Semiconductor bump-bonded X-ray imaging device
View Patent ↗A high pixel density intraoral x-ray imaging sensor includes a direct conversion, fully depleted silicon detector bump bonded to a readout CMOS substrate by cu-pillar bump bonds.
1. An x-ray imaging device comprising:
a direct conversion detector substrate having detector pixels for collecting electronic signals generated in response to incident radiation;
a readout substrate having readout pixels for receiving said electronic signals; and
bump bonds connecting said detector pixels and readout pixels, each bump bond comprising a rigid pillar portion in the form of a rigid bump leg ( 8 ) and a bump pedestal layer ( 7 ) on the bump leg ( 8 ), the bump pedestal layer ( 7 ) having a width of 19.5 micrometers or less,
wherein said detector pixels comprises an under bump metal bulk layer ( 4 ).
2. The x-ray imaging device of claim 1 , wherein, said under bump metal bulk layer ( 4 ) has a diameter (d) in a range from 2.4 micrometers to 24 micrometers.
3. The x-ray imaging device of claim 2 , wherein said under bump metal bulk layer ( 4 ) has a thickness in a range from 68 nanometers to 510 nanomenters.
4. The x-ray imaging device of claim 3 , wherein said under bump metal bulk layer ( 4 ) comprises nickel (Ni).
5. The x-ray imaging device of claim 2 , wherein said under bump metal bulk layer ( 4 ) comprises nickel (Ni).
6. The x-ray imaging device of claim 1 , wherein said under bump metal bulk layer ( 4 ) has a thickness in a range from 68 nanometers to 510 nanomenters.
7. The x-ray imaging device of claim 6 , wherein said under bump metal bulk layer ( 4 ) comprises nickel (Ni).
8. The x-ray imaging device of claim 1 , wherein said under bump metal bulk layer ( 4 ) comprises nickel (Ni).
9. The x-ray imaging device of claim 1 , wherein said rigid bump legs ( 8 ) have an average height of 5 micrometers or more, and said bump bonds further comprise bump solder hats ( 6 ) positioned on top of the rigid bump legs, an average post bonding height of the solder hats ( 6 ) being less than 6.5 micrometers.
10. An x-ray imaging device comprising:
a direct conversion detector substrate having detector pixels for collecting electronic signals generated in response to incident radiation;
a readout substrate having readout pixels for receiving said electronic signals; and
bump bonds connecting said detector pixels and readout pixels, each bump bond comprising a rigid pillar portion in the form of a rigid bump leg ( 8 ) and a bump pedestal layer ( 7 ) on the bump leg ( 8 ), the bump pedestal layer ( 7 ) having a width of 19.5 micrometers or less,
wherein said detector pixels comprise an under bump metal solderpad ( 5 ).
11. The x-ray imaging device of claim 10 , wherein said under bump metal solderpad layer ( 5 ) has a diameter (c) in a range from 2.6 micrometers to 25.5 micrometers.
12. The x-ray imaging device of claim 11 , wherein said under bump metal solderpad ( 5 ) has a thickness in a range from 20 nanometers to 150 nanometers.
13. The x-ray imaging device of claim 12 , wherein said under bump metal solderpad ( 5 ) comprises gold (Au).
14. The x-ray imaging device of claim 13 , wherein said rigid bump legs ( 8 ) have an average height of 5 micrometers or more, and said bump bonds further comprise bump solder hats ( 6 ) positioned on top of the rigid bump legs, an average post bonding height of the solder hats ( 6 ) being less than 6.5 micrometers.
15. The x-ray imaging device of claim 11 , wherein said under bump metal solderpad ( 5 ) comprises gold (Au).
16. The x-ray imaging device of claim 11 , wherein said rigid bump legs ( 8 ) have an average height of 5 micrometers or more, and said bump bonds further comprise bump solder hats ( 6 ) positioned on top of the rigid bump legs, an average post bonding height of the solder hats ( 6 ) being less than 6.5 micrometers.
17. The x-ray imaging device of claim 10 , wherein said under bump metal solderpad ( 5 ) has a thickness in a range from 20 nanometers to 150 nanometers.
18. The x-ray imaging device of claim 17 , wherein said rigid bump legs ( 8 ) have an average height of 5 micrometers or more, and said bump bonds further comprise bump solder hats ( 6 ) positioned on top of the rigid bump legs, an average post bonding height of the solder hats ( 6 ) being less than 6.5 micrometers.
19. The x-ray imaging device of claim 10 , wherein said under bump metal solderpad ( 5 ) comprises gold (Au).
20. The x-ray imaging device of claim 10 , wherein said rigid bump legs ( 8 ) have an average height of 5 micrometers or more, and said bump bonds further comprise bump solder hats ( 6 ) positioned on top of the rigid bump legs, an average post bonding height of the solder hats ( 6 ) being less than 6.5 micrometers.