IP Library Granted Patent US 9,543,073
Granted Patent B2
US 9,543,073 · App. 15/036,317 · Granted Jan 10, 2017

Transformer, method for manufacturing transformer and chip

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Quick Facts
Patent No.
US 9,543,073
App. No.
15/036,317
Granted
Jan 10, 2017
Kind
B2
Abstract

A transformer, a method for manufacturing the transformer and a chip are provided. The method includes: a first primary tuning capacitor and/or a first secondary tuning capacitor are/is arranged in an area enclosed by a primary coil and a secondary coil, wherein the first primary tuning capacitor includes more than one second primary tuning capacitor, and the first secondary tuning capacitor includes more than one second secondary tuning capacitor; the more than one second primary tuning capacitor are connected in parallel, and the more than one second secondary tuning capacitor are connected in parallel; and the more than one second primary tuning capacitor and the at least one wire between the more than one second primary tuning capacitor, and/or the more than one second secondary tuning capacitor and the at least one wire between the more than one second secondary tuning capacitor form a partially-shielded network or part of the partially-shielded network.

Claims (37)

1. A method for manufacturing a transformer, the transformer comprising a primary coil, a secondary coil, a first primary tuning capacitor and a first secondary tuning capacitor, and the method comprising:

arranging the first primary tuning capacitor and/or the first secondary tuning capacitor in an area enclosed by the primary coil and the secondary coil, the first primary tuning capacitor comprising more than one second primary tuning capacitor, and the first secondary tuning capacitor comprising more than one second secondary tuning capacitor;

connecting the more than one second primary tuning capacitor in parallel, and connecting the more than one second secondary tuning capacitor in parallel; and

forming a partially-shielded network or part of the partially-shielded network by the more than one second primary tuning capacitor and at least one wire between the more than one second primary tuning capacitor, and/or by the more than one second secondary tuning capacitor and at least one wire between the more than one second secondary tuning capacitor.

2. The method according to claim 1 , wherein arranging the first primary tuning capacitor and/or the first secondary tuning capacitor in an area enclosed by the primary coil and the secondary coil comprises:

arranging all or some of the more than one second primary tuning capacitor and/or all or some of the more than one second secondary tuning capacitor in a blank area enclosed by the primary coil and the secondary coil or under the blank area.

3. The method according to claim 1 , wherein the transformer comprises an on-chip passive transformer or an on-chip transformer-type balun.

4. The method according to claim 1 , wherein capacitances of the more than one second primary tuning capacitor are completely or incompletely the same;

and/or, capacitances of the more than one second secondary tuning capacitor are completely or incompletely the same.

5. The method according to claim 1 , further comprising:

winding the primary coil and the secondary coil mutually and symmetrically on a same substrate via a metal on a same layer, and adopting an upper-layer metal or a lower-layer metal for transition in a crossed part of metal wires.

6. A transformer, comprising: a primary coil, a secondary coil, a first primary tuning capacitor and a first secondary tuning capacitor, wherein the first primary tuning capacitor comprises more than one second primary tuning capacitor which are connected in parallel; and the first secondary tuning capacitor comprises more than one second secondary tuning capacitor which are connected in parallel;

the first primary tuning capacitor and/or the first secondary tuning capacitor are/is arranged in an area enclosed by the primary coil and the secondary coil; and the more than one second primary tuning capacitor and at least one wire between the more than one second primary tuning capacitor, and/or the more than one second secondary tuning capacitor and at least one wire between the more than one second secondary tuning capacitor form a partially-shielded network or part of a partially-shielded network.

7. The transformer according to claim 6 , wherein the primary coil and the secondary coil are mutually and symmetrically wound on a same substrate via a metal on a same layer, and an upper-layer metal or a lower-layer metal is adopted for transition in a crossed part of metal wires.

8. The transformer according to claim 6 , wherein all or some of the more than one second primary tuning capacitor and/or all or some of the more than one second primary tuning capacitor are arranged in a blank area enclosed by the primary coil and the secondary coil or under the blank area.

9. The transformer according to claim 6 , wherein capacitances of the more than one second primary tuning capacitor are completely or incompletely the same;

and/or, capacitances of the more than one second secondary tuning capacitor are completely or incompletely the same.

10. A chip, comprising a transformer comprising a primary coil, a secondary coil, a first primary tuning capacitor and a first secondary tuning capacitor, wherein the first primary tuning capacitor comprises more than one second primary tuning capacitor which are connected in parallel; and the first secondary tuning capacitor comprises more than one second secondary tuning capacitor which are connected in parallel;

the first primary tuning capacitor and/or the first secondary tuning capacitor are/is arranged in an area enclosed by the primary coil and the secondary coil; and the more than one second primary tuning capacitor and at least one wire between the more than one second primary tuning capacitor, and/or the more than one second secondary tuning capacitor and at least one wire between the more than one second secondary tuning capacitor form a partially-shielded network or part of a partially-shielded network.

11. The method according to claim 2 , further comprising:

winding the primary coil and the secondary coil mutually and symmetrically on a same substrate via a metal on a same layer, and adopting an upper-layer metal or a lower-layer metal for transition in a crossed part of metal wires.

12. The method according to claim 3 , further comprising:

winding the primary coil and the secondary coil mutually and symmetrically on a same substrate via a metal on a same layer, and adopting an upper-layer metal or a lower-layer metal for transition in a crossed part of metal wires.

13. The method according to claim 4 , further comprising:

winding the primary coil and the secondary coil mutually and symmetrically on a same substrate via a metal on a same layer, and adopting an upper-layer metal or a lower-layer metal for transition in a crossed part of metal wires.

14. The transformer according to claim 7 , wherein capacitances of the more than one second primary tuning capacitor are completely or incompletely the same;

and/or, capacitances of the more than one second secondary tuning capacitor are completely or incompletely the same.

15. The transformer according to claim 8 , wherein capacitances of the more than one second primary tuning capacitor are completely or incompletely the same;

and/or, capacitances of the more than one second secondary tuning capacitor are completely or incompletely the same.

16. The chip according to claim 10 , wherein the primary coil and the secondary coil are mutually and symmetrically wound on a same substrate via a metal on a same layer, and an upper-layer metal or a lower-layer metal is adopted for transition in a crossed part of metal wires.

17. The chip according to claim 10 , wherein all or some of the more than one second primary tuning capacitor and/or all or some of the more than one second primary tuning capacitor are arranged in a blank area enclosed by the primary coil and the secondary coil or under the blank area.

18. The chip according to claim 10 , wherein capacitances of the more than one second primary tuning capacitor are completely or incompletely the same;

and/or, capacitances of the more than one second secondary tuning capacitor are completely or incompletely the same.

19. The chip according to claim 16 , wherein capacitances of the more than one second primary tuning capacitor are completely or incompletely the same;

and/or, capacitances of the more than one second secondary tuning capacitor are completely or incompletely the same.

20. A chip according to claim 17 , wherein capacitances of the more than one second primary tuning capacitor are completely or incompletely the same;

and/or, capacitances of the more than one second secondary tuning capacitor are completely or incompletely the same.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 16, 2023
From: ZTE CORPORATION
To: SANECHIPS TECHNOLOGY CO., LTD.
Reel/Frame 062777/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 1, 2016
From: XIE, HAOLV; WU, ZHANGBIN
To: ZTE CORPORATION; SANECHIPS TECHNOLOGY CO.,LTD.
Reel/Frame 040472/0920 →