IP Library Granted Patent US 10,195,841
Granted Patent B2
US 10,195,841 · App. 15/032,952 · Granted Feb 5, 2019

Method for producing cylindrical relief printing original plate

Inventors: Yukimi Yawata (Okayama, JP); Toru Wada (Okayama, JP)
Assignee: TOYOBO CO., LTD.
B41C1/006B29C65/002B41C1/05B41C1/18B41N1/12B41N1/22G03F7/24B29L2031/767
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Quick Facts
Patent No.
US 10,195,841
App. No.
15/032,952
Granted
Feb 5, 2019
Kind
B2
Abstract

A method includes (i) preparing a printing original plate sheet having an uncured photosensitive resin layer on a surface thereof, wherein compressive strength of the uncured photosensitive resin layer at 25° C. is 1.0 to 3.0 kgf/cm 2 ; (ii) mounting the printing original plate sheet around a cylindrical support in such a manner that a starting terminal of the mounting and an ending terminal of the mounting are overlapped; and (iii) applying pressure to the overlapped area of the starting terminal of the mounting and the ending terminal of the mounting at a temperature range of 10 to 40 ° C. so as to pressure-bond the overlapped area. The method may further include, after the step (iii), a step (iv) for photo-curing the uncured photosensitive resin layer and may further comprise, after the step (iv), a step (v) for grinding, abrading and/or machining the overlapped area.

Claims (8)

1. A method for producing a cylindrical relief printing original plate by mounting a printing original plate sheet around a cylindrical support, characterized in that the method comprises the following steps (i) to (iii):

(i) a step for preparing a printing original plate sheet having an uncured photosensitive resin layer on a surface thereof, wherein compressive strength of the uncured photosensitive resin layer at 25° C. is 1.0 to 3.0 kgf/cm 2 ;

(ii) a step for mounting the printing original plate sheet around a cylindrical support in such a manner that a starting terminal of the mounting and an ending terminal of the mounting are overlapped; and

(iii) a step for applying pressure to the overlapped area of the starting terminal of the mounting and the ending terminal of the mounting at a temperature range of 10 to 40° C. so as to pressure-bond the overlapped area.

2. The method according to claim 1 , wherein content of a binder polymer in the photosensitive resin layer is 35 to 55% by mass.

3. The method according to claim 2 , wherein the binder polymer in the photosensitive resin layer contains at least one kind of latex resin selected from polybutadiene latex, nitrile-butadiene latex, styrene-butadiene latex and methyl methacrylate-butadiene latex.

4. The method according to claim 1 , wherein, after the step (iii), the method further comprises a step (iv) for photo-curing the uncured photosensitive resin layer.

5. The method according to claim 4 , wherein, after the step (iv), the method further comprises a step (v) for grinding, abrading and/or machining the overlapped area.

Assignments (3)
CHANGE OF ADDRESS Recorded Aug 7, 2023
From: TOYOBO CO., LTD.
To: TOYOBO CO., LTD.
Reel/Frame 064505/0124 →
DE-MERGER Recorded Aug 7, 2023
From: TOYOBO CO., LTD.
To: TOYOBO MC CORPORATION
Reel/Frame 064505/0803 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 28, 2016
From: YAWATA, YUKIMI; WADA, TORU
To: TOYOBO CO., LTD.
Reel/Frame 038413/0056 →
Priority Claims (1)
JP 2013-224196 · Oct 29, 2013 · national
Continuity (1)
Related Publication 20160250840A1 · Sep 1, 2016