IP Library Granted Patent US 9,773,765
Granted Patent B2
US 9,773,765 · App. 15/037,392 · Granted Sep 26, 2017

Compact optoelectronic modules

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Quick Facts
Patent No.
US 9,773,765
App. No.
15/037,392
Granted
Sep 26, 2017
Kind
B2
Abstract

Compact optoelectronic modules are described that, in some implementations, can have reduced heights, while at the same time having very little optical crosstalk or detection of stray light. An optoelectronic module having optical channel can include a support on which is mounted an optoelectronic device arranged to emit or detect light at a particular one or more wavelengths. The module has a cover including an optically transmissive portion over the optoelectronic device. The optically transmissive portion is surrounded laterally by sections of the cover that are substantially non-transparent to the one or more wavelengths. A passive optical element is present on a surface of the optically transmissive portion. A spacer separates the support from the cover. The cover can be relatively thin so that the overall height of the module is relatively small.

Claims (25)

1. An optoelectronic module having optical channel, the module comprising:

a support on which is mounted an optoelectronic device arranged to emit or detect light at a particular one or more wavelengths;

a cover including an optically transmissive portion over the optoelectronic device, wherein the optically transmissive portion is surrounded laterally by sections of the cover that are substantially non-transparent to the one or more wavelengths, wherein the non-transparent sections of the cover are composed of a PCB, polymer or ceramic layer having a coating of a non-transparent material on a least one side, the cover having a thickness of no more than 150 μm;

a passive optical element on a surface of the optically transmissive portion; and

a spacer separating the support from the cover.

2. The optoelectronic module of claim 1 wherein the non-transparent material of the coating is a metal or polymer.

3. The optoelectronic module of claim 1 including a non-transparent material coating on both sides of the PCB, polymer or ceramic layer.

4. The optoelectronic module of claim 1 wherein the optoelectronic device is operable to emit infra-red light or is operable to detect infra-red light.

5. An optoelectronic module having optical channel, the module comprising:

a support on which is mounted an optoelectronic device arranged to emit or detect light at a particular one or more wavelengths;

a cover including an optically transmissive portion over the optoelectronic device, wherein the optically transmissive portion is surrounded laterally by sections of the cover that are substantially non-transparent to the one or more wavelengths, wherein the non-transparent sections of the cover are composed of a non-transparent material sandwiched between first and second layers of a PCB, polymer or ceramic material, the cover having a thickness of no more than 150 μm;

a passive optical element on a surface of the optically transmissive portion; and

a spacer separating the support from the cover.

6. An optoelectronic module having an optical emission or detection channel, the module comprising:

a support on which is mounted a light emitting or light detecting element;

a cover including an optically transmissive portion over the light emitting or light detecting element, wherein the optically transmissive portion is surrounded laterally by sections of the cover that are substantially non-transparent to one or more wavelengths of light emitted by or detectable by the light emitting or light detecting element, and wherein the non-transparent sections of the cover are composed of a PCB, polymer or ceramic layer having a coating of a non-transparent material;

a lens on a surface of the optically transmissive portion; and

a spacer separating the support from the cover.

7. The optoelectronic module of claim 6 wherein the non-transparent material of the coating is a metal or polymer.

8. The optoelectronic module of claim 6 including:

an optical emission channel and an optical detection channel mounted on the support;

wherein the cover includes a first optically transmissive portion over the light emitting device and a second optically transmissive portion over the light detecting device, wherein the optically transmissive portions are surrounded laterally by sections of the cover that are substantially non-transparent to one or more wavelengths of light emitted by the light emitting device and detectable by the light detecting device, and wherein the non-transparent sections of the cover are composed of a PCB, polymer or ceramic layer having a coating of a non-transparent material;

the module including a lens on a surface of the first optically transmissive portion, and a lens on a surface of the second optically transmissive portion.

9. The optoelectronic module of claim 8 wherein the coating comprises a metal or polymer.

10. The optoelectronic module of claim 8 wherein the coating is composed of a material selected from a group consisting of: copper, chrome, poly(methyl methacrylate), phenol formaldehyde resin, and an epoxy based photoresist.

Assignments (4)
CHANGE OF NAME Recorded Jan 6, 2026
From: AMS SENSORS SINGAPORE PTE. LTD.
To: AMS-OSRAM ASIA PACIFIC PTE. LTD.
Reel/Frame 074202/0700 →
CHANGE OF NAME Recorded Nov 3, 2025
From: AMS SENSORS SINGAPORE PTE. LTD.
To: AMS-OSRAM ASIA PACIFIC PTE. LTD.
Reel/Frame 073476/0659 →
CHANGE OF NAME Recorded Feb 8, 2019
From: HEPTAGON MICRO OPTICS PTE. LTD.
To: AMS SENSORS SINGAPORE PTE. LTD.
Reel/Frame 048289/0147 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 24, 2016
From: GEIGER, JENS
To: HEPTAGON MICRO OPTICS PTE. LTD.
Reel/Frame 038701/0109 →