected base region and the height of which is equal to the maximum height of the projected contact region, and wherein the area of the contact region in projection is less than the area of the reference rectangle, and
the contact region is arranged in projection at least with more than 80% of its area within a reference trapezoid arranged in the reference rectangle, wherein the height of the reference trapezoid is equal to that of the reference rectangle and the point of intersection of the diagonals of the reference rectangle is arranged outside the reference trapezoid.
2. The semiconductor chip according to claim 1 , wherein the semiconductor body is embodied in a rectangular fashion.
3. The semiconductor chip according to claim 1 , wherein the semiconductor chip is an optoelectronic component.
4. The semiconductor chip according to claim 1 , wherein two top side contacts are arranged in the contact region.
5. The semiconductor chip according to claim 1 , wherein the area of the contact region in projection is less than 75% of the area of the reference rectangle.
6. The semiconductor chip according to claim 1 , wherein a width of the contact region in projection increases in a direction toward the base region.
7. The semiconductor chip according to claim 1 , wherein a crystal which forms the carrier body is oriented in such a way that a plurality or all of the side surfaces of the carrier body are formed by crystal faces which have a low risk of fracture.
8. The semiconductor chip according to claim 7 , wherein the carrier body consists of silicon or germanium and a plurality or all of the side surfaces of the carrier body are formed by {110} planes of the crystal forming it.