Nonlinear memristor devices with three-layer selectors

1. A nonlinear memristor device comprising a memristor in electrical series with a three-layer selector,

wherein the memristor comprises at least one electrically conducting layer and at least one electrically insulating layer;

wherein materials of the memristor are stacked in layers, the layers comprising:

the three-layer selector coupled with a first electrode, forming a first interface between a first outer layer of the three-layer selector and the first electrode;

the memristor, comprising two layers, coupled with the three-layer selector, wherein the electrically conducting layer of the memristor forms a second interface with a second outer layer of the three-layer selector; and

a second electrode coupled with the memristor, forming a third interface between the second electrode and the electrically insulating layer of the memristor; and

wherein the three-layer selector comprises a three-layer structure selected from the group consisting of XN—XO—XN; XN—YO—ZN; XN—YO—XN; XO—XN—XO; XO—YN—XO; XO—YN—ZO; XO—YO—XO; XO—YO—ZO; XN—YN—ZN; and XN—YN—XN,

wherein X represents a compound-forming metal different from Y and Z.

2. The device of claim 1 , wherein the compound-forming metals are selected from the group consisting of Ta, Hf, Zr, Al, Co, Ni, Fe, Nb, Mo, W, Cu, Mg, Ca and Ti.

3. The device of claim 1 , wherein the first and second electrodes are selected from the group consisting of Pt Ta, Hf, Zr, Al, Co, Ni, Fe, Nb, Mo, W, Cu, Ti, TaN and TiN.

4. The device of claim 1 , wherein the electrically conducting layer of the memristor also serves as a middle electrode interfacing the memristor with the selector, providing a series connection.

5. The device of claim 1 , wherein the thicknesses of the layers of the three-layer selector vary with the material used and the thicknesses comprise a range between 0.5 to 5 nanometers for a layer.

6. The device of claim 1 , wherein:

the first electrode comprises a layer of TaN;

the three-layer selector comprises an inner layer of TaO x disposed between two outer layers of TaN 1+y , wherein x represents a value between 0 and 2.5 and y represents a value between 0 and 1.7;

the memristor comprises an electrically conducting layer of Ta and an electrically insulating layer of TaO x wherein x represents a value between 0 and 2.5; and

the second electrode comprises TaN.

7. The device of claim 1 , wherein:

the memristor is disposed between a first electrode and a second electrode;

the selector is disposed between a third electrode and a fourth electrode; and

one electrode disposed to the memristor is coupled in electrical series with one electrode disposed to the selector.

8. The device of claim 1 , wherein the device exhibits nonlinearity of at least 10.

9. The device of claim 1 , wherein the device exhibits endurance of at least 10 3 .

10. A nonlinear memristor device, comprising:

a three-layer selector coupled with a first electrode,

wherein the three-layer selector is based on a three-layer structure selected from the group consisting of XN—XO—XN; XN—YO—ZN; XN—YO—XN; XO—XN—XO; XO—YN—XO; XO—YN—ZO; XO—YO—XO; XO—YO—ZO; XN—YN—ZN; and XN—YN—XN,

wherein X represents a compound-forming metal different from Y and Z, and

wherein a first outer layer of the three-layer selector forms a first interface with the first electrode;

a memristor, wherein materials of the memristor are stacked in layers, the layers comprising an electrically conducting layer and an electrically insulating layer, coupled with the three-layer selector, wherein the electrically conducting layer of the memristor forms a second interface with a second outer layer of the three-layer selector; and

a second electrode coupled with the memristor, wherein the second electrode forms a third interface with the electrically insulating layer of the memristor.

11. A method of manufacturing a nonlinear memristor device comprising:

coupling in electrical series;

a memristor comprising at least one electrically conducting layer and at least one electrically insulating layer;

a three-layer selector comprising a three-layer structure selected from the group consisting of XN—XO—XN; XN—YO—ZN; XN—YO—XN; XO—XN—XO; XO—YN—XO; XO—YN—ZO; XO—YO—XO; XO—YO—ZO; XN—YN—ZN; and XN—YN—XN,

wherein X represents a compound-forming metal different from Y and Z; and

coupling the three-layer selector with a first electrode, forming a first interface between a first outer layer of the three-layer selector and the first electrode;

coupling the memristor, comprising two layers, with the three-layer selector, wherein the electrically conducting layer of the memristor forms a second interface with a second outer layer of the three-layer selector; and

coupling a second electrode with the memristor, forming a third interface between the second electrode and the electrically insulating layer of the memristor.

12. The method of claim 11 , wherein the compound-forming metals are selected from the group consisting of Ta, Hf, Zr, Al, Co, Ni, Fe, Nb, Mo, W, Cu, Mg, Ca and Ti.

13. The method of claim 11 , wherein:

the first electrode comprises a layer of TaN;

the three-layer selector comprises an inner layer of TaO x disposed between two outer layers of TaN 1+y , wherein x represents a value between 0 and 2.5 and y represents a value between 0 and 1.7;

the memristor comprises an electrically conducting layer of Ta and an electrically insulating layer of TaO x wherein x represents a value between 0 and 2.5; and

the second electrode comprises TaN.