IP Library Granted Patent US 9,960,852
Granted Patent B2
US 9,960,852 · App. 15/050,492 · Granted May 1, 2018

Device for data transmission

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,960,852
App. No.
15/050,492
Granted
May 1, 2018
Kind
B2
Abstract

Devices are provided including an SFP interface and a further interface for wire-based data transmission. A conversion circuit converts between SFP interface signals and wire-based interface signals. The interfaces and the conversion circuit may be, but need not be, provided on a same circuit board.

Claims (30)

1. A device, comprising:

an SFP interface, and

a wire-based interface for wire-based data transmission, the wire-based interface comprising:

an Ethernet interface; and

a digital subscriber line (DSL) interface;

wherein the Ethernet interface is allocated to a data link layer and the DSL interface is allocated to a physical layer; and

a conversion circuit for converting signals between an SFP interface and the wire-based interface.

2. The device according to claim 1 , the DSL interface comprising an xDSL interface.

3. The device according to claim 2 , wherein xDSL is one of VDSL2, SHDSL or G.fast.

4. The device according to claim 1 , the interfaces and the conversion circuit being arranged on a single circuit board.

5. The device according to claim 4 , the shape of the device adjacently to the SFP interface being selected in such a manner that it can be inserted into an SFP plug-in location.

6. The device according to claim 5 , the device being arranged in a corresponding housing.

7. The device according to claim 1 , the conversion circuit comprising conventional semiconductor components.

8. The device according to claim 1 , the conversion circuit comprising an SGMII interface circuit which provides signals for the SFP interface.

9. The device according to claim 1 , the conversion circuit comprising an xDSL chip.

10. The device according to claim 9 , the conversion circuit comprising a memory for the xDSL chip.

11. The device according to claim 9 , xDSL being VDSL2, SHDSL or G.fast.

12. The device according to claim 1 , the SFP interface comprising conductor tracks on a circuit board which form a male connector.

13. The device according to claim 4 , wherein the circuit board has a smaller width at the SFP interface than at the wire-based interface.

14. A device, comprising:

a printed circuit board having a relatively smaller width portion and a relatively larger width portion,

an SFP interface arranged on the circuit board at the relatively smaller width portion, and

a wire-based interface arranged on the circuit board at the relatively lager width portion for wire-based data transmission, the wire-based interface comprising:

an Ethernet interface; and

a digital subscriber line (DSL) interface; wherein the Ethernet interface is allocated to a data link layer and the DSL interface is allocated to a physical layer; and

a conversion circuit for converting signals arranged on the circuit board between an SFP interface and the wire-based interface.

15. The device according to claim 14 , the interface comprising an xDSL interface.

16. The device according to claim 14 , the circuit board being a single circuit board.

17. The device according to claim 14 , the width of the relatively smaller width portion being such that it can be inserted into an SFP plug-in location.

18. The device according to claim 14 , the SFP interface comprising conductor tracks on the circuit board which form a male SFP connector.

Assignments (1)
CHANGE OF NAME Recorded Apr 6, 2022
From: LANTIQ BETEILIGUNGS-GMBH & CO. KG
To: INTEL GERMANY GMBH & CO. KG
Reel/Frame 059645/0263 →