Optoelectronic component and method for producing an optoelectronic component

1. An optoelectronic component comprising:

a carrier having a substantially planar surface,

an electrode on or above the carrier, wherein the electrode is a closed electrode layer and the electrode has an interface which is substantially conformal with respect to the surface of the carrier; and

an organic functional layer structure formed for emitting an electromagnetic radiation or converting an electromagnetic radiation into an electric current;

wherein the electrode has a surface which is reflective with respect to the electromagnetic radiation, and wherein the organic functional layer structure is formed on or over the reflective surface of the electrode and is electrically coupled thereto; and

wherein the reflective surface has a structuring, wherein the structuring is formed as an arrangement of holes in the electrode or comprises holes and wherein the electrode with the structuring is formed from a single layer, and

wherein the structuring comprises a mask structure in such a way that the mask structure forms a part of the reflective surface.

2. The optoelectronic component as claimed in claim 1 , wherein the electrode comprises a macrostructured region and a matrix region, wherein the macrostructured region in the reflective surface is surrounded by the matrix region in a planar fashion, wherein the macrostructured region is formed for representing information.

3. The optoelectronic component as claimed in claim 2 , wherein the information is represented in the form of lettering, a pictogram, an ideogram and/or a symbol.

4. The optoelectronic component as claimed in claim 1 , wherein the holes have a depth that is greater than half the wavelength of the reflected electromagnetic radiation.

5. The optoelectronic component as claimed in claim 1 ,

wherein the mask structure comprises or is formed from a phosphor.

6. The optoelectronic component as claimed in claim 1 , wherein the optoelectronic component is formed as an organic optoelectronic component.

7. A method for producing an optoelectronic component, the method comprising:

providing a carrier having a substantially planar surface,

forming a structured electrode on or over the carrier,

wherein the electrode is formed as a closed electrode layer, the electrode having an interface which is substantially conformal with respect to the surface of the carrier, and

wherein the structuring of the electrode is formed as an arrangement of holes in the electrode or comprises holes and wherein the electrode with the structuring is formed from a single layer, and

wherein forming the structured electrode comprises forming the electrode on the carrier and structuring the electrode, wherein structuring comprises forming a mask structure on or over the electrode wherein mask structure forms a part of the reflective surface;

forming an organic functional layer structure for emitting an electromagnetic radiation or converting an electromagnetic radiation into an electric current;

wherein the structured electrode is formed with a surface which is reflective with respect to the electromagnetic radiation, and

wherein the organic functional layer structure is formed on or over the reflective surface of the structured electrode and is electrically coupled thereto.

8. The method as claimed in claim 7 ,

wherein forming the mask structure comprises arranging particles on the electrode.

9. The method as claimed in claim 8 ,

wherein at least a first type of particles and a second type of particles are arranged on the electrode.

10. The method as claimed in claim 8 , wherein the particles are arranged in a monolayer on the electrode.

11. The method as claimed in claim 8 ,

wherein the particles are arranged in a macrostructured region and a matrix region, wherein the average diameter and/or the average spacing of the particles in the macrostructured region is varied in a different way than in the matrix region.

12. The method as claimed in claim 11 ,

wherein the average diameter and/or the average spacing of the particles is influenced by a thermal process and particles are processed in the macrostructured region using a different temperature and/or a different time than in the matrix region.