Optimized server design using dense DIMM spacing, wide heatsink, improved routing channels, and improved air delivery to rear devices
View Patent ↗Example embodiments of the present invention provide a method of manufacture and an apparatus for optimized server design using dense DIMM spacing, wide heatsink, improved routing channels, and improved air delivery to rear devices. The method of manufacture comprise providing a plurality of compliant pin memory sockets on a first side of a circuit board at a pitch less than that specified in a reference layout requiring solder tail memory sockets and providing a plurality of surface mount capacitors on the second side of the circuit board enabling at least one pair of the plurality of compliant pin memory sockets to be provided at the pitch less than that specified in the reference layout.
1. A method of manufacture comprising:
providing a plurality of compliant pin memory sockets on a first side of a circuit board; and
providing a plurality of surface mount decoupling capacitors on the second side of the circuit board.
2. The method of claim 1 wherein a pitch between at least one pair of the compliant pin memory sockets is selected from the range 0.312-0.337 inches.
3. The method of claim 2 wherein the provision of compliant pin memory sockets enables the at least one pair of the plurality of compliant pin memory sockets to be provided at the pitch less than that specified in the reference layout.
4. The method of claim 2 further comprising grouping the plurality of compliant pin memory sockets at the pitch less than that specified in the reference layout.
5. The method of claim 4 wherein grouping the plurality of compliant pin memory sockets comprises providing a channel associated with the circuit board between respective groups of compliant pin memory sockets.
6. The method of claim 5 wherein the channel is configured for routing a cable.
7. The method of claim 5 wherein the circuit board is configured for providing a fan configured to direct cooling air through the channel to additional downstream components.
8. The method of claim 1 wherein the circuit board is configured for providing a square-based heatsink on at least one processor provided on the circuit board.
9. The method of claim 8 wherein the circuit board is configured for providing a fan configured to direct cooling air over the heatsink and memory modules installed in the compliant pin memory sockets.
10. An apparatus comprising:
a circuit board having a first side and a second side;
a plurality of compliant pin memory sockets provided on the first side of the circuit board; and
a plurality of surface mount decoupling capacitors provided on the second side of the circuit board.
11. The apparatus of claim 10 wherein a pitch between at least one pair of the compliant pin memory sockets is selected from the range 0.312-0.337 inches.
12. The apparatus of claim 11 wherein the provision of compliant pin memory sockets enables the at least one pair of the plurality of compliant pin memory sockets to be provided at the pitch less than that specified in the reference layout.
13. The apparatus of claim 11 wherein the plurality of compliant pin memory sockets are grouped at the pitch less than that specified in the reference layout.
14. The apparatus of claim 13 further comprising a channel associated with the circuit board between respective groups of compliant pin memory sockets.
15. The apparatus of claim 14 wherein the channel is configured for routing a cable.
16. The apparatus of claim 14 wherein the circuit board is configured for providing a fan configured to direct cooling air through the channel to additional downstream components.
17. The apparatus of claim 10 wherein the circuit board is configured for providing a square-based heatsink on at least one processor provided on the circuit board.
18. The apparatus of claim 17 wherein the circuit board is configured for providing a fan configured to direct cooling air over the heatsink and memory modules installed in the compliant pin memory sockets.