Vertical inductor for WLCSP
View Patent ↗Embodiments of the invention include a microelectronic device and methods of forming a microelectronic device. In an embodiment the microelectronic device includes a semiconductor die and an inductor that is electrically coupled to the semiconductor die. The inductor may include one or more conductive coils that extend away from a surface of the semiconductor die. In an embodiment each conductive coils may include a plurality of traces. For example, a first trace and a third trace may be formed over a first dielectric layer and a second trace may be formed over a second dielectric layer and over a core. A first via through the second dielectric layer may couple the first trace to the second trace, and a second via through the second dielectric layer may couple the second trace to the third trace.
1. A microelectronic device, comprising:
a semiconductor die; and
an inductor electrically coupled to the semiconductor die, wherein the inductor includes one or more conductive coils that extend away from a surface of the semiconductor die, wherein the one or more conductive coils are formed around a core, and wherein one or more of the conductive coils contacts the core.
2. The microelectronic device of claim 1 , wherein the one or more conductive coils comprise a plurality of traces electrically coupled to each other by one or more vias.
3. The microelectronic device of claim 2 , wherein the plurality of traces in the conductive coil comprises a first trace and a third trace formed over a first dielectric layer and a second trace formed over a second dielectric layer and over the core, and wherein a first via through the second dielectric layer couples the first trace to the second trace, and a second via through the second dielectric layer couples the second trace to the third trace.
4. The microelectronic device of claim 1 , wherein the core is a magnetic material.
5. The microelectronic device of claim 4 , wherein the core is nickel or cobalt.
6. The microelectronic device of claim 4 , wherein the core is a composite material.
7. The microelectronic device of claim 6 , wherein the composite material include a polymer matrix comprising epoxy, polyimide, benzocyclobutene (BCB), and a filler material comprising nickel-zinc ferrites, manganese-zinc ferrites, nickel, iron, or cobalt.