Method of manufacturing semiconductor device
View Patent ↗According to an embodiment, a method of manufacturing a semiconductor device includes forming a first opening that extends from a second surface of a semiconductor substrate opposite to a first surface toward the first surface and extending to a first insulating layer in the semiconductor substrate, performing a first annealing process in a first gas atmosphere that contains hydrogen after formation of the first opening, forming a second insulating layer on a side wall of the semiconductor substrate in the first opening, performing a second annealing process after formation of the second insulating layer, forming a second opening that extends to the conductive layer in the first insulating layer through the first opening, and forming a via that is connected to the conductive layer in the first and second openings.
1. A method of manufacturing a semiconductor device, comprising:
forming a first insulating layer on a first surface of a semiconductor substrate comprising silicon;
forming a conductive layer on the first insulating layer;
forming a first opening that extends from a second surface of the semiconductor substrate opposite to the first surface toward the first surface, the first opening extending in the semiconductor substrate to the first insulating layer;
performing a first annealing process in a first gas atmosphere that contains hydrogen after formation of the first opening;
forming a second insulating layer on a side wall of the semiconductor substrate in the first opening;
performing a second annealing process after formation of the second insulating layer;
forming a second opening that extends in the first insulating layer to the conductive layer through the first opening; and
forming a through-via in the first and second openings that is connected to the conductive layer.
2. The method according to claim 1 ,
wherein the second annealing process is performed in a second gas atmosphere that contains hydrogen.
3. The method according to claim 2 ,
wherein a first hydrogen region is formed in the semiconductor substrate by the first annealing process.
4. The method according to claim 2 ,
wherein the first and second annealing processes are performed using a hydrogen radical or deuterium.
5. The method according to claim 4 ,
wherein a first hydrogen region is formed in the semiconductor substrate by the first annealing process.
6. The method according to claim 1 ,
wherein a first hydrogen region is formed in the semiconductor substrate by the first annealing process.
7. The method according to claim 1 ,
wherein the through-via has a width dimension at the second surface that is equal to or greater than a width dimension of the second opening.
8. A method of manufacturing a semiconductor device, comprising:
forming a first insulating layer on a first surface of a semiconductor substrate comprising silicon;
forming a conductive layer on the first insulating layer;
forming a first opening in the semiconductor substrate, the first opening extending from a second surface of the semiconductor substrate that is opposite the first surface, toward the first surface to reach the first insulating layer;
forming a second insulating layer on a side wall of the first opening in the semiconductor substrate;
performing an annealing process after formation of the second insulating layer;
forming a second opening, which extends to the conductive layer, in the first insulating layer through the first opening; and
forming a through-via in the first and second openings which is connected to the conductive layer.
9. The method according to claim 8 , further comprising:
performing an annealing process in an atmosphere that contains hydrogen after formation of the first opening.
10. The method according to claim 8 ,
wherein the annealing process is performed using a hydrogen radical or deuterium.
11. The method according to claim 8 ,
wherein a first hydrogen region is formed in the side wall of the first opening in semiconductor substrate by the first annealing process.
12. The method according to claim 8 ,
wherein the through-via has a width dimension at the second surface which is equal to or greater than a width dimension at the first opening.