Electronic device provided with an integral conductive wire and method of manufacture
An electronic device includes a supporting substrate having a front mounting face and an electrical connection network. An integrated circuit chip is mounted to the mounting face and is electrically connected to the electrical connection network. A primary encapsulation block embeds the integrated circuit chip and extends above and around the integrated circuit chip on the mounting face of the supporting substrate. An opening is provided in the primary encapsulation block to at least partially uncover an electrical contact. An additional wire made from an electrically conductive material has an end that is electrically connected to the electrical contact. An additional encapsulation block above the primary encapsulation block embeds the additional wire.
1. An electronic device, comprising:
a supporting substrate having a mounting face and including an electrical connection network,
an integrated circuit chip mounted on said mounting face of the supporting substrate and electrically connected to said electrical connection network,
an encapsulation block including a primary encapsulation block in which the integrated circuit chip is embedded and which extends above and around the integrated circuit chip on said mounting face of the supporting substrate and an additional encapsulation block above the primary encapsulation block; and
a wire made from an electrically conductive material, the wire being self-supportable above the integrated circuit chip and the primary encapsulation block and embedded in said additional encapsulation block, said wire being electrically connected to at least one of said integrated circuit chip and said electrical connection network.
2. The device according to claim 1 , wherein one end of the wire is connected to an electrical contact on said mounting face of said supporting substrate at a distance from the periphery of the integrated circuit chip.
3. The device according to claim 1 , wherein one end of the wire is connected to at least one electrical contact on a front face of said integrated circuit chip.
4. The device according to claim 1 , further including a pillar above an electrical contact on said mounting face of said supporting substrate, said pillar extending through said primary encapsulation block, wherein one end of the wire is fixed to said pillar.
5. The device according to claim 1 , wherein one end of said wire is fixed to an upper surface of the primary encapsulation block.
6. The device according to claim 1 , wherein said wire is a radio antenna.
7. The device according to claim 1 , wherein said wire is an electrical connection.
8. The device according to claim 1 , wherein the wire is a bonding wire.
9. An electronic device, comprising:
a supporting substrate having a mounting face and including an electrical connection network,
an integrated circuit chip mounted on said mounting face of the supporting substrate and electrically connected to said electrical connection network,
an encapsulation block including a primary encapsulation block in which the integrated circuit chip is embedded and which extends above and around the integrated circuit chip on said mounting face of the supporting substrate and an additional encapsulation block above the primary encapsulation block; and
a wire made from an electrically conductive material embedded in said additional encapsulation block, said wire being electrically connected to at least one of said integrated circuit chip and said electrical connection network; and
a pillar above an electrical contact on a front face of said integrated circuit chip, said pillar extending through said primary encapsulation block, wherein one end of said wire is fixed to this pillar.
10. The device according to claim 9 , wherein one end of the wire is connected to an electrical contact on said mounting face of said supporting substrate at a distance from the periphery of the integrated circuit chip.
11. The device according to claim 9 , wherein one end of the wire is connected to at least one electrical contact on a front face of said integrated circuit chip.
12. The device according to claim 9 , further including a pillar above an electrical contact on said mounting face of said supporting substrate, said pillar extending through said primary encapsulation block, wherein one end of the wire is fixed to said pillar.
13. An electronic device, comprising:
a primary encapsulation block embedding integrated circuit chip, said primary encapsulation block including an opening that at least partially uncovers an electrical contact;
an electrically conductive wire self-supportable above the integrated circuit chip and the primary encapsulation block and positioned such that one end of the electrically conductive wire is electrically connected to said electrical contact; and
an additional encapsulation block on said primary encapsulation block, the additional encapsulation block embedding the electrically conductive wire.
14. The device of claim 13 , further comprising a conductive pillar filling said opening, the one end of the electrically conductive wire making contact with said conductive pillar.
15. The device of claim 13 , wherein said electrical contact is a contact on the integrated circuit chip.
16. The device of claim 13 , wherein said electrical contact is a contact on a support substrate, said integrated circuit chip mounted to said support substrate.
17. The device of claim 13 , wherein said electrically conductive wire is an antenna.
18. An electronic device, comprising:
a primary encapsulation block embedding integrated circuit chip, said primary encapsulation block including an opening that at least partially uncovers an electrical contact;
an electrically conductive wire above the primary encapsulation block and positioned such that one end of the electrically conductive wire is electrically connected to said electrical contact; and
an additional encapsulation block on said primary encapsulation block, the additional encapsulation block embedding the electrically conductive wire, wherein material of said additional encapsulation block fills said opening, the one end of the electrically conductive wire extending into said opening.
19. The device of claim 18 , further comprising a conductive pillar filling said opening, the one end of the electrically conductive wire making contact with said conductive pillar.
20. The device of claim 18 , wherein said electrical contact is a contact on the integrated circuit chip.
21. The device of claim 18 , wherein said electrical contact is a contact on a support substrate, said integrated circuit chip mounted to said support substrate.
22. An electronic device, comprising:
a supporting substrate having a mounting face and including an electrical connection network;
an integrated circuit chip having a surface including a plurality of electrical connection elements, said integrated circuit chip mounted to the supporting substrate with said surface facing the mounting face and said electrical connection elements connected to said electrical connection network;
a primary encapsulation block in which the integrated circuit chip is embedded and which extends above and around the integrated circuit chip on said mounting face of the supporting substrate;
a wire made from an electrically conductive material and having a curved shape in a plane perpendicular to the mounting face, wherein at least one end of said wire is electrically coupled to the electrical connection network; and
an additional encapsulation block above the primary encapsulation block and within which the wire is embedded.
23. The device of claim 22 , wherein said primary encapsulation block includes an opening and said at least one end of said wire passes through said opening to make physical and electrical contact with the electrical connection network.
24. The device of claim 23 , wherein said additional encapsulation block further fills said opening.
25. The device of claim 22 , wherein said primary encapsulation block includes an opening and further including a pillar of electrically conductive material filling said opening and said at least one end of said wire is in physical and electrical contact with a top of said pillar.
26. The device of claim 22 , wherein said wire forms an antenna.
27. An electronic device, comprising:
a supporting substrate having a mounting face and including an electrical connection network;
an integrated circuit chip having a first surface including a plurality of electrical connection elements and a second surface, opposite said first surface, including an electrical contact, said integrated circuit chip mounted to the supporting substrate with said first surface facing the mounting face and said electrical connection elements connected to said electrical connection network;
a primary encapsulation block in which the integrated circuit chip is embedded and which extends above and around the integrated circuit chip on said mounting face of the supporting substrate;
a wire made from an electrically conductive material and having a curved shape in a plane perpendicular to the mounting face, wherein at least one end of said wire is electrically coupled to the electrical contact; and
an additional encapsulation block above the primary encapsulation block and within which the wire is embedded.
28. The device of claim 27 , wherein said primary encapsulation block includes an opening and further including a pillar of electrically conductive material filling said opening and said at least one end of said wire is in physical and electrical contact with a top of said pillar.
29. The device of claim 27 , wherein said wire forms an antenna.