Compact laser device
The invention describes a laser device comprising between two and six mesas ( 120 ) provided on one semiconductor chip ( 110 ), wherein the mesas ( 120 ) are electrically connected in parallel such that the mesas ( 120 ) are adapted to emit laser light if a defined threshold voltage is provided to the mesas ( 120 ). Two to six mesas ( 120 ) with reduced active diameter in comparison to a laser device with one mesa improve the yield and performance despite of the fact that two to six mesas need more area on the semiconductor chip thus increasing the total size of the semiconductor chip ( 110 ). The invention further describes a method of marking semiconductor chips ( 110 ). A functional layer of the semiconductor chip ( 110 ) is provided and structured in a way that a single semiconductor chip ( 110 ) can be uniquely identified by means of optical detection of the structured functional layer. The structured layer enables identification of small semiconductor chips ( 110 ) with a size below 200 μm×200 μm.
1. A laser device, comprising:
between two and four mesas provided on one semiconductor chip and electrically connected in parallel with each; and
a driver configured to electrically drive the mesas,
wherein the driver is configured to provide a defined threshold voltage to the between two to four mesas, and the between two to four mesas are configured so that in response to receiving the defined threshold voltage they emit laser light at the same time as each other, and
wherein each mesas has an active diameter between 7 μm and 9 μm,
wherein the semiconductor chip has a side length of less than 150 μm, and
wherein the laser device is adapted to emit laser light with an optional power, wherein the optical power linearly depends on the provided electrical current when driven at an electrical current between 3 mA and 12 mA.
2. The device according to claim 1 , comprising three mesas.
3. The device according to claim 1 , wherein the laser device is adapted to emit laser light of an optical power between 4 mW and 10 mW.
4. The device according to claim 3 , wherein the laser device is adapted to be driven at a voltage between 1.6 V and 2.2 V at an electrical current of 12 mA when emitting laser light of an optical power between 4 mW and 10 mW.
5. The device according to claim 1 , wherein the laser device is adapted to emit laser light of an optical power between 4 mW and 10 mW at a temperature of 60° C. of the semiconductor chip.
6. The device according to claim 5 , wherein the laser device is adapted to emit laser light of an optical power at a temperature of 25° C. of the semiconductor chip deviating less than 20% from the laser power emitted at 60° C. of the semiconductor chip when driven at an electrical current of 12 mA.
7. The device according to claim 1 , wherein the semiconductor chip comprises a functional layer, the functional layer comprising a coding for identifying the laser device.
8. The device according to claim 7 , wherein the functional layer is a metallization layer of the semiconductor chip.
9. The device according to claim 8 , wherein the metallization layer comprises a binary coding at at least one edge of the semiconductor chip.
10. The device according to claim 1 , wherein the mesas are distributed on the semiconductor chip in a way such that an even heat distribution is enabled across the semiconductor chip.
11. The device of claim 9 , wherein the metallization layer includes an electrical contact of the semiconductor chip.
12. A device, comprising,
a substrate defining one semiconductor chip;
a plurality of mesas provided on the substrate in the one semiconductor chip, the plurality being not greater than four; and
a metallization layer disposed on the substrate, the metallization layer including an electrical contact of the semiconductor chip;
wherein the plurality of mesas are electrically connected in parallel with each other and are configured to be provided with a defined threshold voltage at the same time as each other and in response to receiving the defined threshold voltage the plurality of mesas emit laser light at the same time as each other, and
wherein each mesas has an active diameter between 7 μm and 9 μm, and
wherein the metallization layer which includes the electrical contact of the semiconductor chip also includes a coding for identifying the device.
13. The device of claim 12 , wherein the plurality of mesas is three mesas.
14. The device of claim 12 , wherein the metallization layer comprises a binary coding at at least one edge of the semiconductor chip.
15. The device of claim 12 , wherein the device is adapted to emit the laser light with an optical power, wherein the optical power linearly depends on the provided electrical current when driven at an electrical current between 3 mA and 12 mA.
16. A device, comprising:
a substrate defining one semiconductor chip;
a plurality of mesas provided on the substrate in the one semiconductor chip, the plurality being not greater than six; and
a metallization layer disposed on the substrate, the metallization layer including an electrical contact of the semiconductor chip, and further including a number of extensions of different widths disposed along at least one edge of the semiconductor chip and forming a binary coding which uniquely identifies the semiconductor chip,
wherein the plurality of mesas are electrically connected in parallel with each other and are configured to be provided with a defined threshold voltage at the same time as each other and in response to receiving the defined threshold voltage the plurality of mesas emit laser light at the same time as each other, and
wherein each mesa has an active diameter between 5 μm and 9 μm.