Solder application stamp for applying solder on contact locations possessing small dimensions
A solder application stamp embodied to transfer solder paste from a reservoir to a contact location of a circuit board. The solder stamp has a basic body having an end area and a protrusion, which protrudes out of the end area. The solder application to create solder paste dots of diameters as small as 10-300 μm.
1. A solder application stamp embodied to transfer solder paste from a reservoir to a contact location of a circuit board, comprising:
a basic body having an end area; and
at least one protrusion, which protrudes out of said end area and has a protrusion area, wherein:
said at least one protrusion, in a longitudinal section has an at least sectionally concave contour between said end area and said protrusion area; and
whereby said solder application stamp is embodied to generate solder paste dots of a diameter of 10 μm to 300 μm.
2. The solder application stamp as claimed in claim 1 , wherein:
said protrusion area extends essentially parallel to said end area of said basic body.
3. The solder application stamp as claimed in claim 1 , wherein:
said protrusion area is so embodied that the ratio of said end area to said protrusion area corresponds at most to a factor of 10, preferably a factor of 7.5 and especially preferably a factor of 5.
4. The solder application stamp as claimed in claim 1 , wherein:
said protrusion area is so embodied that the ratio of said end area to said protrusion area corresponds at most to a factor of 35, preferably a factor of 21, and especially preferably a factor of 15.
5. The solder application stamp as claimed in claim 1 , wherein:
the maximum distance between said end area and said projected area and, thus, the height of the projection lies in the range of 50-250 μm, preferably in the range of 80-150 μm.
6. The solder application stamp as claimed in claim 1 , wherein:
the maximum distance between said end area and said projected area and, thus, the height of said projection lies in the range of 50-400 μm, preferably in the range of 180-220 μm, especially preferably in the range of 280-320 μm.
7. The solder application stamp as claimed in claim 1 , wherein:
said projected area has a diameter in the range of 300-180 μm, preferably in the range of 180-130 μm, especially preferably in the range of 130-50 μm.
8. The solder application stamp as claimed in claim 1 , further comprising:
a hydrophobic coating, which is applied on said basic body at least in a region adjoining the protrusion.
9. The use of a solder application stamp as claimed in claim 1 , in an automated plant for repairing a circuit board, which has at least one defective component.