IP Library Granted Patent US 9,524,416
Granted Patent B1
US 9,524,416 · App. 15/045,379 · Granted Dec 20, 2016

Fingerprint sensing device comprising three-dimensional pattern

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Quick Facts
Patent No.
US 9,524,416
App. No.
15/045,379
Granted
Dec 20, 2016
Kind
B1
Abstract

There is provided a fingerprint sensing device comprising: a sensing chip comprising an array of sensing elements, the sensing elements being configured to be connected to readout circuitry for detecting a capacitive coupling between each of the sensing elements and a finger placed on a sensing surface of the sensing device; a cover layer arranged vertically above the sensing elements to cover at least a portions of the sensing elements, wherein an outer surface of the cover layer form the sensing surface of the sensing device; wherein the cover layer comprises a three-dimensional pattern configured to reduce the amount of reflected light within a predetermined sub-range of the visible range. There is also provided a method for manufacturing a fingerprint sensing device.

Claims (21)

1. A fingerprint sensing device comprising:

a sensing chip comprising an array of sensing elements, said sensing elements being configured to be connected to readout circuitry for detecting a capacitive coupling between each of said sensing elements and a finger placed on a sensing surface of said sensing device;

a cover layer arranged vertically above said sensing elements to cover at least a portions of said sensing elements, wherein an outer surface of said cover layer form said sensing surface of said sensing device;

wherein said cover layer comprises a three-dimensional pattern configured to reduce an amount of reflected light within a predetermined sub-range of a visible range.

2. The sensing device according to claim 1 , wherein said three-dimensional pattern is a plasmonic array comprising a plurality of electrically conductive nanostructures, wherein said nanostructures are galvanically isolated from each other.

3. The sensing device according to claim 2 , wherein a size, shape and distribution of said nanostructures is selected to form a plasmonic array configured to reduce the amount of reflected light within a predetermined sub-range of the visible range.

4. The sensing device according to claim 1 , wherein said three-dimensional pattern is reflective diffraction grating.

5. The sensing device according to claim 1 , wherein said cover layer comprises a plurality of sub-layers.

6. The sensing device according to claim 5 , wherein said three-dimensional pattern is arranged in a first sub-layer which is covered by a second sub-layer.

7. The sensing device according to claim 1 , wherein said cover layer comprises a first area portion where said three-dimensional pattern is configured to reduce a first amount of reflected light within a first predetermined sub-range, and a second area portion where said three-dimensional pattern is configured to reduce a second amount of reflected light within a second predetermined sub-range, wherein said first predetermined sub-range is different from said second predetermined sub-range.

8. The sensing device according to claim 1 , wherein said three-dimensional pattern is arranged at said sensing surface, and wherein said pattern is configured to provide hydrophobic surface properties.

9. The sensing device according to claim 1 , wherein said three-dimensional pattern is configured to reduce the amount of reflected light within different predetermined sub-ranges of the visible range for different area portions of the sensing device such that an image is formed on said sensing surface.

10. The sensing device according to claim 1 , wherein said three-dimensional pattern is configured such that the predetermined sub-range is different for different viewing angles.

11. The sensing device according to claim 1 , wherein at least a portion of said cover layer is coated by an optically reflecting material.

12. The sensing device according to claim 1 , wherein at least protruding portions of said three-dimensional pattern are coated by an optically reflecting material.

13. A method for manufacturing a fingerprint sensing device, said method comprising:

providing a sensing chip comprising an array of sensing elements, said sensing elements being configured to be connected to readout circuitry for detecting a capacitive coupling between each of said sensing elements and a finger placed on a sensing surface of said sensing device;

forming a cover layer arranged vertically above said sensing elements to cover at least a portions of said sensing elements, wherein an outer surface of said cover layer form said sensing surface of said sensing device; and

in said cover layer, forming a three-dimensional pattern configured to reduce an amount of reflected light within a predetermined sub-range of a visible range.

14. The method according to claim 13 , wherein forming the three-dimensional pattern comprises nanoimprint lithography or photolithography.

15. The method according to claim 13 , further comprising depositing a reflective coating on protruding portions of said three-dimensional pattern.

Assignments (3)
CORRECTIVE ASSIGNMENT TO CORRECT THE PATENT NUMBER 10945920 WHICH SHOULD HAVE BEEN ENTERED AS 10845920 PREVIOUSLY RECORDED ON REEL 058218 FRAME 0181. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Sep 15, 2022
From: FINGERPRINT CARDS AB
To: FINGERPRINT CARDS ANACATUM IP AB
Reel/Frame 064053/0400 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 22, 2021
From: FINGERPRINT CARDS AB
To: FINGERPRINT CARDS ANACATUM IP AB
Reel/Frame 058218/0181 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 17, 2016
From: ROMMEL, SONJA
To: FINGERPRINT CARDS AB
Reel/Frame 037749/0555 →