IP Library Granted Patent US 9,959,937
Granted Patent B2
US 9,959,937 · App. 15/062,018 · Granted May 1, 2018

Memory system including test circuit

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Quick Facts
Patent No.
US 9,959,937
App. No.
15/062,018
Granted
May 1, 2018
Kind
B2
Abstract

A memory system includes a semiconductor memory device, a controller configured to access the semiconductor module, a plurality of pins for connection to the outside of the memory system, the pins configured to receive and output serial data, and a test circuit. When one of the pins receives serial test data, the test circuit converts the serial test data into parallel test data, and outputs the parallel test data to the semiconductor memory device for writing therein, and when the test circuit receives parallel test data written in the semiconductor memory device, the test circuit converts the parallel test data to serial test data, and outputs the serial test data through one of the pins for test of the memory system.

Claims (73)

1. A memory system, comprising:

a semiconductor memory device;

a controller configured to control the semiconductor memory device;

a plurality of first pins for connection to the outside of the memory system, the plurality of first pins conforming to a first interface protocol;

a plurality of second pins conforming to a second interface protocol, a number of the first pins being smaller than a number of second pins; and

a test circuit, wherein

when one of the first pins receives a serial signal including serial test data and control data, and the control data indicates to assert a first control signal on one of the second pins,

the test circuit converts the serial test data into parallel test data, and outputs the parallel test data to the semiconductor memory device for writing therein.

2. The memory system according to claim 1 , wherein

the memory system is configured to operate in a plurality of operational modes, including a normal mode and a test mode, and

the controller processes serial data received through one of the first pins when the memory system operates in the normal mode, and the controller allows the test circuit, instead of the controller, to process the serial data, when the memory system operates in the test mode.

3. The memory system according to claim 2 , wherein

when the serial data received through one of the first pins are in a first data sequence format and include a first predetermined value, the operational mode is switched to the test mode.

4. The memory system according to claim 3 , wherein

when the serial data received through one of the first pins are in a second data sequence format and include a second predetermined value, the operational mode is switched to the normal mode.

5. The memory system according to claim 1 , wherein

the first pin that receives the serial test data for writing in the semiconductor memory device is the same as the first pin through which the serial test data for test are output.

6. The memory system according to claim 1 , wherein

the first control signal is a write enable signal,

when the first control signal is asserted, the test circuit outputs the parallel test data to the semiconductor memory device for writing therein, and

when the first control signal is deasserted, the test circuit outputs the serial test data for test through said one of the first pins.

7. The memory system according to claim 6 , wherein

another one of the first pins is configured to receive a second control signal, and

when the first control signal is asserted, the test circuit outputs the second control signal to the semiconductor memory device as a write enable signal, and

when the first control signal is deasserted, the test circuit outputs the second control signal to the semiconductor memory device as a read enable signal.

8. The memory system according to claim 1 , wherein

the first interference protocol is a Serial Peripheral Interface (SPI) protocol, and

the second interference protocol is a NAND interface protocol.

9. The memory system according to claim 1 , wherein

the one of the first pins which receives the serial test data further receives command information and address information,

the test circuit outputs a command latch enable signal and an address latch enable signal to the semiconductor memory device,

the command information indicates a logical state of the command latch enable signal when the parallel test data are output to the semiconductor memory device, and

the address information indicates a logical state of the address latch enable signal when the parallel test data are output to the semiconductor memory device.

10. A method for testing a memory system including a semiconductor memory device, the method comprising:

transmitting serial test data and control data through one of a plurality of first pins of the memory system, the plurality of first pins conforming to the a first interface protocol;

converting, in the memory system, the serial test data to parallel test data;

when the control data indicates to assert a control signal on one of a plurality of second pins conforming to a second interface protocol, a number of the first pins being smaller than a number of second pins, writing the parallel test data in the semiconductor memory device;

reading the parallel test data written in the semiconductor memory device;

converting the read parallel test data to serial test data;

receiving, from the memory system, the serial test data that has been converted from the read parallel test data; and

comparing the transmitted serial test data and the received serial test data.

11. The method according to claim 10 , wherein

the memory system is configured to operate in a plurality of operational modes, including a normal mode and a test mode, and

the method is carried out during the test mode.

12. The method according to claim 11 , further comprising:

switching the operational mode to the test mode, by transmitting through said one of the first pins to the memory system the serial test data that is in a first data sequence format and includes a first predetermined value.

13. The method according to claim 12 , further comprising:

switching the operational mode to the normal mode, by transmitting through said one of the first pins to the memory system serial data that is in a second data sequence format and includes a second predetermined value.

14. The method according to claim 10 , wherein

the first pin through which the serial test data are transmitted to the memory system is the same as the first pin through which the serial test data are received from the memory system.

15. The method according to claim 10 , wherein

the first interface protocol is a Serial Peripheral Interface (SPI) protocol, and

the second interference protocol is a NAND interface protocol.

16. The method according to claim 10 , further comprising:

transmitting command information and address information through said one of the first pins through which the serial test data are transmitted; and

outputting a command latch enable signal and an address latch enable signal to the semiconductor memory device, wherein

the command information indicates a logical state of the command latch enable signal when the parallel test data are output to the semiconductor memory device, and

the address information indicates a logical state of the address latch enable signal when the parallel test data are output to the semiconductor memory device.

17. A memory system, comprising:

a semiconductor memory device;

a plurality of first pins for connection to the outside of the memory system, the first pins conforming to a first interface protocol and configured to receive and output serial data;

a plurality of second pins conforming to a second interface protocol, a number of the first pins being smaller than a number of second pins;

a first serial/parallel conversion circuit configured to convert first serial data in a first data sequence format, which are received through one of the first pins, to first parallel data for writing in the semiconductor memory device, when the memory system operates in a first mode; and

a second serial/parallel conversion circuit configured to convert second serial data in a second data sequence format, which are received through one of the first pins, to second parallel data for writing in the semiconductor memory device, when the memory system operates in a second mode.

18. The memory system according to claim 17 , wherein

the first serial/parallel conversion circuit is further configured to convert first parallel data read from the semiconductor memory device to serial data in the first data sequence format for output to the outside of the memory system through one of the first pins, and

the second serial/parallel conversion circuit is further configured to convert second parallel data read form the semiconductor memory device to serial data in the second data sequence format for output to the outside of the memory system through one of the first pins.

19. The memory system according to claim 17 , wherein

the first serial data in the first data sequence format are test data for testing the memory system, and

the second serial data in the second data sequence format are stored in the memory system.

20. The memory system according to claim 17 , wherein

a command to change an operational mode of the memory system to the second mode is received through said one of the first pins, as serial data in the first data sequence format, and

a command to change the operational mode to the first mode is received through said one of the first pins, as serial data in the second data sequence format.

Assignments (5)
MERGER Recorded Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: K.K. PANGEA
Reel/Frame 055659/0471 →
CHANGE OF NAME AND ADDRESS Recorded Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 055669/0001 →
CHANGE OF NAME AND ADDRESS Recorded Jan 22, 2021
From: K.K. PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 055669/0401 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 14, 2017
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 043194/0647 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 8, 2016
From: KADA, KENICHIROU; TAKEDA, SHINYA; KITAZUME, TOSHIHIKO; TAKASUGI, MIKIO; TSUJI, NOBUHIRO; KODERA, SHUNSUKE; IWATA, TETSUYA; FURUYAMA, YOSHIO; NARAI, HIROSUKE
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 038842/0232 →