Substrate processing method and substrate processing apparatus
A substrate processing method according to an embodiment is a substrate processing method for drying a substrate. The substrate processing method includes supplying a solution in which a sublimation material is dissolved in a first solvent to a surface of a cleaned substrate. The substrate processing method includes eliminating at least a portion of association states of the sublimation material. The substrate processing method includes precipitating the sublimation material on the surface of the substrate. The substrate processing method includes removing the precipitated sublimation material by sublimation.
1. A substrate processing method for drying a substrate, comprising:
supplying a solution in which a sublimation material is dissolved in a first solvent to a surface of a cleaned substrate;
eliminating at least a portion of association states of the sublimation material;
precipitating the sublimation material on the surface of the substrate; and
removing the precipitated sublimation material by sublimation, wherein
the supplying the solution is performed while the substrate is rotated, and
the eliminating the association states comprises repeatedly increasing and decreasing a rotation acceleration of the substrate to apply a shear force to the solution.
2. The method of claim 1 , wherein the eliminating the association states comprises adding a second solvent different from the first solvent to the solution.
3. The method of claim 1 , wherein the eliminating the association states comprises adding a second solvent different from the first solvent to the solution.
4. The method of claim 1 , wherein the eliminating the association states comprises bringing a vapor of a second solvent different from the first solvent into contact with the solution.
5. The method of claim 1 , wherein the eliminating the association states comprises bringing a vapor of a second solvent different from the first solvent into contact with the solution.
6. The method of claim 2 , wherein the eliminating the association states comprises bringing a vapor of a second solvent different from the first solvent into contact with the solution.
7. The method of claim 1 , wherein a state where the association states have been eliminated is maintained by bringing a vapor of a third solvent capable of dissolving the sublimation material into contact with the solution.
8. The method of claim 1 , wherein a state where the association states have been eliminated is maintained by bringing a vapor of a third solvent capable of dissolving the sublimation material into contact with the solution.
9. The method of claim 2 , wherein a state where the association states have been eliminated is maintained by bringing a vapor of a third solvent capable of dissolving the sublimation material into contact with the solution.
10. The method of claim 1 , further comprising
supplying an inert gas onto the surface of the substrate, wherein
the supplying the inert gas is performed at a flow speed that suppresses a vapor concentration of the first solvent on the surface of the substrate to be less than a predetermined concentration.
11. The method of claim 2 , wherein the eliminating the association states comprises adding water to the solution to change a surface tension of the solution by a range of 1% to 10%.
12. The method of claim 10 , wherein the predetermined concentration is 1200 ppm, and a flow speed of the inert gas is less than 0.8 nals.
13. The method of claim 1 , wherein the surface of the substrate with a convex pattern formed thereon is dried.
14. The method of claim 1 , wherein the eliminating the association states is performed after the supplying of the solution is finished.
15. A substrate processing apparatus comprising:
a first supplier supplying a solution in which a sublimation material is dissolved in a first solvent, to a surface of a cleaned substrate;
an association eliminator eliminating at least a portion of association states of the sublimation material;
a precipitator precipitating the sublimation material on the surface of the substrate; and
a rotator rotating the substrate while holding the substrate horizontally, wherein
the association eliminator comprises a first controller repeatedly increasing and decreasing a rotation acceleration of the rotator to apply a shear force to the solution.
16. The apparatus of claim 15 , wherein the association eliminator comprises a second supplier supplying a second solvent different from the first solvent onto the surface of the substrate.
17. The apparatus of claim 15 , wherein the association eliminator comprises a third supplier supplying a vapor of a second solvent different from the first solvent onto the surface of the substrate.
18. The apparatus of claim 15 , further comprising a fourth supplier supplying a vapor of a third solvent capable of dissolving the sublimation material onto the surface of the substrate.
19. The apparatus of claim 15 , further comprising a fifth supplier supplying an inert gas onto the surface of the substrate, wherein
the fifth supplier supplies the inert gas at a flow speed that suppresses a vapor concentration of the first solvent on the surface of the substrate to be less than a predetermined concentration.
20. The apparatus of claim 15 , wherein the association eliminator eliminates the association states after the supplying of the solution is finished.