Heat dissipating circuit board and electronic device
A heat dissipating circuit board for a power semiconductor includes an electrode material on which a power semiconductor is mounted on a front surface thereof, and a member bonded to a front surface side of the electrode material. The member is made up from a material which exhibits a lower coefficient of thermal expansion than that of the electrode material, and which exhibits a higher Young's modulus than that of the electrode material.
1. A heat dissipating circuit board for a power semiconductor, comprising:
an electrode material on which the power semiconductor is mounted on a front surface thereof; and
a member bonded to a front surface side of the electrode material,
wherein the member is made up from a material which exhibits a lower coefficient of thermal expansion than that of the electrode material, and which exhibits a higher Young's modulus than that of the electrode material.
2. The heat dissipating circuit board according to claim 1 , wherein the member is formed in an annular shape along an outer circumference of the front surface of the electrode material.
3. The heat dissipating circuit board according to claim 1 , wherein a plurality of the members are provided, the plural members being arranged along an outer circumference of the front surface of the electrode material.
4. The heat dissipating circuit board according to claim 1 , wherein two of the members are bonded at linearly symmetric positions.
5. The heat dissipating circuit board according to claim 1 , wherein a portion of the member extends out in a transverse direction beyond an outer circumference of the front surface of the electrode material.
6. The heat dissipating circuit board according to claim 1 , wherein entirety of the member is bonded within the front surface of the electrode material.
7. The heat dissipating circuit board according to claim 1 , wherein:
a portion of the front surface of the electrode material includes a recess therein; and
the member is bonded in the recess.
8. The heat dissipating circuit board according to claim 1 , further comprising a ceramic substrate, which is bonded to a rear surface of the electrode material.
9. The heat dissipating circuit board according to claim 8 , wherein at least material properties and thicknesses of the member and the ceramic substrate are adjusted so as to suppress warping of the heat dissipating circuit board.
10. The heat dissipating circuit board according to claim 8 , wherein a constituent material of the member is a ceramic material, which is the same as the ceramic material of the ceramic substrate.
11. The heat dissipating circuit board according to claim 8 , wherein a constituent material of the ceramic substrate is silicon nitride.
12. The heat dissipating circuit board according to claim 8 , further comprising another electrode material, which is bonded to an end surface of the ceramic substrate.
13. The heat dissipating circuit board according to claim 12 , wherein a thickness of the electrode material is greater than a thickness of the other electrode material.
14. The heat dissipating circuit board according to claim 13 , wherein an inequality
t1>tb>t2
is satisfied, where tb represents a thickness of the ceramic substrate, t 1 represents the thickness of the electrode material, and t 2 represents the thickness of the other electrode material.
15. An electronic device comprising:
a heat dissipating circuit board for a power semiconductor; and
a power semiconductor, which is mounted on a front surface of an electrode material of the heat dissipating circuit board,
the heat dissipating circuit board comprising:
the electrode material; and
a member bonded to a front surface side of the electrode material,
wherein the member is made up from a material which exhibits a lower coefficient of thermal expansion than that of the electrode material, and which exhibits a higher Young's modulus than that of the electrode material.