Apparatus and method for indirect surface cleaning
View Patent ↗A photomask includes at least one feature disposed thereon. The at least one feature has an associated design location, where a distance between a location of the at least one feature and the associated design location defines a positional error of the at least one feature. A method for improving a performance characteristic of the photomask includes directing electromagnetic radiation toward the photomask, the electromagnetic radiation having a wavelength that substantially coincides with a high absorption coefficient of the photomask; generating a thermal energy increase in the photomask through incidence of the electromagnetic radiation thereon; and decreasing the positional error as a result of the generating the thermal energy increase in the photomask.
1. A wafer fabrication process including a method for improving optical characteristics of a photomask, comprising:
performing a first wafer print process using the photomask and a pellicle disposed across the photomask;
directing electromagnetic radiation through the pellicle toward the photomask, the photomask having a partially-absorbing thin film disposed thereon, the electromagnetic radiation having a wavelength that substantially coincides with a high absorption coefficient of the photomask;
generating a thermal energy increase in the photomask in response to the electromagnetic radiation incident thereon; and
modifying a position of a first feature on the photomask relative to a second feature on the photomask.
2. The method of claim 1 , wherein said modifying includes increasing a distance between the first feature and the second feature.
3. The method of claim 1 , wherein said modifying includes decreasing a distance between the first feature and the second feature.
4. The method of claim 1 , wherein the electromagnetic radiation is further directed toward the thin film, and the electromagnetic radiation has a wavelength that substantially coincides with a high absorption coefficient of the thin film.
5. The method of claim 1 , further comprising performing a second wafer print process using the photomask, the second wafer print process occurring after the optical characteristics of the photomask has been improved by the modification of the position of the first feature on the photomask relative to the second feature on the photomask.
6. The method of claim 1 , wherein the photomask is a next generation photomask configured for use in extreme ultra-violet (EUV) lithography.
7. The method of claim 1 , wherein the thin film disposed on the photomask is patterned and includes void areas under which respective portions of the photomask are exposed.
8. A wafer fabrication process including a method for improving optical characteristics of at least one photomask, comprising:
directing electromagnetic radiation toward the at least one photomask, the electromagnetic radiation having a wavelength that substantially coincides with a high absorption coefficient of the at least one photomask;
generating a thermal energy increase in the at least one photomask in response to the electromagnetic radiation incident thereon;
modifying a position of a first feature on the at least one photomask relative to a second feature on the at least one photomask; and
performing a wafer print process using the at least one photomask after the optical characteristics of the at least one photomask has been improved by the modification of the position of the first feature on the at least one photomask relative to the second feature on the at least one photomask.
9. The method of claim 8 , wherein said modifying includes increasing a distance between the first feature and the second feature.
10. The method of claim 8 , wherein said modifying includes decreasing a distance between the first feature and the second feature.
11. The method of claim 8 , wherein a thin film is disposed on the at least one photomask.
12. The method of claim 11 , wherein the thin film disposed on the at least one photomask is patterned and includes void areas under which respective portions of the at least one photomask are exposed.
13. The method of claim 8 , wherein the at least one photomask is at least partially enclosed within a pellicle, the method further comprising directing the electromagnetic radiation through a pellicle film positioned above the at least one photomask.
14. The method of claim 8 , wherein the at least one photomask is a next generation photomask configured for use in extreme ultra-violet (EUV) lithography.
15. The method of claim 8 , wherein the at least one photomask is a next generation photomask configured for use in nano-imprint lithography.