IP Library Granted Patent US 9,643,291
Granted Patent B2
US 9,643,291 · App. 15/066,896 · Granted May 9, 2017

Polishing method

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Quick Facts
Patent No.
US 9,643,291
App. No.
15/066,896
Granted
May 9, 2017
Kind
B2
Abstract

A polishing method comprising: arranging a polishing tool and a workpiece on lower and upper shaft sides of a polishing device, respectively, the polishing tool including: a polishing surface having a spherical zone shape; and a hole that is provided inside the polishing surface and concentric with an outer edge of the polishing surface around a rotation axis on a projection plane orthogonal to the rotation axis, a ratio of an outer diameter of the polishing surface to an inner diameter of the polishing surface being greater than 1.0 and 6.0 or less; and swinging the polishing tool relative to a reference point while rotating the polishing tool around the rotation axis. The reference point is positioned where a straight line, which passes through a center of the workpiece and intersects with the rotation axis, passes through a center of a spherical zone of the polishing surface in width direction.

Claims (4)

1. A method for polishing a workpiece executed by a polishing device having a polishing tool, the method comprising the steps of:

arranging the polishing tool on a lower shaft side of the polishing device, the polishing tool including: a polishing surface having a predetermined radius of curvature; and a hole that is provided inside the polishing surface and is concentric with an outer edge of the polishing surface around a rotation axis on a projection plane orthogonal to the rotation axis, wherein the polishing surface has a spherical zone shape, and a ratio of an outer diameter of the polishing surface to an inner diameter of the polishing surface is greater than 1.0 and equal to or less than 6.0, and a ratio of a spherical zone width of the polishing surface to an outer diameter of the workpiece is equal to or greater than 0.9;

arranging only the workpiece on an upper shaft side of the polishing device; and

swinging the polishing tool at a constant swing width with respect to a reference point while rotating the polishing tool around the rotation axis to polish the workpiece, wherein the reference point is provided at a position where a straight line, which passes through a center of the workpiece and intersects with the rotation axis, passes through a center of a spherical zone of the polishing surface in a width direction.

Assignments (3)
CHANGE OF ADDRESS Recorded Jun 15, 2017
From: OLYMPUS CORPORATION
To: OLYMPUS CORPORATION
Reel/Frame 042821/0621 →
CHANGE OF ADDRESS Recorded Mar 29, 2017
From: OLYMPUS CORPORATION
To: OLYMPUS CORPORATION
Reel/Frame 042110/0885 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 10, 2016
From: HAGIWARA, GENICHIRO
To: OLYMPUS CORPORATION
Reel/Frame 037950/0050 →