Microcircuit card containing multiple pre-cutout cards having one and the same span of contacts
A microcircuit card including an overall span of contacts including at least individual contact surfaces connected to this microcircuit while defining two parallel columns situated in proximity to two edges of the overall span, in a card body having a format at least equal to the 2FF format, in which there is made a pre-cutout in the 4FF format surrounding the overall span of contacts and a pre-cutout in the 3FF format surrounding the pre-cutout in the 4FF format, these pre-cutouts being such that the individual contact surfaces have, with respect to each of the pre-cutouts, positions and dimensions such that they encompass the theoretical contact zones defined by the standards defining these 4FF, 3FF and 2FF formats, the upper edge of the pre-cutout in the 3FF format being situated at a distance at least equal to 400 micrometers from the upper edge of the pre-cutout in the 4FF format.
1. A microcircuit card comprising:
a global contact area comprising a plurality of individual contact surfaces C 1 to C 3 , C 5 to C 7 connected to the microcircuit card by defining two parallel columns situated in proximity to two edges of the global contact area, the global contact area being in a card body having a format at least equal to the 2FF format, the card body having a pre-cut formed therein in the 4FF format surrounding the global contact area and having a pre-cut formed therein in the 3FF format surrounding the pre-cut in the 4FF format, the pre-cuts being such that the individual contact surfaces C 1 to C 3 , C 5 to C 7 have, relative to each of the pre-cuts, positions and dimensions such that the individual contact surfaces encompass the theoretical contact zones defined by the standards defining the 4FF, 3FF, and 2FF formats, the top edge of the pre-cut in the 3FF format, defined by the longitudinal edge of the pre-cut furthest away from the corner of the pre-cut in the 3FF format comprising a feature-forming sloping edge, being situated at a distance at least equal to 400 micrometers and less than or equal to 542 micrometers from the top edge of the pre-cut in the 4FF format, the individual surfaces C 1 and C 5 being, within the columns, symmetrical to the individual surfaces C 3 and C 7 relative to a median line of the global contact area extending parallel to the length of the global contact area,
wherein the theoretical contact zones of the pre-cut in the 3FF format are offset toward the top edge of the card, relative to the theoretical contact zones of the pre-cut in the 4FF format, by a value less than or equal to (E−e)/2−T, when E is the width of interstices between the theoretical contact zones, e is the width of the interstices between the individual contact surfaces, and T is a fabrication tolerance value.
2. The microcircuit card as claimed in claim 1 , wherein the card body in the 2FF format is delimited, by a discontinuous slot, within a card in the 1FF format, the theoretical zones of which are merged with the theoretical zones of the card in the 2FF format.
3. The microcircuit card as claimed in claim 1 , wherein the global contact area is formed by contact surfaces separated by interstices centered on the interstices between the theoretical contact zones of the card in the 4FF format.
4. The microcircuit card as claimed in claim 1 , wherein the distance between the top edge of the pre-cut in the 3FF format and the top edge of the pre-cut in the 4FF format is at least equal to 490 micrometers.
5. The microcircuit card as claimed in claim 1 , wherein the distance between the top edge of the global contact area and the top edge of the pre-cut in the 4FF format is equal to the distance between the bottom edge of the global contact area and the bottom edge of the pre-cut in the 4FF format.
6. The microcircuit card as claimed in claim 5 , wherein the contact area has a standardized format delimited by a rectangular form whose dimensions are equal to 11*8.32 mm.
7. The microcircuit card as claimed in claim 2 , wherein the global contact area is formed by contact surfaces separated by interstices centered on the interstices between the theoretical contact zones of the card in the 4FF format.
8. The microcircuit card as claimed in claim 7 , wherein the theoretical contact zones of the pre-cut in the 3FF format are offset toward the top edge of the card, relative to the theoretical contact zones of the pre-cut in the 4FF format, by a value less than or equal to (E−e)/2−T, when E is the width of the interstices between the theoretical contact zones, e is the width of the interstices between the individual contact surfaces, and T is a fabrication tolerance value.
9. The microcircuit card as claimed in claim 2 , wherein the distance between the top edge of the pre-cut in the 3FF format and the top edge of the pre-cut in the 4FF format is at least equal to 490 micrometers.
10. The microcircuit card as claimed in claim 3 , wherein the distance between the top edge of the pre-cut in the 3FF format and the top edge of the pre-cut in the 4FF format is at least equal to 490 micrometers.
11. The microcircuit card as claimed in claim 2 , wherein the distance between the top edge of the global contact area and the top edge of the pre-cut in the 4FF format is equal to the distance between the bottom edge of the global contact area and the bottom edge of the pre-cut in the 4FF format.
12. The microcircuit card as claimed in claim 3 , wherein the distance between the top edge of the global contact area and the top edge of the pre-cut in the 4FF format is equal to the distance between the bottom edge of the global contact area and the bottom edge of the pre-cut in the 4FF format.
13. The microcircuit card as claimed in claim 4 , wherein the distance between the top edge of the global contact area and the top edge of the pre-cut in the 4FF format is equal to the distance between the bottom edge of the global contact area and the bottom edge of the pre-cut in the 4FF format.