IP Library Granted Patent US 10,345,875
Granted Patent B2
US 10,345,875 · App. 15/046,480 · Granted Jul 9, 2019

Hybrid passive and active cooling assembly

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Quick Facts
Patent No.
US 10,345,875
App. No.
15/046,480
Granted
Jul 9, 2019
Kind
B2
Abstract

A cooling assembly for cooling a processor includes a heat sink base defining a first area and a second area, a plurality of heat sink fins extending from the first area, a thermoelectric cooling module having a cold side and hot side, wherein the cold side is in contact with the second area, and a heat sink module in contact with the hot side. In use, a method includes monitoring a processor parameter selected from processor power consumption and processor temperature, and causing airflow across the plurality of heat sink fins and the heat sink module. The method further includes powering on the thermoelectric cooling module in response to the processor parameter having a value greater than a first threshold value, and powering off the thermoelectric cooling module in response to the processor parameter having a value less than a second threshold value.

Claims (20)

1. A method, comprising:

monitoring a processor parameter selected from processor power consumption and processor temperature;

causing airflow across a passive heat exchanger in thermal communication with the processor and an active cooling device in thermal communication with the processor;

powering on the active cooling device in response to the processor parameter having a value greater than a first threshold value, wherein the active cooling device includes a thermoelectric module having a cold side in thermal communication with the processor, a hot side in thermal communication with a heat sink module, and electrical contacts for receiving electrical power when the active cooling device is powered on; and

powering off the active cooling device in response to the processor parameter having a value less than a second threshold value.

2. The method of claim 1 , wherein the passive heat exchanger includes a plurality of heat sink fins extending from a first area of a heat sink base that is in contact with the processor.

3. The method of claim 2 , wherein the cold side of the thermoelectric module is in contact with a second area of the heat sink base.

4. The method of claim 3 , wherein the heat sink module includes a second heat sink base and a second plurality of heat sink fins extending from the second heat sink base.

5. The method of claim 1 , wherein the first threshold value is greater than the second threshold value.

6. The method of claim 1 , wherein the first threshold value is equal to the second threshold value.

7. The method of claim 1 , wherein the active cooling device is downstream in a direction of the airflow from the passive heat exchanger.

8. The method of claim 1 , further comprising:

a baseboard management controller controlling a speed of a fan causing the airflow and controlling the powering on and powering off of the active cooling device.

9. A non-volatile computer readable storage medium having non-transitory program instructions embodied therewith, the non-transitory program instructions executable by a processor to cause the processor to perform a method comprising:

monitoring a processor parameter selected from processor power consumption and processor temperature;

controlling a speed of a fan to force airflow across a passive heat exchanger in thermal communication with the processor and an active cooling device in thermal communication with the processor;

powering on the active cooling device in response to the processor parameter having a value greater than a first threshold value, wherein the active cooling device includes a thermoelectric module having a cold side in thermal communication with the processor, a hot side in thermal communication with a heat sink module, and electrical contacts for receiving electrical power when the active cooling device is powered on; and

powering off the active cooling device in response to the processor parameter having a value less than a second threshold value.

10. The non-volatile computer readable storage medium of claim 9 , wherein the first threshold value is greater than the second threshold value.

11. The non-volatile computer readable storage medium of claim 9 , wherein the first threshold value is equal to the second threshold value.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 10, 2025
From: LENOVO GLOBAL TECHNOLOGIES INTERNATIONAL LIMITED
To: LENOVO GLOBAL TECHNOLOGIES SWITZERLAND INTERNATIONAL GMBH
Reel/Frame 069869/0614 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 16, 2020
From: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE LTD
To: LENOVO GLOBAL TECHNOLOGIES INTERNATIONAL LTD
Reel/Frame 052952/0127 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 18, 2016
From: MATTESON, JASON A.; STEINKE, MARK E.; VALLURY, APARNA
To: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
Reel/Frame 037761/0148 →