Electronic device provided with an integrated conductor element and fabrication method
An electronic device includes a support plate having a mounting face and an electrical connection network. An integrated circuit chip is mounted on the mounting face and linked to the electrical connection network. An en encapsulation block embeds the integrated circuit chip. An additional element made of an electrically conductive material is at least partly embedded within the encapsulation block. The additional conductive element has a main portion extending parallel to the support plate and has a secondary portion that is linked electrically to the integrated circuit chip. An opening is formed in the encapsulation block, and the secondary portion extends into that opening to make the electrical link. The additional conductive element may be an antenna.
1. An electronic device, comprising:
a support plate having a mounting face and including an electrical connection network;
an integrated circuit chip mounted on said mounting face of the support plate and linked to said electrical connection network;
an encapsulation block embedding the integrated circuit chip, said encapsulation block extending over the integrated circuit chip and around the integrated circuit chip on said mounting face of the support plate, the encapsulation block having a through hole exposing an electrical contact; and
a conductive element made of an electrically conductive material and at least partly carried by in said encapsulation block, said conductive element having a main portion extending parallel to said support plate and having a secondary portion folded back towards the support plate relative to said main portion and extending into the through hole of the encapsulation block and linked electrically to said electrical contact.
2. The device according to claim 1 , wherein said through hole exposes said mounting face of said support place and said electrical contact is formed on said mounting face of said support plate at a distance from a periphery of the integrated circuit chip.
3. The device according to claim 1 , wherein said through hole exposes a front face of said integrated circuit chip and said electrical contact is formed on said front face of said integrated circuit chip.
4. The device according to claim 1 , wherein a soldering material is interposed between said secondary portion of said conductive element and said electrical contact.
5. The device according to claim 1 , wherein the encapsulation block includes a cavity at least partially revealing said main portion of said conductive element.
6. The device according to claim 1 , wherein said main portion of said conductive element extends over and at a distance from the integrated circuit chip.
7. The device according to claim 1 , wherein said conductive element is a radiofrequency antenna.
8. The device according to claim 1 , further including an additional encapsulation block extending over said encapsulation block, wherein material of said additional encapsulation block fills said through hole, and wherein said conductive element extends between said encapsulation block and said additional encapsulation block.
9. The device according to claim 1 , wherein said encapsulation block includes a groove and the main portion of said conductive element extends within said groove.
10. An electronic device, comprising:
a primary electronic device comprising a support plate and an integrated circuit chip mounted on a mounting face of the support plate;
a primary encapsulation block in contact with and encapsulating said primary electronic device, the primary encapsulation block having a front face parallel to the support plate;
wherein the primary encapsulation block includes a hole extending into the primary encapsulation block from said front face to reach an electrical contact;
a conductive element positioned such that a main portion of the conductive element extends over the front face of the primary encapsulation block and a secondary portion of the conductive element extends into said hole and is electrically connected to said electrical contact; and
an additional encapsulation block in contact with the primary encapsulation block and wherein material of said additional encapsulation block fills said hole and encapsulates around the secondary portion of the conductive element.
11. The device of claim 10 , wherein said electrical contact is located on said mounting face of said support plate.
12. The device of claim 10 , wherein said electrical contact is located on a face of the integrated circuit chip.
13. The device of claim 10 , wherein said secondary portion is folded back relative to said main portion.
14. The device of claim 10 , further comprising a solder material for electrically connecting the conductive element to said electrical contact.
15. The device of claim 10 , wherein the front face of the primary encapsulation block includes a groove, and wherein said main portion of said conductive element in located in said groove.
16. The device of claim 10 , wherein said conductive element is bonded on the front face of the primary encapsulation block.
17. The device of claim 10 , wherein the additional encapsulation block includes a void that at least partially reveals said main portion of said conductive element.
18. An electronic device, comprising:
a support plate having a mounting face with an electrical contact and including an electrical connection network connected to said electrical contact;
an integrated circuit chip having a first face mounted on said mounting face of the support plate and linked to said electrical connection network;
an encapsulation block embedding the integrated circuit chip, said encapsulation block extending over the integrated circuit chip and around the integrated circuit chip on said mounting face of the support plate, the encapsulation block having a through hole exposing the electrical contact at the mounting face of the support plate;
a conductive element made of an electrically conductive material and at least partly carried by said encapsulation block, said conductive element having a main portion extending parallel to said support plate and having a secondary portion extending into said through hole; and
a soldering material interposed between said secondary portion of said conductive element and said electrical contact.
19. The device according to claim 18 , wherein the encapsulation block includes a cavity at least partially revealing said main portion of said conductive element.
20. The device according to claim 18 , wherein said main portion of said conductive element extends over and at a distance from the integrated circuit chip.
21. The device according to claim 18 , wherein said conductive element is a radiofrequency antenna.
22. The device according to claim 18 , further including an additional encapsulation block extending over said encapsulation block, wherein material of said additional encapsulation block fills said through hole, and wherein said conductive element extends between said encapsulation block and said additional encapsulation block.
23. The device according to claim 18 , wherein said encapsulation block includes a groove and the main portion of said conductive element extends within said groove.
24. An electronic device, comprising:
a support plate having a mounting face and including an electrical connection network;
an integrated circuit chip having a first face mounted on said mounting face of the support plate and linked to said electrical connection network and a second face with an electrical contact;
an encapsulation block embedding the integrated circuit chip, said encapsulation block extending over the integrated circuit chip and around the integrated circuit chip on said mounting face of the support plate, the encapsulation block having a through hole exposing the electrical contact at the second face of the integrated circuit chip;
a conductive element made of an electrically conductive material and at least partly carried by said encapsulation block, said conductive element having a main portion extending parallel to said support plate and having a secondary portion extending into said through hole; and
a soldering material interposed between said secondary portion of said conductive element and said electrical contact.
25. The device according to claim 24 , wherein the encapsulation block includes a cavity at least partially revealing said main portion of said conductive element.
26. The device according to claim 24 , wherein said main portion of said conductive element extends over and at a distance from the integrated circuit chip.
27. The device according to claim 24 , wherein said conductive element is a radiofrequency antenna.
28. The device according to claim 24 , further including an additional encapsulation block extending over said encapsulation block, wherein material of said additional encapsulation block fills said through hole, and wherein said conductive element extends between said encapsulation block and said additional encapsulation block.
29. The device according to claim 24 , wherein said encapsulation block includes a groove and the main portion of said conductive element extends within said groove.
30. An electronic device, comprising:
a support plate having a mounting face and including an electrical connection network;
an integrated circuit chip mounted on said mounting face of the support plate and linked to said electrical connection network;
an encapsulation block embedding the integrated circuit chip, said encapsulation block extending over the integrated circuit chip and around the integrated circuit chip on said mounting face of the support plate, the encapsulation block having a through hole exposing part of the mounting face of the support plate; and
a conductive element made of an electrically conductive material and at least partly embedded in said encapsulation block, said conductive element having a main portion extending parallel to said support plate and having a secondary portion extending into the through hole of the encapsulation block and linked electrically to said integrated circuit chip.
31. The device according to claim 30 , wherein said secondary portion of the conductive element is linked to an electrical contact exposed by said through hole and formed on said mounting face of said support plate at a distance from a periphery of the integrated circuit chip.
32. The device according to claim 30 , wherein said secondary portion of said conductive element is folded back towards the support plate relative to said main portion.
33. The device according to claim 30 , wherein the encapsulation block includes a cavity at least partially revealing said main portion of said conductive element.
34. The device according to claim 30 , wherein said main portion of said conductive element extends over and at a distance from the integrated circuit chip.
35. The device according to claim 30 , wherein said conductive element is a radiofrequency antenna.
36. The device according to claim 30 , wherein said encapsulation block comprises two superposed parts between which said conductive element extends.
37. The device according to claim 30 , wherein said encapsulation block includes a groove and the main portion of said conductive element extends within said groove.