IP Library Granted Patent US 9,728,914
Granted Patent B2
US 9,728,914 · App. 15/036,750 · Granted Aug 8, 2017

Connection device and reception device

Inventors: Yoshitaka Yoshino (Tokyo, JP); Satoru Tsuboi (Kanagawa, JP); Tomomichi Murakami (Tokyo, JP); Makoto Makishima (Saitama, JP)
Assignee: Sony Semiconductor Solutions Corporation
H01R24/58H01R24/50H01R2107/00
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Quick Facts
Patent No.
US 9,728,914
App. No.
15/036,750
Granted
Aug 8, 2017
Kind
B2
Abstract

A connection device includes a rod-shaped electrode, a plurality of cylindrical electrodes through which the rod-shaped electrode passes, the plurality of cylindrical electrodes being sequentially exposed on a surface in order from a front end side of the rod-shaped electrode, an insulation section configured to insulate the rod-shaped electrode and the plurality of cylindrical electrodes from each other, and a plurality of connection terminals electrically connected to the rod-shaped electrode and the plurality of cylindrical electrodes in a vicinity of a rear end of the rod-shaped electrode, the plurality of connection terminals being protruded from a rear side.

Claims (33)

1. A connection device, comprising:

a rod-shaped electrode;

a plurality of cylindrical electrodes through which the rod-shaped electrode passes, the plurality of cylindrical electrodes being sequentially exposed on a surface in order from a front end side of the rod-shaped electrode;

an insulation section configured to insulate the rod-shaped electrode and the plurality of cylindrical electrodes from each other; and

a plurality of connection terminals electrically connected to the rod-shaped electrode and the plurality of cylindrical electrodes in a vicinity of a rear end of the rod-shaped electrode, the plurality of connection terminals being protruded from a rear side, wherein the connection terminals are connected to a conductor pattern on a wiring substrate and establish a connection with an external unit through the wiring substrate, and wherein the wiring substrate is located at the rear end of the rod-shaped electrode.

2. The connection device according to claim 1 ,

wherein three or more cylindrical electrodes are provided, and

wherein four or more connection terminals that are electrically connected to the rod-shaped electrode and the cylindrical electrodes are led out.

3. The connection device according to claim 1

wherein the wiring substrate is either one of a rigid substrate, a flexible substrate, and a rigid flexible substrate.

4. The connection device according to claim 1

wherein a cable configured to function as an antenna is connected through the wiring substrate.

5. The connection device according to claim 1

wherein a cable configured to function as an antenna and an audio signal transmission cable are connected through the wiring substrate.

6. The connection device according to claim 1

wherein the connection terminals are each inserted into a hole formed in the wiring substrate.

7. The connection device according to claim 1 ,

wherein the plurality of cylindrical electrodes are led out as the connection terminals through extension electrodes, and

wherein intervals between the extension electrodes are substantially equal to each other in a cross-sectional direction.

8. The connection device according to claim 1 ,

wherein a first pair of the rod-shaped electrode and one of the cylindrical electrodes adjacent to the rod-shaped electrode, and a second pair of two cylindrical electrodes form two high-frequency signal transmission paths.

9. The connection device according to claim 8 ,

wherein the connection terminals are connected to a conductor pattern on a wiring substrate, and two coaxial wires corresponding to the two high-frequency signal transmission paths are connected to the conductor pattern.

10. A reception device to which a connection device is capable of being connected,

wherein the connection device includes

a rod-shaped electrode,

a plurality of cylindrical electrodes through which the rod-shaped electrode passes, the plurality of cylindrical electrodes being sequentially exposed on a surface in order from a front end side of the rod-shaped electrode,

an insulation section configured to insulate the rod-shaped electrode and the plurality of cylindrical electrodes from each other, and

a plurality of connection terminals electrically connected to the rod-shaped electrode and the plurality of cylindrical electrodes in a vicinity of a rear end of the rod-shaped electrode, the plurality of connection terminals being protruded from a rear side, wherein the connection terminals are connected to a conductor pattern on a wiring substrate and establish a connection with an external unit through the wiring substrate, and wherein the wiring substrate is located at the rear end of the rod-shaped electrode.

11. The reception device according to claim 10 ,

wherein first and second high-frequency signals are obtained from two terminals among the plurality of connection terminals through capacitors.

12. The reception device according to claim 10 ,

wherein two terminals among the plurality of connection terminals are connected to a high-frequency attenuation element and the two terminals are configured as first and second audio signal terminals.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 9, 2016
From: SONY CORPORATION
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 039386/0277 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 8, 2016
From: YOSHINO, YOSHITAKA; TSUBOI, SATORU; MURAKAMI, TOMOMICHI; MAKISHIMA, MAKOTO
To: SONY CORPORATION
Reel/Frame 039292/0503 →
Priority Claims (1)
JP 2013-242295 · Nov 22, 2013 · national
Continuity (1)
Related Publication 20160276788A1 · Sep 22, 2016