Modular antennas with heat sinks in wireless power transmission systems
A wireless power transmission system includes a transmitter configured to transmit power waves including printed circuit boards where a printed circuit board and antenna boards, where each antenna board comprises one or more antenna elements, at least one antenna board resides on a printed circuit board, and the at least one antenna board is connected with a power feeding line. The transmitter further includes a heat sink attached to the at least one printed circuit board, wherein placement of the heat sink with respect to the at least one antenna board comprising the one or more antenna elements and shape of the heat sink is configured such that the heat sink operates as a reflector to direct wireless power waves transmitted from the at least one antenna board in a pre-determined direction.
1. A transmitter in a wireless power transmission system, the transmitter comprising:
a transmitter board with opposing first and second surfaces, the transmitter board comprising one or more electrical ports on the first surface, each of the one or more electrical ports being configured to receive electrical signals from the transmitter board and provide the electrical signals to an antenna board;
one or more antenna boards, each antenna board comprising antenna elements configured to transmit radio frequency (RF) power waves to a receiver using the electrical signals from a respective electrical port of the one or more electrical ports, wherein:
each of the one or more antenna boards is configured to removably connect to any one of the one or more electrical ports of the transmitter board; and
the receiver is configured to convert the received RF power waves into usable energy to power and/or charge an electronic device; and
a heat sink attached to the first surface of the transmitter board, the heat sink being configured to:
absorb heat generated by the transmitter board, and
reflect at least some of the RF power waves transmitted by the one or more antenna boards in a pre-determined direction.
2. The transmitter according to claim 1 , wherein placement of the heat sink in relation to a respective antenna board of the one or more antenna boards is selected such that the heat sink reflects the RF power waves transmitted by respective antenna elements of the respective antenna board in the pre-determined direction.
3. The transmitter according to claim 1 , wherein the heat sink is U-shaped.
4. The transmitter according to claim 1 , wherein a shape of the heat sink is substantially parabolic.
5. The transmitter according to claim 1 , wherein a shape of the heat sink is configured to enable high radiation gain of respective antenna elements of any of the one or more antenna boards.
6. The transmitter according to claim 1 , wherein:
the antenna elements of a respective antenna board of the one or more antenna boards are made of ceramic, and
the ceramic is alumina.
7. The transmitter according to claim 1 , wherein:
respective antenna elements of a respective antenna board of the one or more antenna boards are patch antennas configured to radiate the RF power waves.
8. The transmitter according to claim 1 , wherein the one or more antenna boards and the heat sink are positioned on opposite sides of the first surface.
9. The transmitter according to claim 1 , further comprising a casting of a dielectric embedding respective antenna elements of a respective antenna board of the one or more antenna boards, wherein the casting of the dielectric is silicon.
10. The transmitter according to claim 1 , wherein the receiver is embedded in the electronic device.
11. The transmitter according to claim 1 , wherein:
respective antenna elements of a respective antenna board of the one or more antenna boards are configured to operate in a frequency band of 5.8 GHz.
12. The transmitter according to claim 1 , wherein the transmitter board comprises a processor configured to determine when a respective antenna board of the one or more antenna boards is connected to a respective electrical port of the plurality of electrical ports.
13. The transmitter according to claim 12 , wherein the processor is configured to control transmission of the RF power waves by the respective antenna board connected to the respective electrical port.
14. The transmitter according to claim 1 , wherein a radio frequency integrated circuit is connected to a respective antenna board of the one or more antenna boards.
15. A method comprising:
providing a transmitter board with opposing first and second surfaces, the transmitter board comprising one or more electrical ports, each of the one or more electrical ports being configured to receive electrical signals from the transmitter board and provide the electrical signals to an antenna board,
detachably connecting a first antenna board to a first electrical port of the one or more electrical ports, wherein the first antenna board comprises antenna elements configured to transmit radio frequency (RF) power waves to a receiver using electrical signals received via the first electrical port, and
transmitting, by respective antenna elements of the first antenna board, RF power waves to the receiver using the electrical signals, wherein the receiver converts the received RF power waves into usable energy to power and/or charge an electronic device; and
reflecting, by a heat sink attached to the first surface of the transmitter board at least some of the RF power waves transmitted by respective antenna elements of the first antenna board in a pre-determined direction.
16. The method according to claim 15 , wherein placement of the heat sink in relation to the first antenna board is selected such that the heat sink reflects the RF power waves transmitted by the respective antenna elements of the first antenna board in the pre-determined direction.
17. The method according to claim 15 , wherein:
the respective antenna elements of the first antenna board have a mutual coupling among them, and
the mutual coupling is inductive or capacitive coupling between the one or more antenna elements.
18. The method according to claim 15 , wherein the first antenna board and the heat sink are positioned on opposite sides of the first surface.
19. The method according to claim 15 , wherein the heat sink is substantially U-shaped.
20. The method according to claim 15 , wherein the heat sink has a substantially parabolic shape.
21. The method according to claim 15 , wherein:
the height of at least one antenna element of the respective antenna elements of the first antenna board is from about ⅛ inches to about 1 inch,
the width of the at least one antenna element is from about ⅛ inches to about 1 inch, and
the distance between two adjacent antenna elements of the respective antenna elements is between about 1/12 Lambda to about 1 Lambda.
22. The method according to claim 15 , wherein the transmitter board includes a communications component and/or one or more sensors configured to obtain information indicating a location of the receiver.
23. The method according to claim 22 , further comprising, before transmitting the RF power waves:
determining that the receiver is located within a transmission field based on the information obtained by the communications component and/or the one or more sensors; and
instructing the transmitter board to provide, via the first electrical port, the electrical signals to the first antenna board after determining that the receiver is located within the transmission field.