Semiconductor device and method for manufacturing the same
According to one embodiment, the first separation film separates the control electrode, the first insulating layer, the charge storage layer, the intermediate insulating layer, the floating electrode layer, and the second insulating layer in a first direction. The second separation film separates a first stacked unit in a second direction. The first stacked unit includes the charge storage layer, the intermediate insulating layer, the floating electrode layer, the second insulating layer, and the semiconductor layer. The second direction intersects the first direction. The second separation film contains silicon.
1. A semiconductor device, comprising:
a control electrode extending a first direction;
a first insulating layer provided on the control electrode, the first insulating layer containing a metal oxide;
a charge storage layer provided on the first insulating layer;
an intermediate insulating layer provided on the charge storage layer;
a floating electrode layer provided on the intermediate insulating layer;
a second insulating layer provided on the floating electrode layer;
a semiconductor layer provided on the second insulating layer;
a first separation film separating the control electrode, the first insulating layer, the charge storage layer, the intermediate insulating layer, the floating electrode layer, and the second insulating layer in the first direction; and
a second separation film separating a first stacked unit in a second direction, the first stacked unit including the charge storage layer, the intermediate insulating layer, the floating electrode layer, the second insulating layer, and the semiconductor layer, the second direction intersecting the first direction, the second separation film containing silicon,
the semiconductor layer containing an n-type impurity and a p-type impurity, and
a concentration of the p-type impurity having a peak on the second insulating layer side of a center position in a thickness direction of the semiconductor layer.
2. The device according to claim 1 , further comprising an interconnect layer provided on the semiconductor layer and on the first separation film, the interconnect layer contacting the semiconductor layer and extending in the first direction.
3. The device according to claim 2 , wherein the interconnect layer is a silicon layer.
4. The device according to claim 1 , wherein a dielectric constant of the first insulating layer is 9 or more.
5. The device according to claim 1 , wherein the first insulating layer contains at least one of aluminum, hafnium, tantalum, zirconium, and lanthanum.
6. The device according to claim 1 , wherein the semiconductor layer is a silicon layer.
7. The device according to claim 6 , wherein the n-type impurity is phosphorus, and the p-type impurity is boron.
8. The device according to claim 7 , wherein a concentration of the n-type impurity is not more than 1×10 18 (atom/cm 3 ).
9. The device according to claim 1 , further comprising a substrate and a third insulating layer provided between the substrate and the control electrode.
10. The device according to claim 1 , wherein the charge storage layer contains a metal oxide.
11. The device according to claim 1 , wherein the control electrode includes a first metal nitride layer, a second metal nitride layer, and a metal layer provided between the first metal nitride layer and the second metal nitride layer.
12. The device according to claim 1 , wherein
the intermediate insulating layer is a silicon nitride layer,
the floating electrode layer is a silicon layer, and
the second insulating layer is a silicon oxide layer.
13. A semiconductor device, comprising:
a control electrode extending a first direction;
a first insulating layer provided on the control electrode, the first insulating layer containing a metal oxide;
a charge storage layer provided on the first insulating layer;
an intermediate insulating layer provided on the charge storage layer;
a floating electrode layer provided on the intermediate insulating layer;
a second insulating layer provided on the floating electrode layer;
a semiconductor layer provided on the second insulating layer;
a first separation film separating the control electrode, the first insulating layer, the charge storage layer, the intermediate insulating layer, the floating electrode layer, and the second insulating layer in the first direction; and
a second separation film separating a first stacked unit in a second direction, the first stacked unit including the charge storage layer, the intermediate insulating layer, the floating electrode layer, the second insulating layer, and the semiconductor layer, the second direction intersecting the first direction, the second separation film containing silicon,
the semiconductor layer containing an n-type impurity and a p-type impurity,
a concentration of the p-type impurity being higher than a concentration of the n-type impurity on the second insulating layer side of a center position in a thickness direction of the semiconductor layer, and
the concentration of the p-side impurity being lower than the concentration of the n-type impurity on the semiconductor layer front surface side of the center position in the thickness direction of the semiconductor layer.
14. The device according to claim 13 , further comprising an interconnect layer provided on the semiconductor layer and on the first separation film, the interconnect layer contacting the semiconductor layer and extending in the first direction.
15. The device according to claim 13 , wherein the first insulating layer contains at least one of aluminum, hafnium, tantalum, zirconium, and lanthanum.
16. The device according to claim 13 , wherein
the semiconductor layer is a silicon layer,
the n-type impurity is phosphorus, and the p-type impurity is boron, and
a concentration of the n-type impurity is not more than 1×10 18 (atom/cm 3 ).
17. The device according to claim 13 , further comprising a substrate and a third insulating layer provided between the substrate and the control electrode,
wherein the charge storage layer contains a metal oxide, and
the control electrode includes a first metal nitride layer, a second metal nitride layer, and a metal layer provided between the first metal nitride layer and the second metal nitride layer.