VINYL FLOOR COVERING
A vinyl floor covering includes a carrier which includes a nonwoven layer of fibers containing thermoplastic fibers and high modulus threads extending in the longitudinal direction of the vinyl floor covering for eliminating wrinkles in the vinyl floor covering and for preventing the formation of printing errors and/or surface irregularities in the vinyl floor covering.
1 . A vinyl floor covering comprising a carrier wherein the carrier comprises a nonwoven layer of fibers comprising thermoplastic fibers and high modulus threads extending in the longitudinal direction of the vinyl floor covering, the high modulus threads being spaced apart from each other, and wherein the thermoplastic fibers are thermoplastic filaments.
2 . The vinyl floor covering according to claim 1 , wherein the high modulus threads and the nonwoven layer of fibers comprising thermoplastic fibers are connected to each other to form an integrated carrier.
3 . The vinyl floor covering according to claim 1 , wherein the high modulus threads extending in the longitudinal direction of the vinyl floor covering have a modulus of a least 1 GPa.
4 . The vinyl floor covering according to claim 1 , wherein the type and amount of high modulus threads extending in the longitudinal direction of the vinyl floor covering is selected such that the modulus of the carrier is at least 25 N/5 cm, as determined as the load at specified elongation of 2% in accordance with EN29073-3 (08-1992).
5 . The vinyl floor covering according to claim 1 , wherein the high modulus threads extending in the longitudinal direction are not comprised in a scrim.
6 . The vinyl floor covering according to claim 1 , wherein the high modulus threads extending in the longitudinal direction of the vinyl floor covering are comprised in a scrim wherein the weft threads of the scrim are made of a polymer having a melting temperature equal to or less than the lowest melting temperature of the polymers comprised in the thermoplastic fibers comprised in the nonwoven layer of fibers.
7 . The vinyl floor covering according to claim 6 , wherein the weft threads of the scrim are made of a polymer having a melting temperature at least 10° C. less than the lowest melting temperature of the polymers comprised in the thermoplastic fibers comprised in the nonwoven layer of fibers.
8 . The vinyl floor covering according to claim 1 , wherein the nonwoven layer of fibers comprises two types of mono-component filaments, each type of mono-component filaments being composed of a polymer of different chemical construction having a different melting point.
9 . The vinyl floor covering according to claim 8 , wherein the melting points of the polymers of the two types of mono-component filaments differ by at least 10° C.
10 . The vinyl floor covering according to claim 1 , wherein the nonwoven layer of fibers comprises bicomponent filaments composed of two polymers of different chemical construction having a different melting point.
11 . The vinyl floor covering according to claim 10 , wherein the melting points of the polymers of the two components of the bicomponent filaments differ by at least 10° C.
12 . The vinyl floor covering according to claim 1 , wherein the high modulus threads being spaced apart from each other at regular distances.
13 . The vinyl floor covering according to claim 1 , wherein the high modulus threads extending in the longitudinal direction of the vinyl floor covering have a modulus of a least 5 GPa.
14 . The vinyl floor covering according to claim 1 , wherein the type and amount of high modulus threads extending in the longitudinal direction of the vinyl floor covering is selected such that the modulus of the carrier is at least 50 N/5 cm, as determined as the load at specified elongation of 2% in accordance with EN29073-3 (08-1992).
15 . The vinyl floor covering according to claim 6 , wherein the weft threads of the scrim are made of a polymer having a melting temperature at least 20° C. less than the lowest melting temperature of the polymers comprised in the thermoplastic fibers comprised in the nonwoven layer of fibers.
16 . The vinyl floor covering according to claim 8 , wherein the melting points of the polymers of the two types of mono-component filaments differ by at least 20° C.
17 . The vinyl floor covering according to claim 10 , wherein the melting points of the polymers of the two components of the bicomponent filaments differ by at least 20° C.