Mass transfer tool manipulator assembly
Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices.
1. A method comprising:
moving a mass transfer tool manipulator assembly toward a carrier substrate;
contacting an array of micro devices on the carrier substrate with an array of electrostatic transfer heads coupled with a pivot platform of the mass transfer tool manipulator assembly;
sensing deformation of a compliant element coupled with the pivot platform;
stopping relative movement between the mass transfer tool manipulator assembly and the carrier substrate;
applying a voltage to the array of electrostatic transfer heads to create a grip pressure on the array of micro devices; and
picking up the array of micro devices from the carrier substrate.
2. The method of claim 1 , wherein sensing deformation comprises sensing strain in a displacement sensor integrated with the compliant element.
3. The method of claim 1 , further comprising adjusting a position of a base coupled with the compliant element after sensing deformation and before stopping relative movement.
4. The method of claim 1 , wherein adjusting the position comprises actuating an actuator assembly of the mass transfer tool manipulator assembly, the actuator assembly coupled to the base, to further align the base to a plane of the carrier substrate by tipping or tilting the base after sensing deformation.
5. The method of claim 1 , further comprising applying heat to the array of electrostatic transfer heads while picking up the array of micro devices.
6. A method comprising:
moving a mass transfer tool manipulator assembly toward a receiving substrate;
contacting the receiving substrate with an array of micro devices carried by an array of electrostatic transfer heads coupled with a pivot platform of the mass transfer tool manipulator assembly;
sensing deformation of a compliant element coupled with the pivot platform;
stopping relative movement between the mass transfer tool manipulator assembly and the receiving substrate;
removing a voltage from the array of electrostatic transfer heads; and
releasing the array of micro devices onto the receiving substrate.
7. The method of claim 6 , wherein sensing deformation comprises sensing strain in a displacement sensor integrated with the compliant element.
8. The method of claim 6 , further comprising adjusting a position of a base coupled with the compliant element after sensing deformation and before stopping relative movement.
9. The method of claim 8 , wherein adjusting the position comprises actuating an actuator assembly of the mass transfer tool manipulator assembly, the actuator assembly coupled to the base, to further align the base to a plane of the receiving substrate by tipping or tilting the base after sensing deformation.
10. The method of claim 6 , further comprising applying heat to the array of electrostatic transfer heads before removing the voltage.