Bus bar plate, electronic component unit, and wire harness
View Patent ↗An electronic component unit and a wire harness are provided with a bus bar plate. The bus bar plate is provided with a metallic bus bar that is built in a resin material, and including a through-hole in which a terminal of a relay mounted on a mounting surface is soldered. The through-hole is provided with a bus bar through-hole which penetrates the bus bar, and a resin material through-hole which penetrates the resin material and is formed to be larger than the bus bar through-hole to expose the surface of the bus bar. When an inner diameter of the bus bar through-hole is defined as r and an inner diameter of the resin material through-hole is defined as R, 1.5r≦R is satisfied.
1. A bus bar plate comprising:
a metallic bus bar that is built in a resin material and includes a through-hole in which terminals of an electronic component mounted on a mounting surface are soldered, wherein
the through-hole is provided with:
a bus bar through-hole which penetrates the metallic bus bar; and
a resin material through-hole which penetrates the resin material and is larger than the bus bar through-hole to expose the surface of the metallic bus bar;
when an inner diameter of the bus bar through-hole is defined as r and an innermost diameter of the resin material through-hole is defined as R, 1.5r≦R≦3.25r and 1.2 mm≦r≦2.0 mm are satisfied, and
a thickness of the metallic bus bar is 0.4 mm to 0.8 mm.
2. The bus bar plate according to claim 1 , wherein
when the inner diameter of the bus bar through-hole is defined as r and the innermost diameter of the resin material through-hole is defined as R, 1.83r=R is satisfied.
3. The bus bar plate according to claim 1 , wherein
the resin material through-hole is tapered so as to be gradually enlarged as the resin material through-hole approaches the mounting surface.
4. The bus bar plate according to claim 2 , wherein
the resin material through-hole is tapered so as to be gradually enlarged as the resin material through-hole approaches the mounting surface.
5. An electronic component unit comprising:
a bus bar plate provided with a metallic bus bar that is built in a resin material and includes a through-hole in which terminals of an electronic component mounted on a mounting surface are soldered; and
a housing in which the bus bar plate is internally assembled, wherein
the through-hole is provided with:
a bus bar through-hole which penetrates the metallic bus bar; and
a resin material through-hole which penetrates the resin material and is larger than the bus bar through-hole to expose the surface of the metallic bus bar,
when an inner diameter of the bus bar through-hole is defined as r and an innermost diameter of the resin material through-hole is defined as R, 1.5r≦R≦3.25r and 1.2 mm≦r≦2.0 mm are satisfied, and
a thickness of the metallic bus bar is 0.4 mm to 0.8 mm.
6. A wire harness comprising:
an electronic component unit equipped with a bus bar plate provided with a metallic bus bar that is built in a resin material and includes a through-hole in which terminals of an electronic component mounted on a mounting surface are soldered, and a housing in which the bus bar plate is internally assembled; and
an electric wire electrically connected to the electronic component unit, wherein
the through-hole is provided with:
a bus bar through-hole which penetrates the metallic bus bar; and
a resin material through-hole which penetrates the resin material and is larger than the bus bar through-hole to expose the surface of the metallic bus bar, and
when an inner diameter of the bus bar through-hole is defined as r and an innermost diameter of the resin material through-hole is defined as R, 1.5r≦R≦3.25r and 1.2 mm≦r≦2.0 mm are satisfied, and
a thickness of the metallic bus bar is 0.4 mm to 0.8 mm.
7. The bus bar plate according to claim 1 , wherein
when the inner diameter of the bus bar through-hole is defined as r, r=1.2 mm is satisfied, and
a radial width around the terminal of the surface of the bus bar exposed inside the through-hole is 0.3 mm or more and 1.35 mm or less.