Polycrystalline diamond compact including a substrate having a convexly-curved interfacial surface bonded to a polycrystalline diamond table, and related applications
View Patent ↗Embodiments of the invention relate to polycrystalline diamond compacts including a substrate having a convexly-curved interfacial surface bonded to a polycrystalline diamond table. In an embodiment, a polycrystalline diamond compact includes a substrate including at least one side surface and a convexly-curved interfacial surface that may, in some embodiments, extend inwardly directly from the at least one side surface to form at least one peripheral edge therebetween. The polycrystalline diamond compact further includes a polycrystalline diamond table bonded to the convexly-curved interfacial surface of the substrate.
1. A polycrystalline diamond compact, comprising:
a substrate including at least one side surface and a convexly-curved interfacial surface, the convexly-curved interfacial surface extending inwardly directly from the at least one side surface of the substrate; and
a polycrystalline diamond table bonded to the convexly-curved interfacial surface of the substrate, the polycrystalline diamond table including:
a plurality of bonded diamond grains defining a plurality of interstitial regions;
a concavely-curved table interfacial surface substantially corresponding to the convexly-curved interfacial surface of the substrate;
an upper surface that is substantially perpendicular;
at least one lateral surface extending between the concavely-curved table interfacial surface and the upper surface;
a first region adjacent to the substrate that includes a metallic infiltrant disposed interstitially between at least a portion of the plurality of bonded diamond grains thereof;
a second region extending inwardly from the upper surface to a depth therein, the plurality of interstitial regions of the second region being substantially free of the metallic infiltrant; and
wherein the polycrystalline diamond table exhibits a ratio of a maximum depth of the second region to a minimum thickness of the polycrystalline diamond table of about 0.30 to about 0.50.
2. The polycrystalline diamond compact of claim 1 wherein the convexly-curved interfacial surface of the substrate exhibits a generally ellipsoidal geometry or generally hemispherical geometry.
3. The polycrystalline diamond compact of claim 1 wherein the convexly-curved interfacial surface of the substrate includes a plurality of grooves extending transversely across the convexly-curved interfacial surface.
4. The polycrystalline diamond compact of claim 3 wherein the plurality of grooves are substantially parallel to each other.
5. The polycrystalline diamond compact of claim 1 wherein the convexly-curved interfacial surface of the substrate includes a plurality of recesses formed therein.
6. The polycrystalline diamond compact of claim 1 wherein the polycrystalline diamond table exhibits a minimum thickness over an uppermost location of the convexly-curved interfacial surface of about 0.0050 inch or more, and the uppermost location is generally centrally located on the polycrystalline diamond table.
7. The polycrystalline diamond compact of claim 1 wherein the metallic infiltrant includes cobalt, iron, nickel, or alloys thereof.
8. The polycrystalline diamond compact of claim 1 wherein the second region is at least partially leached of the metallic infiltrant and exhibits a maximum leach depth that is greater than about 250 μm as measured from the upper surface.
9. The polycrystalline diamond compact of claim 1 wherein the convexly-curved interfacial surface of the substrate exhibits a radius of curvature of about 0.50 inch to about 1.20 inch.
10. A polycrystalline diamond compact, comprising:
a substrate including at least one side surface and a convexly-curved interfacial surface extending inwardly directly from the at least one side surface; and
a polycrystalline diamond table bonded to the convexly-curved interfacial surface at a concavely-curved table interfacial surface substantially corresponding to the convexly-curved interfacial surface, the preformed polycrystalline diamond table including an upper surface generally opposite the table interfacial surface, wherein the upper surface is substantially planar; and
wherein the polycrystalline diamond table exhibits about 30 hits to about 80 hits to failure at about a 50% probability of failure in a 40 J repeating impact test;
wherein the polycrystalline dia1nond table exhibits a maximum thickness of 0.050 inch to about 0.150 inch;
wherein the polycrystalline diamond table exhibits a minimum thickness of 0.0050 inch to about 0.100 inch.
11. The polycrystalline diamond compact of claim 10 wherein the polycrystalline diamond table exhibits about 45 hits to about 55 hits to failure in the repeating impact test.
12. The polycrystalline diamond compact of claim 10 wherein the polycrystalline diamond table exhibits an average diamond grain size of about 18 μm to about 25 μm.
13. The polycrystalline diamond compact of claim 10 wherein the convexly-curved interfacial surface extends inwardly directly from the at least one side surface of the substrate to define at least one peripheral edge between the at least one side surface and the convexly-curved interfacial surface.
14. The polycrystalline diamond compact of claim 10 wherein the convexly-curved interfacial surface of the substrate exhibits a generally elliptical or generally hemispherical geometry.
15. The polycrystalline diamond compact of claim 10 wherein the polycrystalline diamond table is at least partially leached.
16. A rotary drill bit, comprising:
a bit body configured to engage a subterranean formation; and
a plurality of polycrystalline diamond cutting elements affixed to the bit body, at least one of the plurality of polycrystalline diamond cutting elements including:
a substrate including at least one side surface and a convexly-curved interfacial surface, the convexly-curved interfacial surface extending inwardly directly from the at least one side surface of the substrate; and
a polycrystalline diamond table bonded to the convexly-curved interfacial surface at a concavely-curved table interfacial surface substantially corresponding to the convexly-curved interfacial surface, the polycrystalline diamond table including an upper surface generally opposite the concavely-curved table interfacial surface, wherein the upper surface is substantially planar;
wherein the polycrystalline diamond table exhibits a maximum thickness of 0.050 inch to about 0.150 inch;
wherein the polycrystalline diamond table exhibits a minimum thickness of 0.0050 inch to about 0.100 inch;
wherein the at least one of the plurality of polycrystalline diamond cutting elements exhibits about 30 hits to about 80 hits to failure at about a 50% probability of failure in a 40 J repeating impact test.