IP Library Granted Patent US 9,685,584
Granted Patent B2
US 9,685,584 · App. 15/034,919 · Granted Jun 20, 2017

Light emitting semiconductor component including an absorptive layer

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Quick Facts
Patent No.
US 9,685,584
App. No.
15/034,919
Granted
Jun 20, 2017
Kind
B2
Abstract

A radiation-emitting semiconductor device includes a semiconductor body with a semiconductor layer sequence, wherein the semiconductor layer sequence has an active region that generates radiation having a peak wavelength in the near-infrared spectral range and an absorptive region, and the absorption region at least partially absorbs a shortwave radiation component having a cut-off wavelength shorter than the peak wavelength.

Claims (19)

1. A radiation-emitting semiconductor device comprising a semiconductor body with a semiconductor layer sequence,

wherein the semiconductor layer sequence has an active region that generates radiation having a peak wavelength in the near-infrared spectral range and an absorption region,

the absorption region at least partially absorbs a shortwave radiation component having a cut-off wavelength which is shorter than the peak wavelength,

the absorption region is nominally undoped, and

the semiconductor device has a first contact and a second contact that externally electrically contact the semiconductor device and the absorption region is arranged outside a current path extending through the active region between the first contact and the second contact.

2. A radiation-emitting semiconductor device comprising:

a semiconductor body with a semiconductor layer sequence having an active region that generates radiation having a peak wavelength in the near-infrared spectral range and an absorption region, and the absorption region at least partially absorbs a shortwave radiation component having a cut-off wavelength shorter than the peak wavelength; and

a first contact and a second contact that externally electrically contact the semiconductor device and the absorption region is arranged outside a current path extending through the active region between the first contact and the second contact.

3. The radiation-emitting semiconductor device according to claim 2 , wherein the absorption region has an absorption coefficient for radiation having the cut-off wavelength of at least 5000/cm.

4. The radiation-emitting semiconductor device according to claim 2 , wherein the cut-off wavelength is shorter than or equal to 820 nm.

5. The radiation-emitting semiconductor device according to claim 2 , wherein the absorption region has at least one layer, the doping concentration of which is at most half a level of a doping concentration of a semiconductor material arranged between the absorption region and the active region.

6. The radiation-emitting semiconductor device according to claim 2 , wherein the absorption region is nominally undoped.

7. The radiation-emitting semiconductor device according to claim 2 , wherein the absorption region has at least one cutout in which a semiconductor layer arranged between the absorption region and the active region is adjacent the first contact or the second contact.

8. The radiation-emitting semiconductor device according to claim 2 , wherein the active region contains Al x In y Ga 1−x−y As with 0≦x≦1,0≦y≦1 and x+y≦1.

9. The radiation-emitting semiconductor device according to claim 2 , wherein the absorption region contains Al x Ga 1−x As with 0.01≦x≦0.1.

10. The radiation-emitting semiconductor device according to claim 2 , wherein the absorption region contains Al x Ga 1−x As with 0.03≦x≦0.07.

11. The radiation-emitting semiconductor device according to claim 2 , wherein the absorption region has a quantum structure with at least one quantum layer.

12. The radiation-emitting semiconductor device according to claim 2 , wherein the absorption region is arranged between the active region and a radiation exit face of the semiconductor body.

13. The radiation-emitting semiconductor device according to claim 2 , wherein the semiconductor device is a thin-film semiconductor chip in which the semiconductor body is fastened by a materially bonded connection to a carrier and is remote from a growth substrate for the semiconductor layer sequence of the semiconductor body.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 3, 2020
From: OSRAM OPTO SEMICONDUCTORS GMBH
To: OSRAM OLED GMBH
Reel/Frame 051467/0906 →
CORRECTIVE ASSIGNMENT TO CORRECT THE FIRST INVENTOR EXECUTION DATE PREVIOUSLY RECORDED AT REEL: 038955 FRAME: 0808. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jul 19, 2016
From: TÅNGRING, IVAR; SUNDGREN, PETRUS
To: OSRAM OPTO SEMICONDUCTORS GMBH
Reel/Frame 039389/0546 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 20, 2016
From: TÅNGRING, IVAR; SUNDGREN, PETRUS
To: OSRAM OPTO SEMICONDUCTORS GMBH
Reel/Frame 038955/0808 →